A micro-electro-mechanical system (MEMS) device may include a mirror structure suspended from a first hinge and a second hinge that are arranged to enable the mirror structure to be tilted about a tilt axis. The mirror structure may include a first actuator and a second actuator located on opposite sides of the tilt axis. The MEMS device may include a fixed electrode coupled to first actuator to cause the mirror structure to tilt about the tilt axis in a first direction based on a fixed voltage applied to the fixed electrode. The MEMS device includes a driving electrode coupled to the second actuator to cause the mirror structure to tilt about the tilt axis in a second direction opposite from the first direction based on a driving voltage applied to the driving electrode.

Angular accelerometers are described, as are systems employing such accelerometers. The angular accelerometers may include a proof mass and rotational acceleration detection beams directed toward the center of the proof mass. The angular accelerometers may include sensing capabilities for angular acceleration about three orthogonal axes. The sensing regions for angular acceleration about one of the three axes may be positioned radially closer to the center of the proof mass than the sensing regions for angular acceleration about the other two axes. The proof mass may be connected to the substrate though one or more anchors.

A microelectromechanical systems (MEMS)-tunable optical ring resonator is described herein. The ring resonator includes a resonator ring and a tuner ring, along with one or more springs. The springs may be internal or external, i.e., either within or outside the areal footprint of the resonator ring and the tuner ring. The one or more springs are configured to displace the tuner ring from the resonator ring by a desired gap based upon a desired resonant wavelength of the resonator ring. Tuning is implemented by applying a voltage to the ring resonator, with motion of the tuner ring causing a corresponding change in the effective index of the resonator ring. As the ring resonator is essentially a capacitive device, it draws very little power once tuning is achieved.

A MEMS structure is provided. The MEMS structure includes a substrate having an opening portion and a backplate disposed on one side of the substrate and having acoustic holes. The MEMS structure also includes a diaphragm disposed between the substrate and the backplate and extending across the opening portion of the substrate. The diaphragm includes a ventilation hole, and an air gap is formed between the diaphragm and the backplate. The MEMS structure further includes a filler structure disposed on the diaphragm, and a portion of the filler structure is disposed in the ventilation hole.

There is provided a piezoelectric microelectromechanical systems microphone comprising a sensor including at least one piezoelectric layer, at least one constraint in contact with the sensor at a position, such that the sensor is supported by the at least one constraint, and such that the sensor that the sensor has a membrane region to one side of the at least one constraint and a cantilevered region to the other side of the at least one constraint and a cavity defined at least partially by the at least one constraint. There is also provided a method of manufacturing the microphone.

A MEMS device may include: (i) a lower cavity, including a first island, formed within a first layer of the MEMS device; (ii) an upper cavity, including a second island, formed within a second layer of the MEMS device; (iii) a MEMS resonating element arranged in a device layer of the MEMS device and anchored via the first and second islands; (iv) a first set of electrodes for electrostatic actuation and sensing of the MEMS resonating element in an in-plane mode that is arranged in the device layer of the MEMS device; and (v) a second set of electrodes for electrostatic actuation and sensing of the MEMS resonating element in an out-of-plane mode that is electrically isolated from the first set of electrodes and located in the first or second layer of the MEMS device, and wherein the out-of-plane mode is a torsional mode or a saddle mode.

A micromechanical component. The micromechanical component includes: a membrane; the membrane includes at least one reinforcement structure of a geometrically defined shape, which reinforces the membrane in a defined manner, in the region of at least one anchor structure and/or in the region of at least one connecting structure.

A method of forming a MEMS device includes providing a substrate having a device stopper. The device stopper is integral to the substrate and formed of the substrate material. A thermal dielectric isolation layer may be arranged over the device stopper and the substrate. A device cavity may be formed in the substrate and the thermal dielectric isolation layer. The thermal dielectric isolation layer and the device stopper at least partially surround the device cavity. An active device layer may be formed over the thermal dielectric isolation layer and the device cavity.

A PMUT includes a substrate, a membrane, and a sacrificial layer. The substrate has a cavity penetrating the substrate. The membrane is disposed over the cavity and includes a first piezoelectric layer, a bottom electrode, a top electrode, and a second piezoelectric layer. The first piezoelectric layer is disposed over the cavity and includes an anchor portion, where the anchor portion of the first piezoelectric layer is in direct contact with the substrate. The top and bottom electrodes are disposed over the first piezoelectric layer. The second piezoelectric layer is disposed between the bottom electrode and the top electrode. The sacrificial layer is disposed between the substrate and the first piezoelectric layer, and a vertical projection of the sacrificial layer does not overlap a vertical projection of portions of the membrane disposed over the cavity.

A PMUT includes a substrate, a membrane, and a sacrificial layer. The substrate has a cavity penetrating the substrate. The membrane is disposed over the cavity and includes a first piezoelectric layer, a bottom electrode, a top electrode, and a second piezoelectric layer. The first piezoelectric layer is disposed over the cavity and includes an anchor portion, where the anchor portion of the first piezoelectric layer is in direct contact with the substrate. The top and bottom electrodes are disposed over the first piezoelectric layer. The second piezoelectric layer is disposed between the bottom electrode and the top electrode. The sacrificial layer is disposed between the substrate and the first piezoelectric layer, and a vertical projection of the sacrificial layer does not overlap a vertical projection of portions of the membrane disposed over the cavity.