Patent classifications
B81B2203/051
Manufacturing method of sensor package
A sensor package including a fixed frame, a moveable platform, elastic restoring members and a sensor chip is provided. The moveable platform is moved with respect to the fixed frame, and used to carry the sensor chip. The elastic restoring members are connected between the fixed frame and the moveable platform, and used to restore the moved moveable platform to an original position. The sensor chip is arranged on the elastic restoring members to send detected data via the elastic restoring members.
MANUFACTURING METHOD OR SENSOR PACKAGE
A sensor package including a fixed frame, a moveable platform, elastic restoring members and a sensor chip is provided. The moveable platform is moved with respect to the fixed frame, and used to carry the sensor chip. The elastic restoring members are connected between the fixed frame and the moveable platform, and used to restore the moved moveable platform to an original position. The sensor chip is arranged on the elastic restoring members to send detected data via the elastic restoring members.
Actuator, shutter device, fluid control device, switch, and two-dimensional scanning sensor device
An actuator includes: an electrostatic actuation mechanism including a stationary electrode and a movable electrode; a first movable part driven by the electrostatic actuation mechanism; a first elastic support part that elastically supports the first movable part; an electret formed in at least one of the stationary electrode and the movable electrode; and a drive control unit that controls application of voltage to the electrostatic actuation mechanism. In the actuator a plurality of stable states are set in which the first movable part is positioned at a stable position at which an electrostatic force generated by the electret matches with an elastic force exerted by the first elastic support part or at a stable position near such stable position. By applying a voltage to the electrostatic actuation mechanism, the first movable part may be displaced from any stable position to another stable position.
MEMS ACTUATION SYSTEM
A multi-axis MEMS assembly includes: a micro-electrical-mechanical system (MEMS) actuator configured to provide linear three-axis movement; and an optoelectronic device coupled to the micro-electrical-mechanical system (MEMS) actuator.
Device to convert out-of-plane motion to in-plane motion and/or conversely
An actuator comprising two devices each comprising an out-of-plane deformable element, said deformable element comprising a first fixed end anchored on a substrate and a second free end relative to the substrate, said device also comprising means to guide the second free end in in-plane translation along a first direction, the first deformable element being capable of deforming out-of-plane through application of a stimulus so that the second free end draws close to the first fixed end following in-plane translational movement. The actuator also comprises an element mobile in rotation about an axis orthogonal to the plane and mechanically linked to the free ends of the deformable elements, and a translationally mobile element mechanically linked to the rotationally mobile element.
Physical quantity sensor, electronic device, and mobile body
A physical quantity sensor has a first movable electrode section which has a portion facing a first fixed electrode section and a second movable electrode section which has a portion facing a second fixed electrode section, and is provided with a movable mass section which is formed in a shape which encloses a first fixed electrode side fixed section, a second fixed electrode side fixed section, a first movable electrode side fixed section, and a second movable electrode side fixed section in planar view.
MICROELECTROMECHANICAL AND/OR NANOELECTROMECHANICAL DEVICE OFFERING IMPROVED ROBUSTNESS
Microelectromechanical and/or nanoelectromechanical device comprising a fixed part (4), at least one suspended part (2) intended to be moveable in the plane of said device with respect to the fixed part (4) along at least one first direction (Y), a first means (6) for suspending said suspended part (2), said first suspension means (6) comprising two suspension elements (8.1, 8.2) each suspension element (8.1, 8.2) comprising a first end fixed directly to the suspended part (2) and a second end connected to the fixed part (4), each suspension element (8.1, 8.2) having a half-ellipse shape in the plane and extending between the first end and the second end, the two suspension elements (8.1, 8.2) being arranged with respect to each other so as to form an ellipse.
SENSOR ASSEMBLY AND ARRANGEMENT AND METHOD FOR MANUFACTURING A SENSOR ASSEMBLY
A sensor assembly for being mounted on a circuit board comprises an interposer with at least one opening extending between a first and a second main surface of the interposer. The interposer comprises at least two stress decoupling elements, each comprising a flexible structure formed by a respective portion of the interposer being partially enclosed by one of the at least one opening. A sensor die is connected to the flexible structures on the first main surface. At least two board connection elements are arranged on the first main surface and adapted for connecting the assembly to the circuit board.
Micro-electromechanical device for energy harvesting
A device for converting mechanical energy to electrical energy that include a mechanical device comprising a seismic mass flexibly connected to a base by at least one spring, a mechano-electric transducer that is associated with the mechanical device for converting mechanical energy of the seismic mass to electric energy, and an electric circuit that is connected to the mechano-electric transducer in a way that electric current is generated in the electric circuit when the seismic mass moves relative to the base. The mechano-electric transducer is designed to adjust a force that the mechano-electric transducer can exert on the mechanical device and by that to control the conversion level of the mechanical energy to the electrical energy.
Contact point structure, electronic device, and electronic apparatus
To provide a contact point structure of an electronic device capable of maintaining stable impact resistance. There is provided a contact point structure including: a base portion that is a semiconductor substrate; a movable contact point portion that is supported by the base portion and is a part of a movable member capable of being driven in a predetermined direction; and a fixed contact point portion that faces the movable contact point portion. The fixed contact point portion includes a fixed portion that is supported by the base portion and an extending member that extends from the fixed portion and is capable of being displaced relative to the fixed portion.