A microelectromechanical system (MEMS) sensor package includes a laminate that provides physical support and electrical connection to a MEMS sensor. A resin layer is embedded within an opening of the laminate and a MEMS support layer is embedded within the opening by the resin layer. A MEMS structure of the MEMS sensor is located on the upper surface of the MEMS support layer.

An addressable display system configured for use in a mounting adapter configured to mount a personal electronic device (PED) on an aircraft includes a transparent surface configured to overlay the display surface of a PED when the PED is mounted in the mounting adapter wherein the transparent surface includes a region that is uniformly coated with a coating layer that when activated with a select excitation wavelength is configured to emit visible light to annunciate a message indicating a problem with an image displayed on a PED display; a lighting source configured to provide light in at an excitation wavelength; a MEMS (microelectromechanical systems) scanner module that is controllable to write desired symbology for annunciation at different addressable locations on the transparent surface; and an imaging device configured to capture an image of the PED display for an integrity check of data displayed on the PED display.

A transmitting device, preferably containing at least two laser diodes and a scanning mirror, which is deflectable about its center (MP) and is arranged in a housing with a transparent cover element. The cover element is formed, at least in a coupling-out region, by a section of a monocentric hemispherical shell (HK) with a center of curvature (K) and is arranged to cover the scanning mirror in such a way that the center of curvature (K) of the hemispherical shell (HK) and the center (MP) of the scanning mirror coincide, and is formed in a coupling-in region by an optical block, comprising a toroidal entrance surface, in the special form of a cylindrical surface, at least one toroidal exit surface and at least two first mirror surfaces arranged between them, for deflecting and pre-collimating the laser beams.

An electromechanical microsystem including two electromechanical transducers, a first deformable diaphragm and a cavity hermetically containing a deformable medium keeping a constant volume under the action of a change in the external pressure. The first diaphragm forms at least one portion of a first wall of the cavity and has a freely deformable area. The free area cooperates with an external member so that its deformation induces, or is induced by, a movement of the external member. The electromechanical transducers are configured so that a first electromechanical transducer forms a portion of the first wall of the cavity, and a second electromechanical transducer forms at least one portion of the wall opposite to the first wall of the cavity.

A projector including a light source, a first prism, a second prism and a digital micro-mirror device (DMD) is provided. The light source emits light. The first prism includes a first surface, a second surface and a third surface which are connected to each other around the perimeter thereof, and the illumination light enters the first prism through the first surface. The second prism has a fourth surface and a fifth surface which are connected to each other, and the fourth surface faces the second surface of the first prism. The DMD faces the third surface. The illumination light sequentially passes through the first surface, is reflected by the second surface, passes through the third surface, and reaches the DMD. The DMD converts the illumination light into image light, and the image light sequentially passes through the third surface, the second surface, the fourth surface and the fifth surface. In the first prism, a first included angle between the first surface and the third surface is more than or equal to 105 degrees.

Described examples include a micromechanical device having a substrate. The micromechanical device includes a MEMS element and a via between the MEMS element and the substrate, the via having a conductive layer extending from the substrate to the MEMS element and having a structural integrity layer on the conductive layer.

A mirror device includes a frame body, a shaft member provided inside the frame body and connected to the frame body at both end portions, and a reflection member fixed to the shaft member and provided so as to be capable of swinging around an axis of the shaft member. The reflection member has a base portion provided along an axial direction of the shaft member and a reflection portion provided on the base portion. The base portion has a three-dimensional uneven structure including a bottom wall portion having a main surface provided along the axial direction of the shaft member and a plurality of side wall portions extending from the bottom wall portion on the side opposite to the reflection portion.

The present disclosure provides a method for preparing a MEMS micro mirror with electrodes on both sides. The method includes: providing a first base, forming an electrode lead groove in the first base; forming an insulating groove, a plurality of lower comb plates and a moving space groove in a first device layer to obtain a bonded structure layer; providing a second base bonded with the bonded structure layer to obtain a bonded piece; forming a frame, upper comb plates, movable micro light reflector, and elastic beams in a second device layer, with the movable micro light reflector located inside the frame, and the elastic beam connected with the frame and/or the movable micro light reflector; forming a metal reflecting layer, a first upper comb plate electrode, a first lower comb plate electrode, a second upper comb plate electrode and a second lower comb plate electrode.

An example includes: a system board having a surface; bond fingers on a surface of the system board; a semiconductor device on the surface of the system board, the semiconductor device comprising a semiconductor die having a surface, the semiconductor die comprising bond pads on the surface; conductors coupling the bond pads to the bond fingers; and a datum structure on the surface of the system board, the datum structure having openings that form wells with sides around the bond fingers.

In described examples, a bondline structure is arranged along a periphery of a cavity. The bondline structure extends from a first substrate and is configured to bond with an interposer arranged on a second substrate. A diffusion barrier is arranged on the first substrate for contacting the interposer. The diffusion barrier is arranged to impede a contaminant against migrating from the bondline structure and entering the cavity.