In an assembly between a MEMS and/or NEMS electromechanical component and a casing, the electromechanical component includes at least one suspended and movable structure which is provided with at least one fixing zone, on which a region for receiving the casing is fixed, the suspended structure being at least partially formed in a cover for protecting the component or in a layer which is different from the one in which a sensitive element of the component is formed.

Substrates comprising a functionalizable layer, a polymer layer comprising a plurality of micro-scale or nano-scale patterns, or combinations thereof, and a backing layer and the preparation thereof by using room-temperature UV nano-embossing processes are disclosed. The substrates can be prepared by a roll-to-roll continuous process. The substrates can be used as flow cells, nanofluidic or microfluidic devices for biological molecules analysis.

The invention generally relates to drives for microelectromechanical acoustic pressure-generating device, which may be implemented in a microelectromechanical system (MEMS). In some embodiments of the invention, the microelectromechanical acoustic pressure-generating device is implemented in a chip/die, e.g. in form of a System-on-Chip (SoC) or a System-in-Package (SiP). Further embodiments of the invention relate to the use of such acoustic pressure-generating device in a microelectromechanical loudspeaker system, for example, headphones, hearing-aids, or the like. Embodiments of the invention relate to the miniaturization of the device. Some of the embodiments focus on countermeasures that reduce the pull-in force, which can facilitate further miniaturization of the microelectromechanical acoustic pressure-generating device.

The present disclosure provides a MEMS phase shifter and a manufacturing method thereof. The MEMS phase shifter includes a first substrate having a first surface, a coplanar waveguide on the first surface of the first substrate and including a first conductive wire and two second conductive wires on two sides of the first conductive wire and insulated from the first conductive wire, and a plurality of capacitance bridges on a side of the coplanar waveguide away from the first substrate. The plurality of capacitance bridges are arranged at intervals and insulated from the first conductive wire and the second conductive wire, and each of the plurality of capacitance bridges intersects the first conductive wire. The first surface of the first substrate includes a first groove, and the first conductive wire is suspended above the first groove.

In an assembly between a MEMS and/or NEMS electromechanical component and a casing, the electromechanical component includes at least one suspended and movable structure which is provided with at least one fixing zone, on which a region for receiving the casing is fixed, the suspended structure being at least partially formed in a cover for protecting the component or in a layer which is different from the one in which a sensitive element of the component is formed.

A method of fabricating a semiconductor structure includes: providing a first wafer; providing a second wafer having a first surface and a second surface opposite to the first surface; contacting the first surface of the second wafer with the first wafer; and forming a plurality of scribe lines on the second surface of the second wafer, wherein the formation of the plurality of scribe lines includes removing portions of the second wafer from the second surface towards the first surface to form a third surface between the first surface and the second surface, and the plurality of scribe lines protrudes from the third surface of the second wafer.

This application discloses a MEMS chip structure, including a substrate, a side wall, a dielectric plate, a MEMS micromirror array, and a grid array, where the MEMS micromirror array includes a plurality of grooves and a plurality of MEMS micromirrors. The plurality of MEMS micromirrors are in a one-to-one correspondence with the plurality of grooves. The grid array is located above the MEMS micromirror array, and a lower surface of the grid array is connected to upper surfaces of side walls of at least some of the plurality of grooves.

Substrates comprising a functionalizable layer, a polymer layer comprising a plurality of micro-scale or nano-scale patterns, or combinations thereof, and a backing layer and the preparation thereof by using room-temperature UV nano-embossing processes are disclosed. The substrates can be prepared by a roll-to-roll continuous process. The substrates can be used as flow cells, nanofluidic or microfluidic devices for biological molecules analysis.

A method of fabricating a semiconductor structure includes: providing a first wafer; providing a second wafer having a first surface and a second surface opposite to the first surface; contacting the first surface of the second wafer with the first wafer; and forming a plurality of scribe lines on the second surface of the second wafer; wherein the plurality of scribe lines protrudes from a third surface of the second wafer, and the third surface is between the first surface and the second surface.

Substrates comprising a functionalizable layer, a polymer layer comprising a plurality of micro-scale or nano-scale patterns, or combinations thereof, and a backing layer and the preparation thereof by using room-temperature UV nano-embossing processes are disclosed. The substrates can be prepared by a roll-to-roll continuous process. The substrates can be used as flow cells, nanofluidic or microfluidic devices for biological molecules analysis.