A MEMS device includes a semiconductor support body having a first cavity, a membrane including a peripheral portion, fixed to the support body, and a suspended portion. A first deformable structure is at a distance from a central part of the suspended portion of the membrane and a second deformable structure is laterally offset relative to the first deformable structure towards the peripheral portion of the membrane. A projecting region is fixed under the membrane. The second deformable structure is deformable so as to translate the central part of the suspended portion of the membrane along a first direction, and the first deformable structure is deformable so as to translate the central part of the suspended portion of the membrane along a second direction.

A fixed frame (2) is fixed to an external member. An ultrasonic oscillator (3) is disposed inside the fixed frame (2) and includes a flexible first substrate and a first piezoelectric element deposited on the first substrate in the form of a thin film. The ultrasonic oscillator (3) is warped in response to expansion or contraction of the first piezoelectric element and generates ultrasonic waves. Actuator units (4) include a flexible second substrate coupling the first substrate to the fixed frame (2) and a second piezoelectric element deposited on the second substrate in the form of a thin film. The actuator units (4) are warped in response to expansion or contraction of the second piezoelectric element and cause the ultrasonic oscillator (3) to swing relative to the fixed frame (2). The fixed frame (2), the first substrate, and the second substrate are composed of the same substrate.

A micro fluid actuator includes an orifice layer, a flow channel layer, a substrate, a chamber layer, a vibration layer, a lower electrode layer, a piezoelectric actuation layer and an upper electrode layer, which are stacked sequentially. An outflow aperture, a plurality of first inflow apertures and a second inflow aperture are formed in the substrate by an etching process. A storage chamber is formed in the chamber layer by the etching process. An outflow opening and an inflow opening are formed in the orifice layer by the etching process. An outflow channel, an inflow channel and a plurality of columnar structures are formed in the flow channel layer by a lithography process. By providing driving power which have different phases to the upper electrode layer and the lower electrode layer, the vibration layer is driven to displace in a reciprocating manner, so as to achieve fluid transportation.

A MEMS device includes a semiconductor support body having a first cavity, a membrane including a peripheral portion, fixed to the support body, and a suspended portion. A first deformable structure is at a distance from a central part of the suspended portion of the membrane and a second deformable structure is laterally offset relative to the first deformable structure towards the peripheral portion of the membrane. A projecting region is fixed under the membrane. The second deformable structure is deformable so as to translate the central part of the suspended portion of the membrane along a first direction, and the first deformable structure is deformable so as to translate the central part of the suspended portion of the membrane along a second direction.

A method for large scale integration of haptic devices is described. The method comprises forming a first elastomer layer of a large scale integration (LSI) device on a substrate according to a specified manufacturing process, the first elastomer layer having a plurality of fluid based circuits, the first elastomer layer adhering to a plurality of formation specifications. The method further comprises curing the first elastomer layer. Additionally, one or more additional elastomer layers of the LSI device are formed with the first elastomer layer according to the specified manufacturing process, the one or more additional elastomer layers having a plurality of fluid based circuits, the one or more additional elastomer layers adhering to the plurality of formation specifications.

A micro-electro-mechanical (MEMS) device is formed in a first wafer overlying and bonded to a second wafer. The first wafer includes a fixed part, a movable part, and elastic elements that elastically couple the movable part and the fixed part. The movable part further carries actuation elements configured to control a relative movement, such as a rotation, of the movable part with respect to the fixed part. The second wafer is bonded to the first wafer through projections extending from the first wafer. The projections may, for example, be formed by selectively removing part of a semiconductor layer. A composite wafer formed by the first and second wafers is cut to form many MEMS devices.

Described is a micro-haptic actuator device that can be fabricated with roll-to-roll MEMS processing techniques. The device includes a first body having a first surface and a second, opposing surface, the body has a chamber defined by at least one interior wall, a piston member disposed in the chamber, physically spaced from the at least one interior wall of the chamber, the piston member having a first surface and a second opposing surface. A membrane layer is disposed over and attached to the first surface of the body, with a portion of the membrane attached to the first surface of the piston member. The device also includes a first electrode supported on a second surface the membrane, and a second body that supports a second electrode, with the second body attached to the second surface of the first body.

In accordance with an embodiment, a microelectromechanical transducer includes a displaceable membrane having an undulated section comprising at least one undulation trough and at least one undulation peak and a plurality of piezoelectric unit cells. At least one piezoelectric unit cell is provided in each case in at least one undulation trough and at least one undulation peak, where each piezoelectric unit cell has a piezoelectric layer and at least one electrode in electrical contact with the piezoelectric layer. The membrane may be formed as a planar component having a substantially larger extent in a first and a second spatial direction, which are orthogonal to one another, than in a third spatial direction, which is orthogonal to the first and the second spatial direction and defines an axial direction of the membrane.

A MEMS element includes a substrate 200, a fixing portion 2 provided at the substrate 200, first and second actuators 3, 4 provided at the fixing portion, a drive target member 7 coupled to the first and second actuators 3, 4, a third actuator 9 provided at the fixing portion 2, and a restriction member 10 coupled to the third actuator. The first and second actuators 3, 4 drive the drive target member 7 in a direction parallel to or crossing an upper surface of the substrate 200. The third actuator 9 drives the restriction member 10 in a direction crossing a movement direction of the drive target member 7 to position the restriction member 10 within a movement plane of the drive target member 7 such that the restriction member 10 restricts displacement of the drive target member 7.

A micro-electro-mechanical (MEMS) actuator device includes a frame, and a first functional sub-structure positioned within the frame and mechanically coupled thereto by supporting elements. The first functional sub-structure is subdivided into first and second portions. The first portion is subdivided into first and second sub-portions separated from one another by a first through trench, and the second portion is subdivided into first and second sub-portions separated from one another by a second through trench. First and second piezo-electric structures are respectively carried by the first and second sub-portions of the first portion. Third and fourth piezo-electric structures are respectively carried by the first and second sub-portions of the second portion. A third through trench extends between the frame and the first functional sub-structure except for regions in which the supporting elements are present.