Patent classifications
B81B2201/037
CONVERTING ROTATIONAL MOTION TO LINEAR MOTION
System and methods are disclosed herein for converting rotational motion to linear motion. A system comprising a rotational drive can be connected to a proof mass by a first structure comprising a coupling spring. An anchor can be connected to the proof mass by a second structure comprising a drive spring. The coupling spring and the drive spring can be configured to cause the proof mass to move substantially along a first axis when the rotational drive rotates about a second axis.
Device and Method for Adapting Measuring Range and Sensitivity of Micromechanical Sensors
A measuring system based on micromechanical elements, including an energy converter which is configured to convert a physical signal into a displacement of the energy converter, a force generator which is configured to convert the displacement from the energy converter into a force on a movably mounted slider, and an electrostatic actuator which is mechanically connected to the slider and/or an electrostatic anti-spring which is mechanically connected to the slider, and an electromechanical signal converter which converts a displacement of the slider into an electrical signal, the electrostatic actuator being configured to convert the displacement from the energy converter into a force on a movably mounted slider, which is mechanically connected to the slider, and an electromechanical signal converter which converts a displacement of the slider into an electrical signal, wherein the electrostatic actuator is configured to set an offset compensation of the measuring system via a control voltage and/or the electrostatic anti-spring is configured to set a sensitivity of the measuring system via a control voltage.
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
The present disclosure describes a semiconductor package with a photonic device on a micro-electro-mechanical systems (MEMS) structure. The semiconductor package includes a substrate, a MEMS structure disposed on the substrate, and a photonic device disposed on the MEMS structure. The MEMS structure includes a comb structure bonded to the substrate and a frame structure coupled to the comb structure. The photonic device is bonded to the frame structure.