A signal processing method and device of a MEMS microphone and a MEMS microphone are disclosed. The method comprises: acquiring a first electrical signal obtained by converting a received optical signal by an optical sensor disposed near a sound hole of the MEMS microphone; acquiring a second electrical signal output by the MEMS microphone; and judging that the second electrical signal is an interference signal when within a substantially overlapping time range, the first electrical signal acquired reaches a preset first threshold value and the second electrical signal acquired meets a preset condition.

The present disclosure relates generally to digital microphone and other sensor assemblies including a transduction element and a successive-approximation (SA) quantizer configured to reuse a digital code generated for a prior sample period for a current sample period when a reuse condition is satisfied. The SA quantizer does not regenerate a new digital code for the current sample period when the digital code generated for the prior sample period is used thereby reducing power consumption.

In an embodiment, a semiconductor package includes a support and a stack of two or more semiconductor dies, the stack including an upper die and further including a lower die attached to the support by adhesive on a backside of the lower die, wherein the adhesive covers only part of the backside of the lower die, and wherein the adhesive has a plurality of non-contiguous regions on the backside of the lower die.

A semiconductor device includes an active region and a trapping region positioned peripherally with respect to the active region, the trapping region presenting trapping apertures permitting the passage of particles, the trapping apertures being in fluid communication with at least one trapping chamber for trapping the particles. A method for manufacturing the semiconductor devices from one semiconductor wafer presents semiconductor device regions to be singulated along a dicing portion line. The method includes in each semiconductor device region, making a semiconductor device precursor by making or applying at least one active element in an active region, making at least one trapping chamber and making, in a trapping region of the semiconductor device region positioned more peripherally than the active region, trapping apertures in fluid communication with the at least one trapping chamber; and singulating the semiconductor device regions by separating the semiconductor device precursors along the dicing portion lines.

PMUT acoustic transducer formed in a body of semiconductor material having a face and accommodating a plurality of first buried cavities, having an annular shape, arranged concentrically with each other and extending at a distance from the face of the body. The first buried cavities delimit from below a plurality of first membranes formed by the body so that each first membrane extends between a respective first buried cavity of the plurality of first buried cavities and the face of the body. A plurality of piezoelectric elements extend on the face of the body, each piezoelectric element extending above a respective first membrane of the plurality of first membranes. The first membranes have different widths, variable between a minimum value and a maximum value.

A method of making a piezoelectric sensor includes forming piezoelectric layer(s) to define a beam extending between a proximal portion and a distal end. The method also includes modeling a strain distribution on the beam based on a force applied to the beam, and defining an outer boundary with a shape substantially corresponding to a contour line of the strain distribution on the beam. The method also includes forming an electrode having said outer boundary shape, and attaching the electrode to the beam. The method also includes attaching the beam to a substrate in cantilever form so that the proximal portion of the beam is anchored to the substrate and the distal end of the beam is unsupported.

In an embodiment A package includes a casing having an opening and enclosing a cavity, a die accommodated in the cavity and a membrane attached to the casing, the membrane being air-permeable, covering and sealing the opening, wherein the membrane is configured to allow only a lateral gas flow, and wherein a blocking member is configured to block a vertical gas flow through the membrane into the cavity, the blocking member tightly covering a surface of the membrane at least in an area comprising the opening.

A membrane structure comprises a substrate having a main surface and a rear surface. A plurality of pillars are arranged on the main surface of the substrate and have a support area facing away from the main surface of the substrate. A thin-film structure is arranged above the main surface of the substrate and the pillars, wherein the thin-film structure comprises a plurality of raised portions that are spaced further from the substrate than at least one lower portion of the thin film structure. The raised portions each comprise at least one protruding portion, the protruding portions being hollow and having a bottom part and a sidewall and the protruding portions extending towards the substrate. The bottom part of each protruding portion is mechanically connected to the support area of one of the pillars, respectively. A back-volume is formed by the volume between the main surface of the substrate and the thin-film structure.

Electronic acoustic devices and methods of operating the same include a microphone having a frequency response including a resonance frequency, a reference microphone having a frequency response including a resonance frequency, the microphone and the reference microphone configured to substantially simultaneously receive a common acoustic signal to produce a transduced signal of the microphone and a transduced signal of the reference microphone, the resonance frequency of the reference microphone being different than the resonance frequency of the microphone, and an equalization module configured to equalize the frequency response of the microphone based on the transduced signal of the microphone and the transduced signal of the reference microphone.

An electronic device including a substrate, a sensor, a partition wall structure, a pressurizing component, and a stopping structure is provided. The substrate has a carrying surface. The sensor is disposed on the carrying surface. The partition wall structure is disposed on the carrying surface and surrounds the sensor. The pressurizing component is disposed on the partition wall structure. The pressurizing component, the partition wall structure, and the substrate jointly form a cavity, and the pressurizing component includes a mass and a vibration membrane. The stopping structure is disposed between the pressurizing component and the partition wall structure and extends into the cavity. The stopping structure has at least one opening penetrating the stopping structure.