A cooling structure for a heat source, where the cooling structure includes a beam having a first end and a second end and a length disposed therebetween. The beam is formed at least in part of a first material having a first thermal coefficient of expansion and a second material having a second thermal coefficient of expansion, where the first thermal coefficient of expansion is different from the second thermal coefficient of expansion. The first end of the beam is thermally connected to the heat source, such that heat generated by the heat source is conducted along the length of the beam to the second end of the beam. The heat conducted through the beam causes the beam to deflect as the first and second materials expand differently due to the difference in the first and second thermal coefficients of expansion.

This invention relates to apparatus and systems for providing home and building security and condition monitoring. More particularly, the invention relates to a plurality of devices, including intelligent, multi-sensing, network-connected devices, that communicate dynamically with each other and a remote server.

The present disclosure relates to fluidic systems and devices for processing, extracting, or purifying one or more analytes. These systems and devices can be used for processing samples and extracting nucleic acids, for example by isotachophoresis. In particular, the systems and related methods can allow for extraction of nucleic acids, including non-crosslinked nucleic acids, from samples such as tissue or cells. The systems and devices can also be used for multiplex parallel sample processing.

An environmental sensor including sensor elements to measure multiple physical quantities associated with a surrounding environment, and includes a state determination unit that determines whether the environmental sensor is in a first state in which the sensor is fixed at a predetermined installation location or in a second state in which the sensor is away from an installation location, and an operation switch unit that switches an operation of each sensor element that measures the physical quantities based on whether a state determined by the determination unit is the first state or the second state.

The present invention relates to an electronic system comprising an electronic system comprising an electromechanical microsystem and a hermetic box encapsulating said microsystem. The box includes a fastening plane. The electromechanical microsystem includes a sensitive part and at least two beams connecting the sensitive part to the fastening plane.

The beams are thermally coupled to the sensitive part and are electrically coupled to one another. The system further includes a thermal regulator of the electromechanical microsystem including an electrical circuit including at least two ends connected to the beams, and a circuit controller able to generate an electrical current in the electrical circuit to modify the temperature of the sensitive part.

A device with a first MEMS device and a second MEMS device is disclosed. The first MEMS device is configured to sense at least one external influence. The second MEMS device is responsive to the at least one external influence. The first MEMS device is configured to change a state when the at least one external influence exceeds a threshold value. The first MEMS device is configured to retain the state below the threshold value, wherein the change in state of the first MEMS device is done passively and wherein the state of the first MEMS device is indicative of a status of the second MEMS device.

A MEMS apparatus with dynamic displacement control includes a MEMS parallel plate capacitor integrated with one or more memristors in a series configuration wherein a displacement is observable as a function of memristance, such that an upper electrode position is capable of being interpreted in a form of a resistance rather than a capacitance. The current is limited by said MEMS parallel plate capacitor restricting a change in the resistance of the memristor(s). The memristor(s) can be employed in some embodiments a sensor element to improve a MEMS operation range.

A heating apparatus for a MEMS sensor, comprising a metallic supply lead element for electric current; a metallic return lead element for electric current; and a defined number of metallic heating elements configured between the supply lead element and the return lead element, a substantially constant electrical current density being configurable in the supply lead element, in the return lead element, and in the heating elements.

According to various embodiments, a MEMS device includes a substrate, an electrically movable heating element having a first node coupled to a first terminal of a first voltage source and the second node coupled to a reference voltage source, a first anchor anchoring the first node and a second anchor anchoring the second node of the electrically movable heating element to the substrate, and a cavity between the first anchor and the second anchor and between the electrically movable heating element and the substrate.

This invention relates to apparatus and systems for providing home and building security and condition monitoring. More particularly, the invention relates to a plurality of devices, including intelligent, multi-sensing, network-connected devices, that communicate dynamically with each other and a remote server.