A microelectromechanical membrane transducer includes: a supporting structure; a cavity formed in the supporting structure; a membrane coupled to the supporting structure so as to cover the cavity on one side; a cantilever damper, which is fixed to the supporting structure around the perimeter of the membrane and extends towards the inside of the membrane at a distance from the membrane; and a damper piezoelectric actuator set on the cantilever damper and configured so as to bend the cantilever damper towards the membrane in response to an electrical actuation signal.

A micro-electro-mechanical system (MEMS) device may comprise a first layer that includes a stator comb actuator; a second layer that includes a rotor comb actuator; a mirror structure that includes a mirror; and a first set of hinges and a second set of hinges configured to tilt the mirror structure about a first axis of the MEMS device based on a driving torque caused by the stator comb actuator engaging with the rotor comb actuator. The first set of hinges may be configured to resist a lateral linear force on the mirror structure in a direction associated with the first axis caused by the stator comb actuator engaging with the rotor comb actuator. The second set of hinges may be configured to resist an in-plane torque on the mirror structure about a second axis of the MEMS device caused by the stator comb actuator engaging with the rotor comb actuator.

A micro electro mechanical system (MEMS) includes a circuit substrate, a first MEMS structure disposed over the circuit substrate, and a second MEMS structure disposed over the first MEMS structure.

Various embodiments of the present disclosure are directed towards a microelectromechanical systems (MEMS) package comprising a wire-bond damper. A housing structure overlies a support substrate, and a MEMS structure is between the support substrate and the housing structure. The MEMS structure comprises an anchor, a spring, and a movable mass. The spring extends from the anchor to the movable mass to suspend and allow movement of the movable mass in a cavity between the support substrate and the housing structure. The wire-bond damper is on the movable mass or structure surrounding the movable mass. For example, the wire-bond damper may be on a top surface of the movable mass. As another example, the wire-bond damper may be on the support substrate, laterally between the anchor and the movable mass. Further, the wire-bond damper comprises a wire formed by wire bonding and configured to dampen shock to the movable mass.

A micro-electromechanical system (MEMS) device includes a silicon substrate; and a Tantalum (Ta) layer comprising a first portion and a second portion, a first portion being suspended over the silicon substrate and configured to move relative to the silicon substrate, and the second portion of the structure being coupled to the silicon substrate and fixed in place relative to the silicon substrate. MEMS devices including accelerometers, gyroscopes, microphones, etc. can be fabricated in which Ta forms the structure material of the MEMS components on a chip. The Ta and integrated circuit (IC) can be fabricated together in a single package in which the MEMS structure is able to use the full area above the IC in the package.

There is provided a MEMS resonator comprising a support structure, a distributed cross-sectional resonator element with a particular eigenmode, at least one anchor coupling the distributed cross-sectional resonator element to the support structure, at least one drive electrode for actuating the particular eigenmode, and at least one sense electrode for sensing the particular eigenmode. The particular eigenmode is defined by a propagating series of modes, such as a plurality of Lamé modes. The MEMS resonator may be homogenously doped with one of N-type or P-type dopants, such that a second order temperature coefficient of frequency of the distributed cross-sectional resonator element is about zero. Additionally, the first order temperature coefficient of frequency may be reduced to about zero by modifying the ratio of elongation of the distributed cross-sectional resonator element or by modifying the material composition of the distributed cross-sectional resonator element.

A MEMS capacitive microphone according to the present invention is configured such that a support plate 120 from which an inside thereof has been removed in a plane is attached to supports 110 each having an end fixed to a substrate 100, an anchor 130 is attached to an edge region of the support plate 120, an edge of a diaphragm 200 is supported by the anchor 130, and a “substrate-free area” includes the anchor 130 in a plan view, and pluralities of moving comb fingers 300 and stiffeners are attached to a top or bottom or a top and bottom of the diaphragm 200, and the supports 110 support the stationary comb fingers 400 arranged at predetermined intervals on both sides of the moving comb fingers 300 in a plan view.

A method of forming a MEMS device includes providing a substrate having a device stopper. The device stopper is integral to the substrate and formed of the substrate material. A thermal dielectric isolation layer may be arranged over the device stopper and the substrate. A device cavity may be formed in the substrate and the thermal dielectric isolation layer. The thermal dielectric isolation layer and the device stopper at least partially surround the device cavity. An active device layer may be formed over the thermal dielectric isolation layer and the device cavity.

A micromechanical sensor element includes a substrate, a first structure movably arranged on the substrate, a second structure movably arranged on the substrate and an electrode arrangement, situated on the substrate in a fixed manner, which includes at least one first electrode. The movably arranged structures are coupled with each other by at least one coupling element in such a way that, upon a deflection of the first movably arranged structure along a first direction, the second movably arranged structure undergoes a deflection along an opposite direction. The first electrode includes a plurality of electrode surfaces. The movably arranged structures each include a plurality of movable electrode surfaces. The substrate-fixed electrode surfaces and the movable electrode surfaces engage with each other. The movable electrode surfaces are each situated on sides of the electrode surfaces of the substrate-fixed electrode arrangement facing away from the movably arranged structures.

A MEMS device and a method for manufacturing a MEMS device are provided. The MEMS device includes an anchor, a diaphragm structure, and a sealing film. The diaphragm structure is disposed over the anchor and has an opening through the diaphragm structure. The sealing film covers at least a portion of the opening of the diaphragm structure.