An article is provided, the article including a substrate having a surface with a first wettability characteristic. A nano-structure array is formed on the surface of the substrate to provide a nano-structured surface having a second wettability characteristic. A thin-layer surface coating is formed on the nano-structured surface, the thin-layer surface coating being configured to tune the nano-structured surface to a target wettability characteristic.

A MEMS device includes a first substrate and a second substrate that is disposed laminated on the first substrate and has a piezoelectric element on the first substrate side, in which the first substrate and the second substrate are substantially the same size, and in planar view, an end of the first substrate and an end of the second substrate are disposed at substantially the same position.

A MEMS device includes a first substrate 22 including a single-crystal silicon substrate and a second substrate 23 including a single-crystal silicon substrate, in which the first substrate 22 and the second substrate 23 are laminated together, and the first substrate 22 and the second substrate 23 are joined to each other such that the cleavage directions of both substrates intersect each other.

A device includes a first member, a second member, and a bonding layer. A first surface of the first member and a second surface of the second member are bonded to each other via the bonding layer. The bonding layer includes a filler particle configured to be in contact with both of the first surface and the second surface, and a solidified adhesive. A distance between the first surface and the second surface is smaller than a diameter of the filler particle at at least one portion of an outer edge of the bonding layer.

A 3D printer includes an ejector device including a substrate and a plurality of ejector conduits on the substrate. Each ejector conduit includes: a first end positioned to accept a print material and a second end including an ejector nozzle. The ejector nozzle includes a first electrode and a second electrode, and a passageway for allowing the print material to flow from the first end to the second end. A current pulse generating system is in electrical connection with the first electrode and the second electrode of the plurality of ejector conduits. A magnetic field source is proximate the second end of the plurality of ejector conduits so as to generate a flux region disposed within the ejector nozzle of the plurality of ejector conduits during operation of the 3D printer.

Aspects of the present disclosure are directed to an apparatus including a circuit region and a fluidic region. In a particular example, the circuit region with logical circuits thereon, includes a thermal oxide layer on a silicon substrate, and a dielectric layer over the field oxide layer, the dielectric layer including a doped dielectric film. The microfluidic device further includes a fluidic region including fluid ports formed through a surface of the apparatus and including an un-doped dielectric film. The fluidic region includes an aperture in the dielectric layer, where the aperture is defined by a dielectric wall which forms part of the dielectric layer. A sealing film deposited over the dielectric wall may prevent the doped dielectric film from contacting fluid contained in the fluid port.

A method of forming a semiconductor structure includes providing a semiconductor substrate, forming a micro-electromechanical structure (MEMS) device in and/or on the semiconductor substrate, and providing a semiconductor chiplet comprising a circuit configured to provide input for the MEMS device and/or to process output from the MEMS device. The method further includes micro-transfer printing the semiconductor chiplet onto the semiconductor substrate, and connecting the circuit to the MEMS device.