A hermetic housing is disclosed (10a) for an optoelectronic component (11) or a MEMS device configured to form an enclosure (12) within which a low pressure or vacuum prevails. The hermetic housing includes: an optical window (14) transparent for at least one wavelength of interest (λ); and a layer of a getter material (15a) configured to capture gases present in said enclosure and deposited on the optical window opposite the enclosure. This layer of getter material has a thickness (e_t), greater than 60 nanometers, and a porosity (P) in the range from 10 to 70% to satisfy the following relation: (1−P)*e_t<λ/2πk with λ corresponding to the at least one wavelength of interest, and k corresponding to the extinction coefficient of the material of the layer of getter material for the at least one wavelength of interest of the optical window.

The present invention relates to a MEMS device and related methods comprising a mirror for the measuring of light frequency. The MEMS mirror may rotate around a pivot point and is driven by a periodic force for continuous bi-directional motion without transient vibrations. The periodic force may further comprise transient functions comprising special waveforms when at the turn-around point of the bi-directional rotation.

A die-wrapped packaged device includes at least one flexible substrate having a top side and a bottom side that has lead terminals, where the top side has outer positioned die bonding features coupled by traces to through-vias that couple through a thickness of the flexible substrate to the lead terminals. At least one die includes a substrate having a back side and a topside semiconductor surface including circuitry thereon having nodes coupled to bond pads. One of the sides of the die is mounted on the top side of the flexible circuit, and the flexible substrate has a sufficient length relative to the die so that the flexible substrate wraps to extend over at least two sidewalls of the die onto the top side of the flexible substrate so that the die bonding features contact the bond pads.

A display device and a display method thereof, and a display equipment are disclosed. The display device includes a display panel and a light transmittance adjusting layer, the display panel includes a plurality of pixel regions, the light transmittance adjusting layer is stacked with the display panel, and the light transmittance adjusting layer is configured to adjust display brightness of the plurality of pixel regions.

Described herein are systems and methods for ToF imaging of a target. The ToF imaging system includes an optical splitter that splits the light beam from a light source into multiple transmitting light beams. The transmitting light beams are directed towards a target, and one or more portions return as reflected light beams. A detector generates detector signals, representative of the reflected light beams. An electronically-controlled mirror is used to change the angular position of the transmitting light beams incident on the target, so that different regions of the target can be measured at different time instants. The ToF imaging system uses a flash and scan process to flash one region(s) of the target with the transmitting light beams during one sub-frame exposure and to scan other region(s) of the target during subsequent sub-frame exposures. An image processing apparatus constructs target information from multiple sub-frame exposure.

An apparatus includes a lens material forming a lens. The apparatus also includes a piezoelectric capacitor over the lens material, where the piezoelectric capacitor is configured to change a shape of the lens material in response to a voltage across the piezoelectric capacitor to thereby change a focus of the lens. The apparatus further includes at least one stress compensation ring over a portion of the lens material and over at least a portion of the piezoelectric capacitor. The at least one stress compensation ring is configured to at least partially reduce bending of the lens material caused by stress on or in the lens material.

A semiconductor device according to one embodiment of the present disclosure includes a substrate, a plurality of structures arranged in a matrix and each having a planar part, and a plurality of piezoelectric actuators disposed on the substrate and configured to move each of the plurality of structures along a direction perpendicular to one surface of the substrate.

There is provided a MOMS sensor comprising a fiber interface comprising a fiber passthrough for one or more optical fibers, a cavity comprising an element hermetically encapsulated within the cavity, wherein the element is movably anchored by SiN arms, which are movable with respect to walls of the cavity, wherein the SiN arms comprise anchor portions at first ends of the SiN arms, which are connected to the element, and at second ends of the SiN arms, which are connected to the walls of the cavity, and the fiber interface is configured to receive the fibers through the fiber passthrough into positions for communications of light between the element and the fibers. In this way a robust structure that supports sensitivity of the sensor is provided.

A micro-electrical-mechanical system (MEMS) actuator configured to provide multi-axis movement, the micro-electrical-mechanical system (MEMS) actuator including: a first portion, a second portion, wherein the first portion and the second portion are displaceable with respect to each other, and a locking assembly configured to releasably couple the first portion and the second portion to attenuate displacement between the first portion and the second portion.

A production method for a micromechanical device having inclined optical windows. First and second substrates are provided. A plurality of through-holes is produced in the first and second substrate such that for each through-hole in the first substrate a congruent through-hole is produced in the second substrate, which overlap when the first substrate is placed over the second substrate. A slanted edge region is produced around a respective through-hole in the first and second substrate, the edge region being inclined at a window angle, two slanted edge regions situated on top of each other being congruent in a top view and being inclined at the same window angle. A window foil is provided having a structured window region, which covers the through-hole in a top view of the window foil in each case, the window foil forming an optical window slanted at the window angle above the respective through-hole.