B81B2201/042

SYSTEMS AND APPARATUS FOR MICROMIRROR DESIGNS WITH ELECTRODE CONTACT
20230070502 · 2023-03-09 ·

Systems and Apparatus for micromirror designs with electrode contact. In some examples, a micromirror including a mirror, a mirror via coupled to the mirror, a hinge coupled to the mirror via, the hinge including a springtip associated with a first side of the micromirror, the springtip associated with a first terminal, and an electrode associated with the first side of the micromirror, the electrode having a dielectric coating in contact with the springtip, the electrode associated with a second terminal different than the first terminal.

METHODS AND APPARATUS FOR ELECTRONIC DEVICE PACKAGING
20230126914 · 2023-04-27 ·

An example method of producing a microelectromechanical system (MEMS) package, the method comprising: applying first epoxy layers to a first substrate, at least one of the first epoxy layers coupled to a second substrate; applying a first post gel heat treatment to the first epoxy layers; after applying the first post gel heat treatment to the first epoxy layers, applying second epoxy layers to the second substrate and to the first epoxy layers; and applying a second post gel heat treatment to the first epoxy layers and the second epoxy layers.

Mirror device
11474345 · 2022-10-18 · ·

A mirror device includes a support portion, a movable portion, and a pair of torsion bars disposed on both sides of the movable portion on a first axis. The movable portion includes a frame-shaped frame connected to the pair of torsion bars and a mirror unit disposed inside the frame. The mirror unit is connected to the frame in each of a pair of connection regions located on both sides of the mirror unit in a direction parallel to a second axis. A region other than the pair of connection regions in a region between the mirror unit and the frame is a space. An outer edge of the mirror unit and an inner edge of the frame are connected to each other so that a curvature in each of the pair of connection regions is continuous when viewed from a direction perpendicular to the first and the second axes.

MULTI-LEVEL MICROELECTROMECHANICAL SYSTEM STRUCTURE WITH NON-PHOTODEFINABLE ORGANIC POLYMER SPACER LAYERS

In an example, a method includes depositing an organic polymer layer on one or more material layers. The method also includes thermally curing the organic polymer layer. The method includes depositing a hard mask on the organic polymer layer and depositing a photoresist layer on the hard mask. The method also includes patterning the photoresist layer to expose at least a portion of the hard mask. The method includes etching the exposed portion of the hard mask to expose at least a portion of the organic polymer layer. The method also includes etching the exposed portion of the organic polymer layer to expose at least a portion of the one or more material layers.

Optical device

An optical device includes an elastic support portion which includes a torsion bar extending in a second direction perpendicular to a first direction and a nonlinearity relaxation spring connected between the torsion bar and a movable portion. The nonlinearity relaxation spring is configured so that a deformation amount of the nonlinearity relaxation spring around the second direction is smaller than a deformation amount of the torsion bar around the second direction and a deformation amount of the nonlinearity relaxation spring in a third direction perpendicular to the first direction and the second direction is larger than a deformation amount of the torsion bar in the third direction while the movable portion moves in the first direction. A first comb finger of a first comb electrode and a second comb finger of a second comb electrode which are adjacent to each other face each other in the second direction.

Actuator, optical scanning device, and manufacturing methods
11635615 · 2023-04-25 · ·

An actuator includes a first driving beam that is connected to an object to be driven and includes multiple first beams extending in a direction orthogonal to a first predetermined axis, ends of each adjacent pair of the first beams being connected to each other via one of first turnaround parts such that the first driving beam forms a zig-zag bellows structure as a whole; first driving sources formed on first surfaces of the first beams; and ribs formed on second surfaces of the first beams at positions that are closer to the first predetermined axis than the first turnaround parts. The first driving sources are configured to move the first driving beam and thereby rotate the object around the first predetermined axis.

MEMS device

MEMS devices include fluid confinement structures on either a fixed part of a substrate and/or on a suspended element. The fluid confinement structures may be configured to confine a viscoelastic fluid in a limited part of a gap between one or more vertical sidewalls of both the fixed part of the substrate and either the suspended element or the drive beam or both the suspended element and drive beam such that one part of the gap is bridged by the fluid and another part of the gap is not, The structures may be configured to prevent flow of the fluid to other parts of the gap.

PROTECTIVE BONDLINE CONTROL STRUCTURE

In described examples, apparatus includes a first substrate that delimits a surface of a cavity and a bondline structure arranged along a periphery of the cavity, where the bondline structure extends from the first substrate, and the bondline structure configured to bond with an interposer arranged on a second substrate. The apparatus also includes a diffusion barrier on the first substrate, the diffusion barrier configured to contact the interposer and impede a contaminant against migrating from the bondline structure and entering the cavity.

METHOD FOR PRODUCING AT LEAST ONE FIRST AND ONE SECOND MICROMIRROR DEVICE
20230066345 · 2023-03-02 ·

A method for producing a first and second micromirror device. A silicon oxide layer is applied to at least the front side of a silicon wafer. The silicon oxide layer is removed so that a first and second separation region of the silicon oxide layer are generated, which are arranged spatially separated from each other along a separation plane. A silicon layer is applied to the front side of the silicon wafer and to the silicon oxide layer. An etching mask is applied to the rear side of the silicon wafer, the etching mask having a first opening along the separation plane of the first and second separation region. The silicon layer and the silicon wafer are removed, according to the etching mask on the rear side of the silicon wafer and according to the silicon oxide layer of the first and second separation region.

MOVABLE APPARATUS
20220326512 · 2022-10-13 ·

A movable apparatus includes a movable unit including a mirror configured to reflect light, a support portion including a first end and a second end, the first end being connected to the movable unit, the support portion configured to swingably support the movable unit, and a fixed unit connected to the second end of the support portion. The support portion includes a plurality of beam units and a connection unit connecting adjacent beam units of the plurality of beam units, wherein where the support portion is divided into two parts at a predetermined or given position, the two parts including a first part closer to the fixed unit and a second part closer to the movable unit. A beam unit of the plurality of beam units in the first part has a higher rigidity than a beam unit of the plurality of beam units in the second part.