An electronic utility gas meter using MEMS thermal time-of-flight flow sensor to meter gas custody transfer mass flowrate and an additional MEMS gas sensor to measure the combustion gas composition for the correlations to the acquisition of gas high heat value simultaneously is disclosed in the present invention. The meter is designed for the applications in the city utility gas consumption in compliance with the current tariff while metering the true thermal value of the delivered gases for future upgrades. Data safety, remote data communication, and other features with state-of-the-art electronics are also included in the design.

Aspects of the subject disclosure include a pressure-sensing device consisting of a housing including a membrane and one or more piezoresistive elements disposed on the membrane to sense a displacement due to a deflection of the membrane. A first set of electrodes is disposed over the membrane, and a second set of electrodes is disposed on a permeable port of the device at a distance from the membrane. The first and second sets of electrodes form an electrostatic actuator to exert a repulsive force onto the membrane to reduce the deflection of the membrane.

Methods for fabricating crack resistant Microelectromechanical (MEMS) devices are provided, as are MEMS devices produced pursuant to such methods. In one embodiment, the method includes forming a sacrificial body over a substrate, producing a multi-layer membrane structure on the substrate, and removing at least a portion of the sacrificial body to form an inner cavity within the multi-layer membrane structure. The multi-layer membrane structure is produced by first forming a base membrane layer over and around the sacrificial body such that the base membrane layer has a non-planar upper surface. A predetermined thickness of the base membrane layer is then removed to impart the base membrane layer with a planar upper surface. A cap membrane layer is formed over the planar upper surface of the base membrane layer. The cap membrane layer is composed of a material having a substantially parallel grain orientation.

A microphone device comprises a microphone die including a first microphone motor and a second microphone motor, an acoustic integrated circuit structured to process signals produced by the first microphone motor and the second microphone motor, and a sensor die stacked on top of the acoustic integrated circuit, wherein the sensor die comprises a pressure sensor. Another microphone comprises a microphone die including a first microphone motor and a second microphone motor and an integrated circuit die. The integrated circuit die comprises an acoustic integrated circuit structured to process signals produced by the first microphone motor and the second microphone motor, a pressure sensor, and a pressure integrated circuit structured to press signals produced by the pressure sensor.

A pressure sensor outputting an electrical signal upon a fluid pressure in a target space includes a diaphragm having a pressure receiving surface disposed in the target space for receiving a fluid pressure, and a back surface on a back side of the pressure receiving surface, an inner member disposed to face the back surface and a diaphragm supporting portion connected to the diaphragm. The diaphragm includes a center portion disposed to face the inner member and is distorted as a concave shape toward the detecting direction because of the heat transmitted to the pressure receiving surface and the distortion of the center portion as a concave shape toward the detecting direction. A contacting portion provided on a connecting portion between the center portion and the outside portion is in contact with the inner member.

A microstructure and a method for manufacturing the same includes: disposing a liquid film on a surface of a substrate, wherein a solid-liquid interface is formed where the liquid film is in contact with the substrate; and irradiating the substrate with a laser of a predetermined waveband to etch the substrate at the solid-liquid interface, wherein the position where the laser is irradiated on the solid-liquid interface moves at least along a direction parallel to the surface of the substrate, and the absorption rate of the liquid film for the laser is greater than the absorption rate of the substrate for the laser.

A method of making a system-in-package device, and a system-in-package device is disclosed. In the method, at least one first species die with predetermined dimensions, at least one second species die with predetermined dimensions, and at least one further component of the system-in-device is included in the system-in package device. At least one of the first and second species dies is selected for redimensioning, and material is added to at least one side of the selected die such that the added material and the selected die form a redimensioned die structure. A connecting layer is formed on the redimensioned die structure. The redimensioned die structure is dimensioned to allow mounting of the non-selected die and the at least one further component into contact with the redimensioned die structure via the connecting layer.

A glass wafer is provided that includes a sheetlike glass substrate with an opening. The sheetlike glass substrate is configured for use in a sensor selected from a group consisting of a pressure sensor, a piezoresistive sensor, a capacitive pressure sensor, and a piezoresistive pressure sensor. The opening is defined in the glass substrate from a first surface to a second, opposite surface. The opening has a cross-sectional area that is delimited by a straight portion having a minimum length of at least 10 μm and a side face with a surface characterized by a skewness (Ssk) of at most 5.0.

Integrated microelectromechanical systems (MEMS) acoustic sensor devices are disclosed. Integrated MEMS acoustic sensor devices can comprise a MEMS acoustic sensor element and a pressure sensor within the back cavity associated with the MEMS acoustic sensor element. Integrated MEMS acoustic sensor devices can comprise a port adapted to receive acoustic waves or pressure. Methods of fabrication are also disclosed.

A microelectromechanical system (MEMS) device includes a first movable element and a second movable element, wherein the second movable element is connected with a movable membrane for sensing pressure to make the second movable element move with the movable membrane to sense the pressure variation of the external environment, and other portion of the substrate forming the movable membrane can form a cap to protect the first movable element for sensing other physical quantity.

Accordingly, the pressure sensor and the MEMS structure for sensing other physical quantity can be integrated in the foregoing MEMS device by a single process.