Examples of an epitaxial-silicon wafer with a buried oxide layer are described herein. Examples of methods to manufacture an epitaxial-silicon wafer with a buried oxide layer are also described herein. In some examples, material may be removed from an epitaxial-silicon wafer at a surface opposite an epitaxial surface layer until the epitaxial-silicon wafer is a specified thickness. The thinned epitaxial-silicon wafer may be bonded to an oxidized-silicon wafer at an oxidized surface forming a buried oxide layer.

A microfluidic device (100) for mixing a liquid L is provided. The microfluidic device (100) comprises a microfluidic chamber (20), having an inlet (30), and arranged to receive the liquid L therein. In use, the microfluidic device (100) is arranged to control translation through the liquid L of a body B introduced therein, wherein the translation of the body B is due to a potential field acting on the body. In this way, the controlled translation of the body B mixes the liquid L in the microfluidic chamber (20).

The present disclosure is drawn to inertial pumps. An inertial pump can include a microfluidic channel, a fluid actuator located in the microfluidic channel, and a check valve located in the microfluidic channel. The check valve can include a moveable valve clement, a narrowed channel segment located upstream of the moveable valve element, and a blocking element formed in the microfluidic channel downstream of the moveable valve element. The narrowed channel segment can have a width less than a width of the moveable valve element so that the moveable valve element can block fluid flow through the check valve when the moveable valve element is positioned in the narrowed channel segment. The blocking element can be configured such that the blocking element constrains the moveable valve element within the check valve while also allowing fluid flow when the moveable valve element is positioned against the blocking element.

The present disclosure relates to a microfluidic chip. The microfluidic chip includes a first substrate, and the first substrate includes a sample input hole and a reaction region located downstream of the sample input hole. The reaction region includes at least one groove, an orthographic projection of each groove on the first substrate is an axisymmetric pattern, a width of the axisymmetric pattern in a first direction is not less than a width of the axisymmetric pattern in a second direction, and the first direction is perpendicular to the second direction.

A method for producing a cavity in a substrate composed of hard brittle material is provided. A laser beam of an ultrashort pulse laser is directed a side surface of the substrate and is concentrated by a focusing optical unit to form an elongated focus in the substrate. Incident energy of the laser beam produces a filament-shaped flaw in a volume of the substrate. The filament-shaped flaw extends into the volume to a predetermined depth and does not pass through the substrate. To produce the filament-shaped flaw, the ultrashort pulse laser radiates in a pulse or a pulse packet having at least two successive laser pulses. After at least two filament-shaped flaws are introduced, the substrate is exposed to an etching medium which removes material of the substrate and widens the at least two filament-shaped flaws to form filaments. At least two filaments are connected to form a cavity.

A microchip includes: a first substrate; a second substrate partially bonded to the first substrate, the second substrate having a main surface and an outer side face; a hollow channel located between the first substrate and the second substrate, the channel extending in a direction along the main surface of the second substrate; a liquid distribution port formed to penetrate the second substrate; a first bonding section that bonds the first substrate to the second substrate to surround the channel when viewed from a direction orthogonal to the main surface; a second bonding section located at a position closer to the outer side face of the second substrate than the first bonding section, and that bonds the first substrate to the second substrate; and an internal space provided between the first substrate and the second substrate, and that communicates with a space outside the first substrate and the second substrate.

Large bioreactors based on microfluidic technology, and methods of manufacturing the same, are provided, The big microbioreactor can include a chip or substrate having the microfluidic channels thereon, and the chip can be manufactured by forming a master mold, forming a male mold from a photopolymer plate using replica molding with the Fmold, and transferring features of the male to a polymer material.

An additive manufacturing process includes forming an object material stack using sheet materials without use of binder material between the sheet materials and forming features of the cross-sectional layers of a 3D object in the corresponding sheet materials. Another process involves forming features of the cross-sectional layers of a 3D object in soot layers of a laminated soot sheet. A manufactured article includes three or more glass layers laminated together without any binder material between the glass layers. At least one of the glass layers is composed of silica or doped silica, and at least one feature is formed in at least one of the glass layers.

A microfluidic bead-packing method includes activating a first micropump to transfer active microbeads through an inlet microchannel from a bead suspension reservoir to an adsorbing channel; packing the microbeads in the adsorbing channel; and activating a second micropump to reverse flow through at least a portion of the inlet microchannel and to transfer a sample fluid through the inlet microchannel from a sample reservoir to the adsorbing channel such that the sample fluid interacts with the packed microbeads.

A micro-fluidic device is described. The micro-fluidic device includes a semiconductor substrate; at least one micro-reactor in the semiconductor substrate; one or more micro-fluidic channels in the semiconductor substrate, connected to the at least one micro-reactor; a cover layer bonded to the semiconductor substrate for sealing the one or more micro-fluidic channels; and at least one through-substrate trench surrounding the at least one micro-reactor and the one or more micro-fluidic channels.