An inertial sensor includes a movable element having a mass that is asymmetric relative to a rotational axis and anchors attached to the substrate. First and second spring systems are spaced apart from the surface of the substrate. Each of the first and second spring systems includes a pair of beams, a center flexure interposed between the beams, and a pair of end flexures. One of the end flexures is interconnected between one of the beams and one of the anchors and the other end flexure is interconnected between one of the beams and the movable element. The beams are resistant to deformation relative to the center flexure and the end flexures. The first and second spring systems facilitate rotational motion of the movable element about the rotational axis and the spring systems facilitate translational motion of the movable element substantially parallel to the surface of the substrate.

An optical system including a dual-layer microelectromechanical systems (MEMS) device, and methods of fabricating and operating the same are disclosed. Generally, the MEMS device includes a substrate having an upper surface; a top modulating layer including a number of light modulating micro-ribbons, each micro-ribbon supported above and separated from the upper surface of the substrate by spring structures in at least one lower actuating layer; and a mechanism for moving one or more of the micro-ribbons relative to the upper surface and/or each other. The spring structures are operable to enable the light modulating micro-ribbons to move continuously and vertically relative to the upper surface of the substrate while maintaining the micro-ribbons substantially parallel to one another and the upper surface of the substrate. The micro-ribbons can be reflective, transmissive, partially reflective/transmissive, and the device is operable to modulate a phase and/or amplitude of light incident thereon.

Microelectronic structure comprising at least one movable mass that is mechanically connected to a first mechanical element by a first mechanically linking connector and to a second mechanical element (24) by electrically conductive second mechanically linking connector, and a device for electrically biasing the second mechanically linking connector, the second mechanically linking connector being such that they are the seat of a thermo-piezoresistive effect, the second linking connector and the movable mass being placed with respect to each other so that a movement of the movable mass applies a mechanical stress to the second linking connector, wherein the electrically biasing device are DC voltage biasing device and form, with at least the second mechanically linking connector, a thermo-piezoresistive feedback electric circuit.

A MEMS transducer for interacting with a volume flow of a fluid includes a substrate including a cavity, and an electromechanical transducer connected to the substrate in the cavity and including an element deformable along a lateral movement direction, wherein a deformation of the deformable element along the lateral movement direction and the volume flow of the fluid are causally related.

An electrostatic actuator includes a base, a movable electrode including a semiconductor and supported to the base to be displaceable in a first direction, and a fixed electrode including the semiconductor and fixed to the base, in which the fixed electrode faces the movable electrode in a state of being separated therefrom in the first direction. The electrostatic actuator includes a high-resistance region formed in at least a portion of each of respective facing surfaces of the movable electrode and the fixed electrode, and lower in impurity concentration than a surrounding region thereof.

A device transmits a movement and a force between a first zone and a second zone which are insulated from one another in a sealed manner. The device includes a planar support, a transmission element that is rotatably movable with respect to the support by a pivot joint having an axis of rotation that is parallel to a plane of the support, an opening in the support through which the transmission element passes and level with which the pivot joint is positioned. The transmission element includes at least one first transmission arm on one side of the plane of the support and one second transmission arm on the other side of the plane of the support, and sealed insulation positioned in the opening, such that it insulates the first zone from the second zone in a sealed manner and allows the rotational movement of the transmission element.

A sensor package including a fixed frame, a moveable platform, elastic restoring members and a sensor chip is provided. The moveable platform is moved with respect to the fixed frame, and used to carry the sensor chip. The elastic restoring members are connected between the fixed frame and the moveable platform, and used to restore the moved moveable platform to an original position. The sensor chip is arranged on the elastic restoring members to send detected data via the elastic restoring members.

A robust microelectromechanical structure that is less prone to internal or external electrical disturbances. The structure includes a mobile element with a rotor suspended to a support, a first frame anchored to the support and circumscribing the mobile element, and a second frame anchored to the support and circumscribing the mobile element between the mobile element and the first frame, electrically isolated from the first frame. The rotor and the second frame are galvanically coupled to have a same electric potential.

A method for fabricating a symmetrical MEMS accelerometer. For each half, etch multiple holes on the bottom of an SOI wafer; form multiple hollowed parts on the top of a silicon wafer; form silicon dioxide on the top and bottom of the silicon wafer; bond the top of the silicon wafer with the bottom of the SOI wafer; deposit silicon nitride on the bottom of the silicon wafer, remove parts of the silicon nitride and silicon dioxide to expose the bottom of the silicon wafer; etch the exposed bottom of the silicon wafer; reduce the thickness of the SOI wafer; remove the silicon nitride and exposed bottom. Bond the two halves along their bottom surface to form the accelerometer. Form a bottom cap including electrodes. Bond the bottom cap and the accelerometer. Deposit metal on top of the silicon wafer.

A method and system for a sensor system of a device is disclosed. The sensor system includes a first MEMS sensor (FMEMS), a second MEMS sensor (SMEMS) and a signal processor (SP). An excitation is imparted to the device along a first axis (FA). The FMEMS has a first primary sense axis (FPSA), moves in response to a component of the excitation along the FA aligned with the FPSA and outputs a first signal proportional to an excitation along the FPSA. The SMEMS has a second primary sense axis (SPSA), moves in response to a component of the excitation along the FA aligned with the SPSA and outputs a second signal proportional to an excitation along the SPSA. The SP combines the first signal and the second signal to output a third signal proportional to the excitation along the FA. The FA, the FPSA and the SPSA have different orientations.