Actuators (140), which are a pair of members, are disposed one on either side of a movable frame (120) in the X-axis direction, and oscillate the movable frame (120) about the X axis in relation to a fixed frame (110) by deformation caused by stretching and contracting of piezoelectric elements. Actuators (150), which are a pair of members, are disposed one on either side of a mirror (130) in the Y-axis direction, and oscillate the mirror (130) about the Y axis in relation to the movable frame (120) by deformation caused by stretching and contracting of the piezoelectric elements. The length of each actuator (140) extending in the Y-axis direction is longer than a distance between an inner side of the fixed frame (110) to which the actuator (140) is connected and the middle point of an outer side of the movable frame (120) in the Y-axis direction.

According to the present invention there is provided a MEMS device comprising, a mirror which is connected to a fixed portion by means of a first and second torsional arm, each of the first and second torsional arms are configured such that they can twist about torsional axes so as to oscillate the mirror about a first oscillation axes, and wherein the first and second torsional arms are each configured to have two or more meanders and wherein the first and second torsional arms are arranged symmetrically relative to the first oscillation axis.

A rocker device for a micromechanical Z-sensor, including two rocker arms which are mounted around a torsion spring and which are asymmetric relative to the torsion spring; the rocker arms having first perforations; at least one of the rocker arms having at least one opening, a diameter of the first perforations being configured in a defined manner to be smaller than a diameter of the opening; and a cavity for connecting the first perforations to the at least one opening being formed in at least one of the rocker arms.

A MEMs actuator device and method of forming includes arrays of actuator elements. Each actuator element has a moveable top plate and a bottom plate. The top plate includes a central membrane member and a cantilever spring for movement of the central membrane member. The bottom plate consists of two RF signal lines extending under the central membrane member. A MEMs electrostatic actuator device includes a CMOS wafer, a MEMs wafer, and a ball bond assembly. Interconnections are made from a ball bond to an associated through-silicon-via (TSV) that extends through the MEMS wafer. A RF signal path includes a ball bond electrically connected through a TSV and to a horizontal feed bar and from the first horizontal feed bar vertically into each column of the array. A metal bond ring extends between the CMOS wafer and the MEMS wafer. An RF grounding loop is completed from a ground shield overlying the array to the metal bond ring, a TSV and to a ball bond.

A substrate, a plurality of mirrors disposed on one surface of the substrate to be separated from the substrate, a mirror support post disposed between the substrate and the mirror and connected to a part of the mirror to support the mirror, a first electrode disposed between a first portion of the mirror and the substrate on the substrate, a second electrode disposed between the substrate and a second portion facing the first portion are included. The mirror includes a thin portion in which a thickness of at least a part of an end portion of a rear surface of the mirror is thinner than a thickness of a middle of the mirror.

An acceleration sensor includes a substrate, a support beam, a weight body a stationary section and an engaging section. The weight body is divided into a first weight section and a second weight section based on the support beam as a boundary line, and the first weight section and the second weight section have different weights from each other. The first weight section and the second weight section include a facing section which faces a side of the engaging section opposite to a side facing the support beam. In an X axis direction intersecting the Y axis direction, if a distance between a corner section of the engaging section in the vicinity of one end portion and the support beam is L1 and a distance between the engaging section and the facing section is L2, a relational expression, L1>L2 is satisfied.

A MEMS inertial sensor device, method of operation, and fabrication process are described wherein a MEMS inertial sensor and drive actuation units are coupled together in operational engagement, where the MEMS inertial sensor includes a substrate and a proof mass array positioned in spaced apart relationship above a surface of the substrate and constructed with a plurality of proof mass sub-structures which are each separately connected to the substrate with orthogonally disposed pairs of spring suspension structures and which are each rigidly connected to one or more adjacent proof mass sub-structures with one or more connector bars so that the plurality of proof mass sub-structures move as a single proof mass array that can operate at resonant frequencies of at least 100 kHz when oscillating in first and second orthogonal directions.

A MEMS includes a substrate having an element movably suspended relative to the substrate, the element having a first main surface and an opposite second main surface. The MEMS includes a first spring element connected between the substrate and a first column structure connected to the second main surface, and includes a second spring element connected between the substrate and a second column structure connected to the second main surface.

The invention relates to an electromagnetically actuated microshutter comprising: a moveable plate that can rotate about an axis, connected to a stationary frame by two arms aligned on both sides of the plate to said axis, and comprising on its periphery a conductive loop and below the assembly formed by the stationary frame and the moveable plate, a group of magnets having distinct magnetic orientations, arranged in such a manner so as to create, with respect to the moveable plate, a lateral magnetic field, in the plane of the frame, oblique in relation to the axis of rotation.

A MEMs actuator device and method of forming includes arrays of actuator elements. Each actuator element has a moveable top plate and a bottom plate. The top plate includes a central membrane member and a cantilever spring for movement of the central membrane member. The bottom plate consists of two RF signal lines extending under the central membrane member. A MEMs electrostatic actuator device includes a CMOS wafer, a MEMs wafer, and a ball bond assembly. Interconnections are made from a ball bond to an associated through-silicon-via (TSV) that extends through the MEMS wafer. A RF signal path includes a ball bond electrically connected through a TSV and to a horizontal feed bar and from the first horizontal feed bar vertically into each column of the array. A metal bond ring extends between the CMOS wafer and the MEMS wafer. An RF grounding loop is completed from a ground shield overlying the array to the metal bond ring, a TSV and to a ball bond.