A piezoelectric microelectromechanical systems (MEMS) microphone is provided comprising a substrate including walls defining a cavity and at least one of the walls defining an anchor region, a piezoelectric film layer supported by the substrate at the anchor region such that the piezoelectric film layer is cantilevered, the piezoelectric film layer being formed to introduce differential stress between a front surface of the piezoelectric film layer oriented away from the cavity and a back surface of the piezoelectric film layer oriented towards the cavity such that the piezoelectric film layer is bent into the cavity, and an electrode disposed over the piezoelectric film layer and adjacent the anchor region. A method of manufacturing such a MEMS microphone is also provided.

An MEMS device includes a substrate with a substrate plane, a mass element having a rest position and configured to perform a deflection from the rest position parallel to the substrate plane and in a fluid surrounding the mass element. Further, the MEMS device includes a spring arrangement that is coupled between the substrate and the mass element and configured to deform based on the deflection. An actuator structure is provided that is coupled to the mass element by means of a coupling and configured to apply a force to the mass element by means of the coupling to cause the deflection and a movement of the fluid.

The present invention discloses a MEMS microphone, which includes a substrate with a back cavity, a connection part, and a capacitive system arranged in the connection part. The capacitive system includes a first electrode connected to the inner wall of connection part, and a second electrode disposed on the substrate near the first electrode and spaced from the first electrode. The second electrode has two shape separation gaps. The shape separation gap includes a splitting gap in the second electrode, and two end gaps. The second electrode is divided into an effective vibration area and an auxiliary area by adopting a cracking gap structure. While improving the sensitivity of the first electrode, the stress concentration point of the second electrode is directed to the edge of the second electrode, so as to disperse the stress under the action of loud pressure.

Provided is a micro electro-mechanical system (MEMS) sensor including a substrate including a first cavity, a first frame including a second cavity at least partially overlapping the first cavity, at least a portion of the first frame being spaced apart from the substrate, a plurality of resonators, each of the plurality of resonators including a first end connected to the first frame and a second end extending into the second cavity, and a second frame including a first region connected to the first frame and a second region spaced apart from the first frame and connected to the substrate.

A robust MEMS transducer includes a kinetic energy diverter disposed within its frontside cavity. The kinetic energy diverter blunts or diverts kinetic energy in a mass of air moving through the frontside cavity, before that kinetic energy reaches a diaphragm of the MEMS transducer. The kinetic energy diverter renders the MEMS transducer more robust and resistant to damage from such a moving mass of air.

Disclosed is a multi-silicon on insulator (SOI) micromachined ultrasonic transducer (MUT) device. The device comprises a multi-SOI substrate and a MUT. The MUT is affixed to a surface of the multi-SOI substrate. The multi-SOI substrate has a first SOI layer and at least a second SOI layer disposed above the first SOI layer. The first SOI layer and the second SOI layer each comprise an insulating layer and a semiconducting layer. The first SOI layer further defines a cavity located under a membrane of a MUT and one or more trenches at least partially around a perimeter of the cavity.

A system includes a semiconductor substrate having a first cavity. The semiconductor substrate forms a pedestal adjacent the first cavity. A device overlays the pedestal and is bonded to the semiconductor substrate by metal within the first cavity. A plurality of second cavities are formed in a surface of the pedestal beneath the device, wherein the second cavities are smaller than the first cavity. In some of these teachings, the second cavities are voids. In some of these teachings, the metal in the first cavity comprises a eutectic mixture. The structure relates to a method of manufacturing in which a layer providing a mask to etch the first cavity is segmented to enable easy removal of the mask-providing layer from the area over the pedestal.

One of the main objects of the present invention is to provide a MEMS acoustic sensor with improved acoustic performance and liability. To achieve the above-mentioned objects, the present invention provides a MEMS acoustic sensor, including: a base with a cavity; a number of structural layers fixed on the base, each including a fixed end fixed to the base and a suspension end extending from the fixed end for being suspended above the cavity, the suspension end being spaced from the base for forming a slit; a piezoelectric functional layer on the suspension end; and a flexible connector completely covering the slit; wherein a Young's modulus of the flexible connector is smaller than a Young's modulus of the structural layer.

A micromechanical arm is provided. The micromechanical arm includes: a bottom metal piece having a plurality of trenches extending downwardly from a top surface of the bottom metal piece; an intermediate layer on the bottom metal piece and filling at least a portion of each of the plurality of trenches; and a top metal piece on the intermediate layer. The intermediate layer is made of a material that has a stiffness smaller than the bottom metal piece and the top metal piece.

A sub-centimeter structure includes a first structural component, a second structural component arranged proximate the first structural component, and a joint connecting the first and second structural components. The joint includes a material that has a first phase that is substantially rigid to hold the first and second structural components in a substantially rigid configuration while the material is in the first phase. The material of the joint has a second phase such that the joint is at least partially fluid to allow the first and second structural components to move relative to each other while the material is in the second phase. The joint interacts with the first and second structural components while the material is in the second phase to cause the first and second structural components to move relative to each other. And, the first and second structural components include a polymer.