A method for fabricating a three-dimensional integrated circuit device includes providing a first substrate having a first crystal orientation, forming at least one or more PMOS devices overlying the first substrate, and forming a first dielectric layer overlying the one or more PMOS devices. The method also includes providing a second substrate having a second crystal orientation, forming at least one or more NMOS devices overlying the second substrate, and forming a second dielectric layer overlying the one or more NMOS devices. The method further includes coupling the first dielectric layer to the second dielectric layer to form a hybrid structure including the first substrate overlying the second substrate.

A sensor is described. The sensor includes a nano-patterned semiconductor layer on a frontside of a substrate. The sensor also includes a frontside conductive layer on the nano-patterned semiconductor layer on the frontside of the substrate. The sensor further includes a backside conductive layer on a backside of the substrate, distal from the frontside conductive layer.

A method includes masking a carbon-containing single crystal for defining masked regions and unmasked regions on the single crystal. The method also includes performing a plasma etch for removing portions of the unmasked regions of the single crystal, thereby defining a pillar in each unmasked region, and performing a chemical etch on the pillars at a temperature between 1200 C. and 1600 C. for selectively reducing a width of each pillar.

A method of manufacturing a MEMS device comprising a main body and a protrusion. To provide a generic method of manufacturing a protrusion with reduced vulnerability, the method includes creating a recess in a wafer substrate, said recess having an upper recess section and a lower recess section. The upper recess section is created using anisotropic etching and the lower recess section is formed using corner lithography followed by directional etching. Finally, a filler material is introduced in the recess and at least part of the wafer substrate material is removed so as to expose the filler material introduced in the recess. Additionally, the method allows for the batch-wise production of protrusions having oblique ends.

An object of the present invention is to provide an anti-adhesive/anti-clogging and/or color marked/tinted micro-capillary tube (microtube), microneedle, or micropipette. Typically, the color/tint will be selected such that the tip of the microneedle or micropipette is in contrast (e.g., visually) to the biological material. The tint/color may be selected to contrast the stained biological material. In some aspects, the color mark comprises nanoparticles that are modified by adding a non-adhesive coating/material that minimizes protein adhesion/adsorption. The microtubes and/or micropipettes may be treated with an anti-clogging reagent and an anti-adhesive reagent to prevent or reduce clogging and adhesion of the micropipette or microneedle to biological materials. The microtubes and/or micropipettes may be formed using additive printing processes and additive manufacturing techniques or from micropipette and microneedle pullers.

Disclosed herein are novel 3D microelectrode arrays (3D MEA) that include a substrate body (e.g. chip), microneedles, traces, and a well, wherein the 3D MEA provides for transfer of electrical signals on one side of the substrate body to the other side of the substrate body. Methods for using 3D MEAs to grow electrogenic cells and obtain electrophysiological signals are disclosed as well. Fabrication techniques for producing the 3D MEAs are also disclosed.

The present invention provides a novel method for manufacturing a microstructure via the use of a viscous polymer, particularly microstructures that may be found on medical devices, such as transdermal patches, for either cosmetic or medicinal purposes.