A MEMS device includes a semiconductor support body having a first cavity, a membrane including a peripheral portion, fixed to the support body, and a suspended portion. A first deformable structure is at a distance from a central part of the suspended portion of the membrane and a second deformable structure is laterally offset relative to the first deformable structure towards the peripheral portion of the membrane. A projecting region is fixed under the membrane. The second deformable structure is deformable so as to translate the central part of the suspended portion of the membrane along a first direction, and the first deformable structure is deformable so as to translate the central part of the suspended portion of the membrane along a second direction.

Provided is a method including at least the thermal treatment step of thermally treating a SOI substrate having a first silicon layer at a first temperature that the diffusion flow rate of an interstitial silicon atom in a silicon single crystal is higher than the diffusion flow rate of an interstitial oxygen atom and the processing step of processing the SOI substrate after the thermal treatment step to obtain a displacement enlarging mechanism.

A die-wrapped packaged device includes at least one flexible substrate having a top side and a bottom side that has lead terminals, where the top side has outer positioned die bonding features coupled by traces to through-vias that couple through a thickness of the flexible substrate to the lead terminals. At least one die includes a substrate having a back side and a topside semiconductor surface including circuitry thereon having nodes coupled to bond pads. One of the sides of the die is mounted on the top side of the flexible circuit, and the flexible substrate has a sufficient length relative to the die so that the flexible substrate wraps to extend over at least two sidewalls of the die onto the top side of the flexible substrate so that the die bonding features contact the bond pads.

A hermetic capsule including a semiconductor/metal base with sensitive semiconductor/polymer electrical and optical components formed thereon and a semiconductor/metal lid. The semiconductor/metal lid sealed to the semiconductor/metal base by metallization so as to form a chamber including all of the sensitive semiconductor/polymer electrical and optical components and hermetically sealing the chamber and all sensitive components from the ambient. External access to the sensitive semiconductor/polymer electrical and optical components is provided through a metallization.

A device for sensing a motion of a deflectable surface includes a deflectable element having a first side beam deflectable and includes a reflective surface at a second side of the deflectable element, proposing the first side. The device includes an optical emitter for emitting an optical signal towards the reflective surface and an optical receiver for receiving a reflected optical signal from the reflective surface and for providing a reception signal based on a reflective optical signal. The device includes a control unit in communication with the optical receiver for determining information related to the motion of the deflectable element based on the reception signal.

In a method of generating a microelectromechanical system, MEMS, device, a MEMS substrate including a movable element is provided. A glass cover member including a glass cover is formed by hot embossing. The glass cover member is bonded to the MEMS substrate so as to hermetically seal by the glass cover a cavity in which the movable element is arranged.

The present disclosure relates to a method of fabricating a reflector, the reflector being at least partially reflective and at least partially transmissive for at least a wavelength of electromagnetic radiation; the method comprising: forming a first material layer defining a bottom layer; forming a sacrificial layer on the bottom layer; forming a second material layer defining a top layer on the sacrificial layer and a supporting structure connected to the bottom layer; and removing at least part of the sacrificial layer to form a cavity between the bottom layer and the top layer such that the supporting structure supports the top layer relative to the bottom layer and no further supporting structure is provided within the cavity, wherein after the at least part of the sacrificial layer is removed, at least the top layer has residual tensile stress.

A MEMS actuator includes a monolithic body of semiconductor material, with a supporting portion of semiconductor material, orientable with respect to a first and second rotation axes, transverse to each other. A first frame of semiconductor material is coupled to the supporting portion through first deformable elements configured to control a rotation of the supporting portion about the first rotation axis. A second frame of semiconductor material is coupled to the first frame by second deformable elements, which are coupled between the first and the second frames and configured to control a rotation of the supporting portion about the second rotation axis. The first and second deformable elements carry respective piezoelectric actuation elements.

A hermetic package includes a base body, wherein dielectric material of a bottom of the base body is made of an organic material, an optical component mounted on the base body, and inorganic material hermetically enclosing the optical component along all surrounding sides.

An autofocus system is disclosed. The autofocus system includes a lens assembly, an upper actuator, and a lower actuator. The upper and the lower actuators have stationary elements and movable elements. The lens assembly is attached to the movable elements of the upper and the lower actuators. The autofocus system allows three degrees of freedoms of translational adjustments and two degrees of freedoms of rotational adjustments.