A microphone device may include: a substrate wafer, a support member bonded to a front surface of the substrate wafer, a single-crystal piezoelectric film provided over the support member, a top electrode and a bottom electrode. The single-crystal piezoelectric film may have a first surface and an opposing second surface. The top electrode may be arranged adjacent to the first surface of the single-crystal piezoelectric film. The bottom electrode may be arranged adjacent to the second surface of the single-crystal piezoelectric film. The substrate wafer may have a through-hole formed therein. The through-hole of the substrate wafer may be at least substantially aligned with at least one of the top electrode and the bottom electrode.

Disclosed are a MEMS chip and an electronic device. The chip can include a substrate having a back cavity, as well as a back electrode and an induction membrane both disposed on the substrate, wherein the back electrode and the induction membrane are located on the back cavity and constitute a capacitor structure, the induction membrane comprises an active area opposite to the back cavity, an inactive area disposed outside the active area, and an isolation area located between the active area and the inactive area, and the isolation area comprises two insulation loops connected to the active area and the inactive area respectively, and a buffer area connected between the two insulation loops, both of the insulation loops being disposed around the active area.

A contact sensor for monitoring breathing of a subject, comprising: a microphone housing defining a first acoustic cavity, a MEMS microphone disposed within the first acoustic cavity; a second acoustic cavity separated from the first acoustic cavity by a cavity wall having a front surface and a rear surface, the second acoustic cavity at least partially defined by the front surface of the cavity wall; an acoustic conduit formed between the first acoustic cavity and the second acoustic cavity through the cavity wall; and a pressure relief vent having a first end terminating at the second acoustic cavity and a second end terminating outside of the second acoustic cavity.

A capacitive transducer or microphone includes a first substrate of one or more layers and which includes a first surface, a first cavity in the first surface, and a mesa diaphragm that spans the first cavity. The capacitive transducer or microphone includes a second substrate fixed to the first substrate. The second substrate has one or more layers which includes a second cavity having a nonplanar (e.g., contoured or structured or stepped) bottom surface that faces the mesa diaphragm. A shape or relief of the bottom surface of the cavity may advantageously be, to at least some degree, complementary to a deformed shape of the diaphragm. The second substrate may include one or more acoustic holes, non-uniformly distributed thereacross. One or more vents may vent the second cavity.

Proposed is a MEMS device comprising a layer stack having at least one second layer formed between a first layer and a third layer. At least one first cavity is formed in the second layer. The MEMS device further comprises a laterally deflectable member having an end connected to a sidewall of the first cavity and a free end. Further, the MEMS device includes a passive element rigidly tethered to the free end of the laterally deflectable element to follow movement of the laterally deflectable element. The laterally deflectable element and the passive element divide the first cavity into a first sub-cavity and a second sub-cavity. The first sub-cavity is in contact with an ambient fluid of the MEMS device via at least a first opening. Further, the second subcavity is in contact with the ambient fluid of the MEMS device via at least a second opening. The at least one first opening is formed in a different layer of the first layer and the third layer than the at least one second opening.

The invention relates to an amplifier unit for a MEMS sound transducer, which is operable as a microphone and as a loudspeaker, comprising at least one audio amplifier for sound reproduction and/or sound recording. According to the invention, the amplifier unit is designed in such a way that the MEMS sound transducer provided therefor is simultaneously operable as a loudspeaker and as a microphone. Moreover, the invention relates to sound-generating unit comprising a MEMS sound transducer, which is operable as a microphone and as a loudspeaker, and an amplifier unit coupled to the sound transducer for sound reproduction and/or sound recording.

An integrated structure of a MEMS microphone and an air pressure sensor, and a fabrication method for the integrated structure, the structure including a base substrate; a vibrating membrane, back electrode, upper electrode, and lower electrode formed on the base substrate, as well as a sacrificial layer formed between the vibrating membrane and the back electrode and between the upper electrode and the lower electrode; a first integrated circuit electrically connected to the vibrating membrane and the back electrode respectively; and a second integrated circuit electrically connected to the lower electrode and the upper electrode respectively, wherein a region of the base substrate corresponding to the vibrating membrane is provided with a back cavity; the sacrificial layer between the vibrating membrane and the back electrode is hollowed out to from a vibrating space that communicates with the exterior of the integrated structure, and the sacrificial layer between the upper electrode and the lower electrode is hollowed out to form a closed space; and the integrated circuits are formed on a chip, thereby reducing the interference of connection lines on the performance of a microphone, reducing the introduction of noise, reducing the size of a product and reducing power consumption.

A force feedback actuator includes a pair of electrodes and a dielectric member. The pair of electrodes are spaced apart from one another to form a gap. The dielectric member is disposed at least partially within the gap. The dielectric member includes a first portion having a first permittivity and a second portion having a second permittivity that is different from the first permittivity. The dielectric member and the pair of electrodes are configured for movement relative to each other.

A MEM vibration sensor includes a substrate including a first supporting-portion and a cavity and a sensing-device disposed on the substrate. The sensing-device includes a second supporting-portion correspondingly disposed over and connected with the first supporting-portion, a first sensing-unit disposed on the cavity, a first mass-block disposed on the cavity, a second sensing-unit disposed on the first sensing-unit and the first mass-block, a first metal pad disposed on the third supporting-portion and electrically coupled with the first sensing-unit, and a second metal pad disposed on the third supporting-portion and electrically coupled with the second sensing-unit.

A semiconductor device may include a first substrate, a first electrical component, a lid, a second substrate, and a second electrical component. The first substrate may include an upper surface, a lower surface, and an upper cavity in the upper surface. The first electrical component may reside in the upper cavity of the first substrate. The lid may cover the upper cavity and may include a port that permits fluid to flow between an environment external to the semiconductor device and the upper cavity. The second substrate may include the second electrical component mounted to an upper surface of the second substrate. The lower surface of the first substrate and the upper surface of the second substrate may fluidically seal the second electrical component from the upper cavity.