A micromechanical device with electrostatically caused deflection by a plate capacitor extending along and spaced apart from the neutral fiber of the deflectable element is improved with regard to its manufacturing complexity and/or with regard to its operating characteristics, such as, for example, maximum voltage applicable or deflectability, by using a continuous insulation layer between the distal and proximal electrodes of the plate capacitor, or else the proximal electrode is structured so as to have gaps at the segment boundaries where the distal electrode is mechanically fixed so as to be laterally spaced apart from the distal electrode. Both procedures avoid the problems of generating a roughness of the surface of the proximal electrode facing the distal electrode, as would otherwise be necessitated by etching an insulation layer for providing spacers between the distal and proximal electrodes at the segment boundaries.

An optical scanning device is provided. The optical scanning device includes a mirror having an optical reflection surface, a movable frame supporting the mirror, a pair of drive beams supporting the movable frame from both sides, a drive source, disposed on the drive beams, that causes the movable frame to be swung around a predetermined axis, a fixed frame supporting the drive beams. Each of the drive source includes a lower electrode formed on the drive beams, a piezoelectric thin film formed on the lower electrode, an upper electrode formed on the piezoelectric thin film, and a stress counter film, formed on the upper electrode or formed between the piezoelectric thin film and the upper electrode, that generates a compressive stress on the drive beams.

An optical device includes a support portion, a first movable portion having an optical surface, a second movable portion having a frame shape and surrounding the first movable portion, a first coupling portion coupling the first movable portion and the second movable portion to each other, a second coupling portion coupling the second movable portion and the support portion to each other, and a softening member which has a softening characteristic and to which stress is applied when the first movable portion swings around a first axis. When viewed in a direction perpendicular to the optical surface, the softening member is provided to a portion of the second movable portion, the portion extending between a drive element and the first coupling portion, and is not electrically connected to an outside.

A MEMS device is provided that includes a semiconductor substrate including a main surface extending perpendicular to a first direction and a side surface extending on a plane parallel to the first direction and to a second direction that is perpendicular to the first direction. At least one cantilevered member protrudes from the side surface of the semiconductor substrate along a third direction that is perpendicular to the first and second directions. The at least one cantilevered member includes a body portion that includes a piezoelectric material. The body portion has a length along the third direction, a height along the first direction and a width along the second direction, and the height is greater than the width. The at least one cantilevered member is configured to vibrate by lateral bending along a direction perpendicular to the first direction.

Disclosed herein is a microelectromechanical device that features a fixed structure defining a cavity, a tiltable structure elastically suspended within the cavity, and a piezoelectrically driven actuation structure that rotates the tiltable structure about a first rotation axis. The actuation structure includes driving arms with piezoelectric material, elastically coupled to the tiltable structure by decoupling elastic elements that are stiff to out-of-plane movements but compliant to torsional movements. The tiltable structure is elastically coupled to the fixed structure at the first rotation axis using elastic suspension elements, while the fixed structure forms a frame surrounding the cavity with supporting elements. A lever mechanism is coupled between a supporting element and a driving arm.

A MEMS transducer for interacting with a volume flow of a fluid includes a substrate including a cavity, and an electromechanical transducer connected to the substrate in the cavity and including an element deformable along a lateral movement direction, wherein a deformation of the deformable element along the lateral movement direction and the volume flow of the fluid are causally related.

A repulsive-attractive-force electrostatic actuator according to some embodiments of the invention includes a first actuator layer including a first substrate, a first electrode pattern, and a second electrode pattern. The actuator further includes a second actuator layer including a second substrate, a third electrode pattern, and a fourth electrode pattern. The actuator further includes a first voltage source connected to the first and second electrode patterns such that the first electrode pattern is at a relative voltage of V1 to the second electrode pattern, and a second voltage source connected to the third and fourth electrode patterns such that the third electrode pattern is at a relative voltage of V2 to the fourth electrode pattern. The applied relative voltages V1 and V2 are selectable to provide one of a selected repulsive force or a selected attractive force between the first and second actuator layers.

Disclosed herein are microelectronic assemblies with integrated perovskite layers, and related devices and methods. For example, in some embodiments, a microelectronic assembly may include an organic package substrate portion having a surface with a conductive layer, and a perovskite conductive layer on the conductive layer. In some embodiments, a microelectronic assembly may include an organic package substrate portion having a surface with a conductive layer, a perovskite conductive layer having a first crystalline structure on the conductive layer, and a perovskite dielectric layer having a second crystalline structure on the perovskite conductive layer. In some embodiments, the first and second crystalline structures have a same orientation.

A cooling structure for a heat source, where the cooling structure includes a beam having a first end and a second end and a length disposed therebetween. The beam is formed at least in part of a first material having a first thermal coefficient of expansion and a second material having a second thermal coefficient of expansion, where the first thermal coefficient of expansion is different from the second thermal coefficient of expansion. The first end of the beam is thermally connected to the heat source, such that heat generated by the heat source is conducted along the length of the beam to the second end of the beam. The heat conducted through the beam causes the beam to deflect as the first and second materials expand differently due to the difference in the first and second thermal coefficients of expansion.

A transducer assembly includes: a microelectromechanical systems (MEMS) die including a plurality of piezoelectric elements; a complementary metal-oxide-semiconductor (CMOS) die electrically coupled to the MEMS die by a first plurality of bumps and including at least one circuit for controlling the plurality of piezoelectric elements; and a package secured to the CMOS die by an adhesive layer and electrically connected to the CMOS die.