The MEMS device has a suspended mass supported via a pair of articulation arms by a supporting region. An electrostatic driving system, coupled to the articulation arms, has mobile electrodes and fixed electrodes that are coupled to each other. The electrostatic driving system is formed by two pairs of actuation assemblies, arranged on opposite sides of a respective articulation arm and connected to the articulation arm through connection elements. Each actuation assembly extends laterally to the suspended mass and has an auxiliary arm carrying a respective plurality of mobile electrodes. Each auxiliary arm is parallel to the articulation arms. The connection elements may be rigid or formed by linkages.

A micro optical switch device, an image display apparatus including the same, and a method of manufacturing the micro optical switch device are provided. The micro optical switch device includes a substrate; a first electrode disposed on the substrate and having a plurality of openings; a second electrode disposed above and spaced apart from the first electrode, and having a plurality of openings; and support units disposed on the substrate and configured to support the second electrode, wherein the support units include deformation preventing portions protruding beyond a top surface of the second electrode.

Various particular embodiments include a primary waveguide including an end section; cantilevered waveguides, each cantilevered waveguide including an end section disposed adjacent the end section of the primary waveguide; and control pins for applying an electrical bias to the cantilevered waveguides to selectively displace the end sections of the cantilevered waveguides away from the end section of the primary waveguide.

A method for manufacturing a mirror device, the method includes a first step of preparing a wafer having a support layer, a device layer, and an intermediate layer; a second step of forming a slit in the wafer such that the movable portion becomes movable with respect to the base portion by removing a part of each of the support layer, the device layer, and the intermediate layer from the wafer and forming a plurality of parts each corresponding to the structure in the wafer, after the first step; a third step of performing wet cleaning using a cleaning liquid after the second step; and a fourth step of cutting out each of the plurality of parts from the wafer after the third step. In the second step, a part of the intermediate layer is removed from the wafer by anisotropic etching.

An actuator device includes a support portion, a movable portion, a connection portion, a first wiring provided to the connection portion, a second wiring provided to the movable portion, a first insulation layer which includes a first opening exposing a surface opposite to the movable portion in a first connection part located at the movable portion in one wiring of the first and second wirings, a second insulation layer covering the first and second wirings. The other wiring of the first and second wirings is connected to the surface of the first connection part in the first opening. A region corresponding to a corner of the other wiring of the first and second wirings in a surface opposite to the movable portion in the second insulation layer is curved in a convex shape toward an opposite side to the movable portion.

In some implementations, a phase-shifting optical device includes a micro-electromechanical system (MEMS) device, comprising: a substrate; an electrode layer disposed on the substrate; a mirror layer disposed on the electrode layer, wherein the mirror layer is configured to cause a phase shift of an optical beam; a set of stator teeth formed from at least a first portion of the mirror layer and at least a portion of the electrode layer, and a set of rotor teeth formed from at least a second portion of the mirror layer and disposed on a hinge and engaged with the set of stator teeth.

Robust and reliable microelectromechanical photoswitch devices are provided. The devices are better able to withstand mechanical shock and rough handling during transportation or field operation due to the use of a mechanical stop structure that limits displacement of movable parts of the devices and prevents their contacts from becoming locked. The technology also greatly extends the dynamic range of the sensors, enabling them to detect weak electromagnetic radiation signals as well as much stronger signals without damage when exposed to signals that are orders of magnitude larger than threshold.

An actuator device includes a support portion, a movable portion, a connection portion, a first wiring which is provided to the connection portion, and a second wiring which is provided to the support portion. The first wiring includes a metal material and the second wiring includes a metal material. One wiring of the first wiring and the second wiring includes a first connection part located at the support portion. An other wiring of the first wiring and the second wiring is connected to a surface of the first connection part. An extending length of the first wiring from an end of the connection portion on a side of the support portion to the first connection part along an extending direction of the first wiring is larger than a minimum width of the connection portion.

A cantilever that includes a first dielectric layer with a first intrinsic stress, a second dielectric layer overlaying the first dielectric layer, in which the second dielectric layer has a second intrinsic stress that is different than the first intrinsic stress, the cantilever including a first piezoelectric segment disposed between the first dielectric layer and the second dielectric layer at a first position with respect to a first dimension parallel to the first dielectric layer, the cantilever including a second piezoelectric segment disposed between the first dielectric layer and the second dielectric layer at a second position with respect to the first dimension, and the cantilever including one or more waveguides patterned in the second dielectric layer.

An electrostatic MEMS micromirror is provided, and may be used in a device such as a mobile phone, a microphone, a camera, a radar, or an optical switch. The electrostatic MEMS micromirror includes a support beam, a micromirror, and a drive component. The drive component includes a comb frame and a drive comb located in the comb frame. The support beam and the micromirror are mechanically coupled using the comb frame. Two sides of the comb frame that are mechanically coupled to the micromirror are separately located on two sides of a rotating axis determined by the support beam. The drive comb includes at least one comb pair. The comb pair includes a movable comb structure and a stationary comb structure. The movable comb structure includes a plurality of movable combs. One end of the movable comb is fastened to the comb frame.