A method for manufacturing an apparatus having in-plane and out-of-plane motions is provided. The method includes the steps of providing an in-plane motion motor capable of moving in a first set of three degrees of freedom with respect to a reference plane for mounting thereon a functional device for performing the application function; providing an out-of-plane motion motor having a base plate surface and supporting thereon the in-plane motion motor; and providing four single-axis motors in the out-of-plane motion motor, wherein: each of the four single-axis motors has a single-axis actuator having an actuating end, a planar surface and a side surface; the side surface is attached to the base plate surface; and the four single-axis motors cooperatively enable the reference plane to be capable of moving in a second set of three degrees of freedom, wherein the first set of three degrees of freedom are all different from the second set of three degrees of freedom.

A MEMS device formed using the materials of the BEOL of a CMOS process where a post-processing of vHF and post backing was applied to form the MEMS device and where a total size of the MEMS device is between 50 um and 150 um. The MEMS device may be implemented as an inertial sensor among other applications.

A MEMS includes a substrate with a substrate extension that rises above a substrate plane. The MEMS includes a movable structural element, a first spring element that mechanically connects the movable structural element to the substrate extension, and a second spring element that mechanically connects the movable structural element to the substrate extension. The first spring element and the second spring element form a parallelogram guide of the movable structural element in relation to the substrate extension.

A multi-axis MEMS assembly is configured to provide multi-axis movement and includes: a first in-plane MEMS actuator configured to enable movement along at least an X-axis; and a second in-plane MEMS actuator configured to enable movement along at least a Y-axis; wherein the first in-plane MEMS actuator is coupled to the second in-plane MEMS actuator.

A method for manufacturing a MEMS structure is provided. The method includes providing a MEMS substrate having a first surface, forming a first buffer layer on the first surface of the MEMS substrate, and forming a first roughening layer on the first buffer layer. Also, a MEMS structure is provided. The MEMS structure includes a MEMS substrate, a first buffer layer, a first roughening layer, and a CMOS substrate. The MEMS substrate has a first surface and a pillar is on the first surface. The first buffer layer is on the first surface. The first roughening layer is on the first buffer layer. The CMOS substrate has a second surface and is bonded to the MEMS substrate via the pillar. Moreover, an air gap is between the first roughening layer and the second surface of the CMOS substrate.

A MEMS electrostatic actuator that achieves autofocus and super resolution imaging in cameras is disclosed. The actuator is able to provide multi-degrees of freedom motion (of up to 5-degrees-of-freedom). It consists of a moving and fixed parts. The moving part comprises an inner and outer rotor. The inner rotor contains a load stage and the moving plates of the parallel-plate electrodes and is attached to the outer rotor via a plurality of mechanical springs. The outer rotor holds the inner rotor and contains a plurality of openings or tubes surrounded by walls and are attached to the outer periphery of the actuator via multiple mechanical springs. The present device can be used to achieve super resolution functionality in compact cameras.

Embodiments of an optical data communication apparatus using micro-electro-mechanical system (MEMS) micro-mirror arrays is described herein. The apparatus may include a router configured to operate as a relay to exchange optical data signals between optical switches of the apparatus. The optical switches may be configured to switch between reflection directions to reflect the optical signals over different optical connections between the optical switches and different receiving ports of the router. The reflection directions may be switched in accordance with predetermined mappings between the receiving ports of the router and destinations of the optical signals. The router includes a MEMS micro-mirror array configured to reflect received optical signals to the destinations. A processing element of the optical data switching circuitry may generate a plurality of optical data signals and may send the optical data signals to an optical switch of the optical data switching circuitry.

Embodiments of a satellite transceiver configurable for inter-satellite communication and configurable for satellite to ground communication are disclosed herein. In some embodiments, the satellite transceiver comprises a micro-electromechanical (MEM) micro-mirror array (MMA) (MEM-MMA) configured to steer a beam of encoded optical data over a field-of-view (FOV). The MEM-MMA comprises a plurality of individual mirror elements. Each of the mirror elements is controllable by control circuitry to steer the beam over the FOV.

An active mode image sensor for optical non-uniformity correction (NUC) of an active mode sensor uses a Micro-Electro-Mechanical System (MEMS) Micro-Mirror Array (MMA) having tilt, tip and piston mirror actuation to form and scan a laser spot that simultaneously performs the NUC and illuminates the scene so that the laser illumination is inversely proportional to the response of the imager at the scan position. The MEMS MMA also supports forming and scanning multiple laser spots to simultaneously interrogate the scene at the same or different wavelengths. The piston function can also be used to provide wavefront correction. The MEMS MMA may be configured to generate a plurality of fixed laser spots to perform an instantaneous NUC.

Various embodiments of the present disclosure are directed towards a microelectromechanical system (MEMS) device. The MEMS device includes a first dielectric structure disposed over a first semiconductor substrate, where the first dielectric structure at least partially defines a cavity. A second semiconductor substrate is disposed over the first dielectric structure and includes a movable mass, where opposite sidewalls of the movable mass are disposed between opposite sidewall of the cavity. A first piezoelectric anti-stiction structure is disposed between the movable mass and the first dielectric structure, wherein the first piezoelectric anti-stiction structure includes a first piezoelectric structure and a first electrode disposed between the first piezoelectric structure and the first dielectric structure