A MEMS sensor includes a proof mass that is suspended over a substrate. A sense electrode is located on a top surface of the substrate parallel to the proof mass, and forms a capacitor with the proof mass. The sense electrodes have a plurality of slots that provide improved performance for the MEMS sensor. A measured value sensed by the MEMS sensor is determined based on the movement of the proof mass relative to the slotted sense electrode.

A micromechanical sensor element includes a substrate, a first structure movably arranged on the substrate, a second structure movably arranged on the substrate and an electrode arrangement, situated on the substrate in a fixed manner, which includes at least one first electrode. The movably arranged structures are coupled with each other by at least one coupling element in such a way that, upon a deflection of the first movably arranged structure along a first direction, the second movably arranged structure undergoes a deflection along an opposite direction. The first electrode includes a plurality of electrode surfaces. The movably arranged structures each include a plurality of movable electrode surfaces. The substrate-fixed electrode surfaces and the movable electrode surfaces engage with each other. The movable electrode surfaces are each situated on sides of the electrode surfaces of the substrate-fixed electrode arrangement facing away from the movably arranged structures.

A semiconductor device includes a sensor structure body, a gas conduit that extends from a surface of the sensor structure body toward a hollow space in the sensor structure body to introduce a gas into the hollow space from outside, a pressure sensor that is formed inside the sensor structure body and has a membrane which is able to vibrate by actions of the gas, an acceleration sensor that is formed inside the sensor structure body to detect an acceleration that has acted on the sensor structure body, and a sealing resin that covers the sensor structure body, in which the gas conduit includes an inner end portion on the hollow space side and an outer end portion on the end surface side of the sensor structure body, and the outer end portion of the gas conduit is opened on an end surface of the sealing resin.

An integrated circuit (IC) device includes: a first substrate; a dielectric layer disposed over the first substrate; and a second substrate disposed over the dielectric layer. The second substrate includes anchor regions comprising silicon extending upwards from the dielectric layer, and a series of interdigitated fingers extend from inner sidewalls of the anchor regions. The interdigitated fingers extend generally in parallel with one another in a first direction and have respective finger lengths that extend generally in the first direction. A plurality of peaks comprising silicon is disposed on the dielectric layer directly below the respective interdigitated fingers. The series of interdigitated fingers are cantilevered over the plurality of peaks. A first peak is disposed below a base of a finger and has a first height, and a second peak is disposed below a tip of the finger has a second height less than the first height.

MEMS actuator including: a substrate; a first and a second semiconductive layer; a frame including transverse regions formed by the second semiconductive layer, elongated parallel to a first direction and offset along a second direction, the frame being movable parallel to the second direction. The MEMS actuator includes, for each transverse region: corresponding front rotor regions, which are fixed to the transverse region and are suspended above the substrate; a first and a second stator region, which are formed by the first semiconductive layer in such a way that, when the frame is in rest position, the transverse region is laterally offset with respect to the first and the second stator regions and a first front rotor region partially faces the first stator region, and in such a way that, during a translation of the frame along the second direction, the first and/or a second front rotor region at least partially face the second stator region, when the transverse region begins to superimpose on the first stator region.

A semiconductor oxide plate is formed on a recessed surface in a semiconductor matrix material layer. Comb structures are formed in the semiconductor matrix material layer. The comb structures include a pair of inner comb structures spaced apart by a first semiconductor portion. A second semiconductor portion that laterally surrounds the first semiconductor portion is removed selective to the comb structures using an isotropic etch process. The first semiconductor portion is protected from an etchant of the isotropic etch process by the semiconductor oxide plate, the pair of inner comb structures, and a patterned etch mask layer that covers the comb structures. A movable structure for a MEMS device is formed, which includes a combination of the first portion of the semiconductor matrix material layer and the pair of inner comb structures.

A MEMS (micro-electromechanical system) actuator includes a substrate, a first electrode structure that is stationary with respect to the substrate, wherein the first electrode structure comprises a plurality of partial electrode structures, each of which comprises an edge structure and can be electrically controlled separately and a second electrode structure with an edge structure, wherein the second electrode structure is deflectably coupled to the substrate by means of a spring structure and electronically deflectable by means of the first electrode structure to move the edge structure of the second electrode structure into a discrete deflection position, wherein the edge structures of the first and second electrode structures are configured to be opposite to each other with respect to a top view and the opposite portions are spaced apart by a lateral distance.

This MEMS beam structure that elastically supports a movable section displaced in a first direction includes: a first beam section and a second beam section extending in a second direction orthogonal to the first direction; and a linking section that connects the tip of the first beam section and the tip of the second beam section that is connected to the movable section, wherein the first beam section and the second beam section each have a shape as a beam of uniform strength, and the beam section root of the second beam section is displaced relatively in the first direction with respect to the beam section root of the first beam section according to the displacement of the movable section in the first direction.

An integrated circuit (IC) device includes: a first substrate; a dielectric layer disposed over the first substrate; and a second substrate disposed over the dielectric layer. The second substrate includes anchor regions comprising silicon extending upwards from the dielectric layer, and a series of interdigitated fingers extend from inner sidewalls of the anchor regions. The interdigitated fingers extend generally in parallel with one another in a first direction and have respective finger lengths that extend generally in the first direction. A plurality of peaks comprising silicon is disposed on the dielectric layer directly below the respective interdigitated fingers. The series of interdigitated fingers are cantilevered over the plurality of peaks. A first peak is disposed below a base of a finger and has a first height, and a second peak is disposed below a tip of the finger and has a second height less than the first height.

Proposed is a MEMS device comprising a layer stack having at least one second layer formed between a first layer and a third layer. A cavity is formed in the second layer. The MEMS device further comprises two laterally deflectable elements arranged laterally spaced apart in the cavity. Each of the two laterally deflectable elements comprises a respective end connected to a side wall of the cavity. Additionally, the MEMS device comprises a connecting element connected to the two laterally deflectable elements to couple the movement of the two laterally deflectable elements. A plurality of first fingers are arranged discretely spaced between the two laterally deflectable elements on the side wall of the cavity. Further, a plurality of second fingers are arranged discretely spaced between the two laterally deflectable elements on the connecting element. The plurality of second fingers interdigitate with the plurality of first fingers. Further, the plurality of second fingers are laterally displaceable relative to the plurality of first fingers upon deformation of the two laterally deflectable elements such that the plurality of first fingers and the plurality of second fingers define a plurality of volume variable sub-cavities within the cavity. Each of the plurality of sub-cavities is in contact with an ambient fluid of the MEMS device via a respective opening. In case of adjacent sub-cavities of the plurality of sub-cavities, the respective opening of one sub-cavity of the adjacent sub-cavities is formed in a different layer of the first layer, the second layer and the third layer than the opening of the other sub-cavity of the adjacent sub-cavities.