The invention relates to a component, comprising a carrier made of a structurable material with at least one continues opening which is closed by a porous membrane, characterized in that the porous membrane protrudes from the surface of the component surrounding the continuous opening. In some embodiments, the component further comprises a carrier substrate, wherein a side of the carrier substrate which faces the component and the opposite side of the component preferably form a fluid channel, wherein the at least one continuous opening of the carrier preferably communicates on its open side with the fluid channel. The component according to the invention is suitable for the installation and electrochemical measuring of transmembrane proteins, preferably in lipid bilayers. The invention also proposes different methods for producing the component.

An acoustic sensor device includes a substrate, a cavity formed in the substrate, and a microelectromechanical system (MEMS) transducer having a diaphragm supported by the substrate. The diaphragm includes a first portion configured to be fixed to the substrate and a second portion extending from the first portion and suspended over the cavity. The second portion is configured to vibrate when the MEMS transducer is subject to an external stimulus. The diaphragm also includes an anchor portion that attaches the first portion of the diaphragm to the substrate on at least two sides of the substrate such that an interface between the first portion of the diaphragm and the second portion of the diaphragm is moved away from an edge of the substrate along the cavity.

A micro electromechanical system (MEMS) includes a substrate and a rear surface opposite to the surface, a semiconductor device and a protection wall. The substrate has a surface. The semiconductor device is disposed on the surface. The protection wall surrounds the semiconductor device and passes through the surface but not electrically contacts to the semiconductor device; wherein there is no electronic element disposed between the surface and the rear surface.

The present application provides an inertial sensor, which comprising an anchor point, a first sensing proof mass, and a second sensing proof mass. The first sensing proof mass and the second sensing proof mass are connected with the anchor point by a corresponding flexible member. Each of the first sensing proof mass and the second sensing proof mass is provided with a groove to create mass imbalance on two sides of the flexible member for sensing accelerations in an out-of-plane direction. By mounting electrodes in a plane direction and in the grooves, in-plane accelerations orthogonal to each other are sensed.

A method for producing a cavity in a substrate composed of hard brittle material is provided. A laser beam of an ultrashort pulse laser is directed a side surface of the substrate and is concentrated by a focusing optical unit to form an elongated focus in the substrate. Incident energy of the laser beam produces a filament-shaped flaw in a volume of the substrate. The filament-shaped flaw extends into the volume to a predetermined depth and does not pass through the substrate. To produce the filament-shaped flaw, the ultrashort pulse laser radiates in a pulse or a pulse packet having at least two successive laser pulses. After at least two filament-shaped flaws are introduced, the substrate is exposed to an etching medium which removes material of the substrate and widens the at least two filament-shaped flaws to form filaments. At least two filaments are connected to form a cavity.

Proposed are an attachable microphone and a manufacturing method therefor. The attachable microphone includes a substrate (100) including a back chamber (110) and a first frame member (120), a back plate part (200) being disposed on the substrate (100) and including a plurality of first through holes (210) and a back plate (220), a first electrode part (300) being disposed on the back plate part (200) and having a plurality of second through holes (310) and a first electrode member (320), a support part (400) being disposed on the first electrode part (300) and including a front chamber (410) and a second frame member (420), a second electrode part (500) being disposed on the support part (400) and including a second electrode member (510), and a diaphragm (600) being disposed on the second electrode part (500) and including a thin film (610).

A liquid ejection chip has a first flow channel substrate and a second flow channel substrate bonded to each other by using an adhesive, the first flow channel substrate having an energy generation element configured to generate energy for ejecting liquid and a first flow channel configured to supply the liquid to the energy generation element, the second flow channel substrate having a second flow channel connecting to the first flow channel. Recess portions are formed at each of a wall surface of the first flow channel and a wall surface of the second flow channel, and in terms of at least one of depth and width of the recess portions, the first flow channel substrate>the second flow channel substrate.

A micro-electro-mechanical system (MEMS) package includes a wafer with an interconnect layer disposed thereon. A first device substrate including a first MEMS device and a second device substrate including a second MEMS device are laterally spaced apart from each other and disposed on the wafer. A first and a second bond seal rings are disposed below the first and the second device substrates, respectively, and both bonded to the interconnect layer. A first handle substrate includes a first cavity having a first pressure, and is bonded to the first device substrate. A second handle substrates includes a second cavity having a second pressure different from the first pressure, and is bonded to the second device substrate. A hole is disposed in the second bond seal ring for pressure adjustment in the second cavity.

The present disclosure discloses a MEMS microphone including a shell, a substrate assembled with the shell for forming a receiving space, an ASIC Die, a MEMS Die including a diaphragm and a back plate, and an elastic member. The diaphragm divides the receiving space into a front chamber and a rear chamber, the substrate comprises a first acoustic hole, a second acoustic hole, a connecting channel, and a ventilation hole, the MEMS Die covers the first acoustic hole which is communicating with the front chamber, the ventilation hole is communicating with the connecting channel and the rear chamber, the elastic member covering the ventilation hole is used for opening or closing the ventilation hole. Compared with the related art, a MEMS microphone disclosed by the present disclosure could have with high blowout resistance.

A microelectromechanical device for generating a fluid pressure using a displacer unit. The displacer unit has a movable displacer element, which can be deflected to generate a fluid pressure using a drivable connecting element acting on the displacer element. The connecting element has a base structure and a coupling structure connected to the base structure for connecting the connecting element to the displacer element. The base structure includes a mass reduction portion with a material recess. A microelectromechanical loudspeaker having such a microelectromechanical device is also described.