A handheld electronic product includes a case and a temperature sensing device. The case has a first opening. The temperature sensing device is disposed inside the case of the handheld electronic product. The temperature sensing device includes a first substrate, a sensor chip, and a metal shielding structure. The sensor chip is disposed on the first substrate. The metal shielding structure surrounds the sensor chip, and has a second opening. The sensor chip faces towards the first opening and the second opening.

A microelectromechanical sensing device includes a substrate, a plurality of support structures and a sensing structure. The sensing structure is supported by the plurality of support structures and is disposed above the substrate. The sensing structure includes a first dielectric layer, an electrode layer, a sensing layer and a second dielectric layer. The first dielectric layer has a dielectric top surface coplanar with the support top surface of each of the support structures. The electrode layer is disposed on the first dielectric layer and directly contacts the plurality of support structures. The sensing layer is disposed on the first dielectric layer and a projection of the sensing layer toward the substrate does not overlap the plurality of support structures. The second dielectric layer is disposed on the electrode layer and the sensing layer, wherein the first dielectric layer and the second dielectric layer are made of the same material.

A method for fabricating packaged semiconductor devices (100) with an open cavity (110a) in panel format; placing (process 201) on an adhesive carrier tape a panel-sized grid of metallic pieces having a flat pad (230) and symmetrically placed vertical pillars (231); attaching (process 202) semiconductor chips (101) with sensor systems face-down onto the tape; laminating (process 203) and thinning (process 204) low CTE insulating material (234) to fill gaps between chips and grid; turning over (process 205) assembly to remove tape; plasma-cleaning assembly front side, sputtering and patterning (process 206) uniform metal layer across assembly and optionally plating (process 209) metal layer to form rerouting traces and extended contact pads for assembly; laminating (process 212) insulating stiffener across panel; opening (process 213) cavities in stiffener to access the sensor system; and singulating (process 214) packaged devices by cutting metallic pieces.

A memory device may include a memory array including a plurality of memory cells and a die stack including at least a portion of the plurality of memory cells. The memory device may also include multiple temperature sensors each designed to output a temperature code corresponding to the temperature of a respective die of the die stack. One die of the die stack is then designed to output the temperature code corresponding to the hottest die of the die stack.

A MEMS infrared sensing device includes a substrate and an infrared sensing component. The infrared sensing component is provided above the substrate. The infrared sensing component includes a sensing plate and at least one supporting element. The sensing plate includes at least one infrared absorbing layer, an infrared sensing layer, a sensing electrode and a plurality of metallic elements. The sensing plate has a plurality of openings. The metallic elements respectively surround the openings. The sensing electrode is connected with the infrared sensing layer, and the metallic elements are spaced apart from one another. The supporting element connecting the sensing plate with the substrate.

The present disclosure relates to systems, methods, devices for cantilever based pressuring monitoring, and the like. The systems and devices of the present disclosure can be used in caustic or harsh environments. Continuous pressure monitoring using the described devices can enable real-time adjustments for precise process control, contributing to improved efficiency and product quality.

A MEMS temperature sensor including a clamped-clamped microbeam having a drive electrode on one side configured for applying an AC current, and a sense electrode diagonally situated on the other side, a first anchor at one end and a second anchor at the other end of the microbeam. The first anchor receive a DC bias currents, which heats the microbeam to an operating temperature. The sense electrode is configured to capacitively sense oscillations in the microbeam due to an applied AC current. The MEMS temperature sensor has a three wafer construction in which the components are formed. The device is encapsulated by aluminum, and metal wires connect the first and second anchor, the drive electrode and the sense electrode to side electrode pads outside of the encapsulation. The MEMS temperature sensor has a linear operating region of 30-60 degrees Celsius.

The present disclosure relates to fluidic systems and devices for processing, extracting, or purifying one or more analytes. These systems and devices can be used for processing samples and extracting nucleic acids, for example by isotachophoresis. In particular, the systems and related methods can allow for extraction of nucleic acids, including non-crosslinked nucleic acids, from samples such as tissue or cells. The systems and devices can also be used for multiplex parallel sample processing.

A semiconductor package that contains an application-specific integrated circuit (ASIC) die and a micro-electromechanical system (MEMS) die. The MEMS die and the ASIC die are coupled to a substrate that includes an opening that extends through the substrate and is in fluid communication with an air cavity positioned between and separating the MEMS die from the substrate. The opening exposes the air cavity to an external environment and, following this, the air cavity exposes a MEMS element of the MEMS die to the external environment. The air cavity separating the MEMS die from the substrate is formed with a method of manufacturing that utilizes a thermally decomposable die attach material.

In the field of micro-electromechanical systems (MEMS) for autofocus camera systems, a MEMS device comprises a fixed part, a movable platform with an image sensor, and temperature sensors on both the platform and fixed part. A processor calculates the temperature difference to determine the platform's displacement. This method eliminates the need for additional capacitive or piezoelectric components, reducing complexity and cost. The described technology is particularly useful in consumer electronics, such as smartphone and automotive cameras, where precise focus control may be vital.