A micro-electromechanical system (MEMS) device includes a substrate and a beam suspended relative to a surface of the substrate. The substrate includes a buried insulator layer and a cavity. The beam includes a first portion and a second portion that are separated by an isolation joint. The cavity separates the surface of the substrate from the beam.

A method for manufacturing a substrate including a region, which is mechanically decoupled from a support and has at least one component situated on the region; at least one recess being introduced on a front side of the substrate; an etching pattern being prepared on a back side of the substrate and etched anisotropically in such a manner, that vertical channels are produced on the back side of the substrate; and subsequently, a cavity being introduced at the back side of the substrate; the at least one recess on the front side of the substrate being connected to the cavity on the back side of the substrate; and in at least one region between the front side of the substrate and the cavity, at least two recesses or at least two segments of a recess being interconnected by at least one channel.

The present disclosure relates to an apparatus, system, and method for a microelectromechanical (MEM) device formed on a transparent, insulating substrate. The MEM device may take the form of an electrostatic comb actuator. The fabrication process employs three-dimensional structuring of the substrate to form the actuator combs, biasing elements, and linkages. The combs and other elements of the actuator may be rendered electrically conducting by a conformal conductive coating. The conductive coating may be segmented into a plurality of electrodes without the use of standard lithography techniques. A linear-rotational actuator is provided, which may comprise two perpendicularly-arranged, linear actuators that utilize moveable linkage beams in two orthogonal dimensions. A linear or torsional ratcheting actuator is also provided by using comb actuators in conjunction with a ratcheting wheel or cog. Furthermore, several methods for electrically connecting non-contiguous or enclosed elements are provided.

A MEMS acoustic sensor includes a substrate, a back plate, a diaphragm, a dielectric layer and a connecting portion. The diaphragm is disposed between the substrate and the back plate and includes a vibration portion. The dielectric layer is formed between the substrate and the diaphragm and has a cavity corresponding to the vibrating portion. The connecting portion is located in the cavity and connects the vibrating portion and the substrate.

A micro-electro-mechanical system (MEMS) microphone is provided. The MEMS microphone includes a substrate, a diaphragm, a backplate and a first protrusion. The substrate has an opening portion. The diaphragm is disposed on one side of the substrate and extends across the opening portion of the substrate. The backplate includes a plurality of acoustic holes. The backplate is disposed on one side of the diaphragm. An air gap is formed between the backplate and the diaphragm. The first protrusion extends from the backplate towards the air gap.

A piezoelectric microelectromechanical systems diaphragm microphone can be mounted on a printed circuit board. The microphone can include a substrate with an opening between a bottom end of the substrate and a top end of the substrate. The microphone can have two or more piezoelectric film layers disposed over the top end of the substrate and defining a diaphragm structure. Each of the two or more piezoelectric film layers can have a predefined residual stress that substantially cancel each other out so that the diaphragm structure is substantially flat with substantially zero residual stress. The microphone can include one or more electrodes disposed over the diaphragm structure. The diaphragm structure is configured to deflect when the diaphragm is subjected to sound pressure via the opening in the substrate.

A microelectromechanical systems (MEMS) device includes a MEMS device body connected to a first mooring portion and a second mooring portion. The MEMS device body further includes a first cantilever and a second cantilever and connected by a spring. The spring is in operable communication with the first cantilever and the second cantilever.

A method of manufacturing a microelectromechanical component, the method may include: forming a mask over a layer, the mask comprising a structured surface; heating a region of the mask comprising the structured surface above a glass transition temperature of the mask to smooth out edges of the structured surface to form a corrugated surface; etching the layer covered by the mask, the etching removing the mask to carry over the corrugated surface of the mask into the layer and to form a corrugated surface of the layer; forming a diaphragm over the layer to form a corrugated region of the diaphragm configured to actuate; and forming an electrically-conductive component configured to at least one of: provide a force to actuate the diaphragm in response to an electrical signal transmitted to the electrically-conductive component and provide an electrical signal in response to an actuation of the diaphragm.

Electric connection flexures for moving stages of microelectromechanical systems (MEMS) devices are disclosed. The disclosed flexures may provide an electrical and mechanical connection between a fixed frame and a moving frame, and are flexible in the moving frame's plane of motion. In implementations, the flexures are formed using a process that embeds the two ends of each flexure in the fixed frame and moving frame, respectively.

A robust MEMS transducer includes a kinetic energy diverter disposed within its frontside cavity. The kinetic energy diverter blunts or diverts kinetic energy in a mass of air moving through the frontside cavity, before that kinetic energy reaches a diaphragm of the MEMS transducer. The kinetic energy diverter renders the MEMS transducer more robust and resistant to damage from such a moving mass of air.