An integrated optical transducer for detecting dynamic pressure changes comprises a micro-electro-mechanical system, MEMS, die having a MEMS diaphragm with a first side exposed to the dynamic pressure changes and a second side, and an application-specific integrated circuit, ASIC, die having an optical interferometer assembly. The interferometer assembly comprises a beam splitting element for receiving a source beam from a light source and for splitting the source beam into a probe beam in a first beam path and a reference beam in a second beam path, a beam combining element for combining the probe beam with the reference beam to a superposition beam, and a detector configured to generate an electronic interference signal depending on the superposition beam. The MEMS die is arranged with respect to the ASIC die such that a gap is formed between the second side of the diaphragm and the ASIC die, with the gap defining a cavity and having a gap height. The first beam path of the probe beam comprises coupling into the cavity, reflection off of a deflection point or a deflection surface (16) of the diaphragm and coupling out of the cavity.

Various embodiments may provide a method of fabricating a meta-lens structure. The method may include forming a first dielectric layer in contact with a silicon wafer. The method may also include forming a second dielectric layer in contact with the first dielectric layer. A refractive index of the second dielectric layer may be different from a refractive index of the first dielectric layer. The method may further include, in patterning the second dielectric layer. The method may additionally include removing at least a portion of the silicon wafer to expose the first dielectric layer.

Embodiments of the disclosure provide systems and methods for incorporating an optical sensing system in a MEMS package for real-time sensing of angular position of a MEMS mirror. The system may include an optical source configured to emit an optical signal to a backside of the MEMS mirror. The system may also include an optical detector configured to receive a returning optical signal reflected by the backside of the MEMS mirror. The system may further include at least one controller. The at least one controller may be configured to determine a scanning angle of the MEMS mirror based on a position on the optical detector where the returning optical signal is received.

A Light Detection and Ranging (LiDAR) module for a vehicle can include a semiconductor integrated circuit with a microelectromechanical system (MEMS) and a substrate, the MEMS comprising a micro-mirror assembly including a mirror and a gimbal structure. The gimbal can be configured concentrically around and coplanar with the mirror. When rotated, the gimbal drives the mirror to oscillate at or near a resonant frequency and is coupled to the mirror via mirror-gimbal connectors. A support structure can be coupled to a backside of the mirror and gimbal structures and can increase the stiffness of the mirror to help the mirror better resist dynamic deformation. To limit the added rotational moment of inertia, the support structure can be etched to form a matrix of cells (e.g., formed by a mesh of circumferential and radial ridges) such that up to approximately 90% of the support structure material forming the support structure is removed.

A die-wrapped packaged device includes at least one flexible substrate having a top side and a bottom side that has lead terminals, where the top side has outer positioned die bonding features coupled by traces to through-vias that couple through a thickness of the flexible substrate to the lead terminals. At least one die includes a substrate having a back side and a topside semiconductor surface including circuitry thereon having nodes coupled to bond pads. One of the sides of the die is mounted on the top side of the flexible circuit, and the flexible substrate has a sufficient length relative to the die so that the flexible substrate wraps to extend over at least two sidewalls of the die onto the top side of the flexible substrate so that the die bonding features contact the bond pads.

Embodiments of the disclosure provide an optical sensing system, a method for adjusting a receiving aperture in the optical sensing system, and an adjustable iris in the optical sensing system. The exemplary optical sensing system includes a transmitter configured to emit light beams to an environment. The optical sensing system further includes a receiver configured to receive the light beams returning from the environment. The receiver includes an adjustable iris including a plurality of rotary blades each driven by a MEMS actuator. The plurality of rotary blades collectively form an adjustable receiving aperture for the returned light beams to pass through. The plurality of rotary blades are configured to rotate in order to vary the adjustable receiving aperture during operation of the optical sensing system. The optical sensing system also includes a detector configured to detect the light beams that pass through the adjustable iris.

The present application discloses an optical micro-electro-mechanical system (MEMS) based monitoring system, comprising: a broadband light source, a tunable optical filter (TOF), an optical etalon, a plurality of optical receivers, a plurality of optical couplers, and a plurality of optical MEM sensors; the TOF is configured to capture transmission, reflection or interference spectrum of the optical MEMS sensors; wherein the peak or depression wavelength in the transmission, reflection or interference spectrum corresponds to a parameter of the pressure, the temperature or the stress, and the peak or depression wavelength can be obtained by comparing with the periodic spectrum of the optical etalon with an absolute wavelength mark; the optical MEMS sensor comprises an optical MEMS resonator. The parameter of the pressure, the temperature or the stress can be obtained by the peak or depression wavelength in the transmission, the reflection or the interference spectrum of the optical MEMS sensor.

A display device and a display method thereof, and a display equipment are disclosed. The display device includes a display panel and a light transmittance adjusting layer, the display panel includes a plurality of pixel regions, the light transmittance adjusting layer is stacked with the display panel, and the light transmittance adjusting layer is configured to adjust display brightness of the plurality of pixel regions.

The present invention provides a method for preparing a microgroove array surface with a nearly cylindrical surface based on an air molding method, and relates to the technical field of functional surface preparation. The method includes the following steps: (1) preparing a microgroove array surface, uniformly spreading a layer of a liquid polymer film to be formed on the auxiliary plate, and placing a spacer block in an empty position on the microgroove array surface; (2) placing the auxiliary plate spread with the liquid polymer film on the spacer block on the microgroove array surface, maintaining this state, and feeding the auxiliary plate into a vacuum drying oven; and (3), setting a pressure in the vacuum drying oven according to a designed pressure, heating and solidifying the liquid polymer film, and separating the microgroove array surface to obtain the microgroove array surface with the nearly cylindrical surface.

A method for etching a curved substrate is provided, including: forming a conductive thin film layer with an etched pattern on the curved substrate; supplying power to the conductive thin film layer such that the conductive thin film layer has an equal potential at each position of the conductive thin film layer; etching each position of the curved substrate to an etching depth corresponding to the potential at each position of the conductive thin film layer based on the etched pattern of the conductive thin film layer, so as to obtain the curved substrate having a consistent etching depth at each position of the curved substrate. With the etching method, it is possible to etch an arbitrary curved surface to obtain a microstructure with a uniform processing depth.