Methods of manufacturing a biocompatible, hermetic feedthrough monolithically integrated with a biocompatible ribbon cable are described, as well as the resulting devices themselves. The hermetic feedthrough is created by placing glass over a mold of doped silicon or other material with a higher melting temperature than the glass and heating it to reflow the glass into the mold. The glass is then ground or otherwise removed to reveal a flat surface, and tiny pillars that were in the mold are isolated in the glass to form electrically conductive vias. The flat surface is used to cast a polymer and build up a ribbon cable, photolithographically or otherwise, that is monolithically attached to the vias.

A method of hermetically bonding components of an implantable pump made of biocompatible materials comprises the steps of providing a first SiO.sub.2 layer of predetermined first thickness onto a selected bonding surface of a first biocompatible component of the implantable pump to reduce the surface roughness, Ra, available for bonding below a first predetermined magnitude; providing a second SiO.sub.2 layer of predetermined second thickness onto a selected bonding surface of a second biocompatible component of the implantable pump to reduce the surface roughness of the selected bonding surface; and bringing the first and second SiO.sub.2 layers into contact with each other at a low temperature with a low pressure to form a high quality hermetic bond and seal between first and second SiO.sub.2 layers. The invention includes an implantable pump having a hermetic seal manufactured by the method.

A portable gas detecting device includes at least one detecting chamber, at least one gas sensor and at least one actuator. The gas sensor is disposed in the detecting chamber and configured for monitoring gas inside the detecting chamber. The actuator is disposed in the detecting chamber and includes a piezoelectric actuator. When an actuating signal is applied to the piezoelectric actuator and the piezoelectric actuator generates a resonance effect, the gas outside the detecting chamber is introduced into the detecting chamber for sampling. The actuator is driven by an instantaneous sampling pulse to control a trace of gas to flow into the detecting chamber for forming a stable airflow environment. In the stable airflow environment, a gas molecule is dissolved in or bonded to a reaction material on a surface of the gas sensor for reacting.

The invention relates to a combined pump-sensor arrangement having a substrate having a first main surface and an opposite second main surface. A package lid which defines a package having a measuring cavity is arranged on the first main surface of the substrate. Additionally, the pump-sensor arrangement has a micropump having a pump inlet and a pump outlet, the micropump being configured to suck in an analyte fluid present in the measuring cavity through the pump inlet and eject the same to an environment outside the measuring cavity via the pump outlet. Furthermore, the pump-sensor arrangement has a sensor for detecting at least one component of the analyte fluid present within the measuring cavity and movable by means of the micropump. In accordance with the invention, both the sensor and the micropump are commonly arranged on the first main surface of the substrate and within the measuring cavity.

A package includes a support structure having an electrically insulating material, a microelectromechanical system (MEMS) component, a cover structure having an electrically insulating material and mounted on the support structure for at least partially covering the MEMS component, and an electronic component embedded in one of the support structure and the cover structure. At least one of the support structure and the cover structure has or provides an electrically conductive contact structure.

A MEMS pump module includes a MEMS chip, at least one signal electrode, a plurality of MEMS pumps and a plurality of switch units. The MEMS chip comprises a chip body. The signal electrode is disposed on the chip body. Each of the MEMS pumps comprises a first electrode and a second electrode. The second electrode is electrically connected to the signal electrode. The switch units are electrically connected to the first electrodes of the MEMS pumps. A modulation voltage is received by the at least one signal electrode and then is transmitted to the second electrodes of the MEMS pumps. The on-off actions of MEMS pumps are controlled by the plurality of switch units.

A MEMS pump module includes a microprocessor and a MEMS chip. The microprocessor outputs a constant voltage and a variable voltage. The MEMS chip includes a chip body, a plurality of MEMS pumps and at least one common electrode. The plurality of MEMS pumps are disposed on the chip body, and each MEMS pump includes a first electrode and a second electrode. The at least one common electrode is disposed on the chip body and electrically connected to the second electrodes of the plurality of MEMS pumps. The microprocessor is electrically connected to the first electrodes of the plurality of MEMS pumps and the at least one common electrode so as to transmit the constant voltage to the at least one common electrode and transmit the variable voltage to the first electrodes of the plurality of MEMS pumps.

A micro fluid actuator includes an orifice layer, a flow channel layer, a substrate, a chamber layer, a vibration layer, a lower electrode layer, a piezoelectric actuation layer and an upper electrode layer, which are stacked sequentially. An outflow aperture, a plurality of first inflow apertures and a second inflow aperture are formed in the substrate by an etching process. A storage chamber is formed in the chamber layer by the etching process. An outflow opening and an inflow opening are formed in the orifice layer by the etching process. An outflow channel, an inflow channel and a plurality of columnar structures are formed in the flow channel layer by a lithography process. By providing driving power which have different phases to the upper electrode layer and the lower electrode layer, the vibration layer is driven to displace in a reciprocating manner, so as to achieve fluid transportation.

A process for manufacturing a diaphragm unit of a MEMS transducer that includes multiple piezoelectric transducer units, each of the multiple piezoelectric transducer units including at least one electrode layer and at least one piezoelectric layer formed on a carrier includes the step of removing the transducer units from the carrier. At least one of the transducer units that has been removed from the carrier is arranged on a diaphragm and connected to the diaphragm. Moreover, a diaphragm unit made according to the process includes a diaphragm and multiple piezoelectric transducer units arranged on and connected to the diaphragm. Each of the multiple piezoelectric transducer units includes at least one electrode layer and at least one piezoelectric layer formed on a carrier.

One example provides a microelectromechanical systems (MEMS) device that includes a number of silicon die over-molded with an overmold material, a number of active areas formed on the silicon die, the active areas including at least one sensor to sense a number of attributes of a fluid introduced to the at least one sensor, and a fan-out layer coupled to the silicon die, the fan-out layer including a number of fluid channels formed therein that interface with active areas of the silicon die and allow the fluid to flow to the at least one sensor.