A hinge for a microelectromechanical system includes a fixed part and a part movable relative to the fixed part along at least an out-of-plane direction, the hinge being intended to suspend the moving part from the fixed part. The hinge includes a first rigid part, a second part fixed to the first part at one end and intended to be anchored to the fixed part or the moving part. The second part deforms in bending in a first direction, two third parts are fixed to the first part and are anchored to the moving part or the fixed part, and the third parts deform in bending along a second direction orthogonal to the first direction.

An MEMS chip includes a substrate, a movable assembly, a fastening assembly, and a drive assembly. The fastening assembly is located between the substrate and the movable assembly. The movable assembly includes a fastening portion, a movable portion, and a first support beam. The first support beam is connected to the movable portion and the fastening portion. A first avoidance slot is disposed on a face that is of the movable portion and that faces the fastening assembly. The fastening assembly is grounded. A boss and a first position limiting pole are disposed on a face that is of the fastening assembly and that faces the movable assembly. The boss is connected to the fastening portion and configured to support the fastening portion. The first position limiting pole corresponds to the first avoidance slot. The drive assembly is connected to the movable portion to drive the movable portion to move.

A MEMS acoustic transducer provided with: a substrate of semiconductor material, having a back surface and a front surface opposite with respect to a vertical direction; a first cavity formed within the substrate, which extends from the back surface to the front surface; a membrane which is arranged at the upper surface, suspended above the first cavity and anchored along a perimeter thereof to the substrate; and a combfingered electrode arrangement including a number of mobile electrodes coupled to the membrane and a number of fixed electrodes coupled to the substrate and facing respective mobile electrodes for forming a sensing capacitor, wherein a deformation of the membrane as a result of incident acoustic pressure waves causes a capacitive variation of the sensing capacitor. In particular, the combfingered electrode arrangement lies vertically with respect to the membrane and extends parallel thereto.

The present disclosure relates to a microelectromechanical systems (MEMS) package featuring a flat plate having a raised edge around its perimeter serving as an anti-stiction device, and an associated method of formation. A CMOS IC is provided having a dielectric structure surrounding a plurality of conductive interconnect layers disposed over a CMOS substrate. A MEMS IC is bonded to the dielectric structure such that it forms a cavity with a lowered central portion the dielectric structure, and the MEMS IC includes a movable mass that is arranged within the cavity. The CMOS IC includes an anti-stiction plate disposed under the movable mass. The anti-stiction plate is made of a conductive material and has a raised edge surrounding at least a part of a perimeter of a substantially planar upper surface.

A micro-electrical-mechanical system (MEMS) assembly includes a stationary stage, a rigid stage, at least one flexure configured to slidably couple the stationary stage and the rigid stage, at least one flexible electrode coupled and essentially orthogonal to one of the stationary stage and the rigid stage, and at least one rigid electrode coupled and essentially orthogonal to the other of the stationary stage and the rigid stage.

Systems and methods for a time-based optical pickoff for MEMS sensors are provided. In one embodiment, a method for an integrated waveguide time-based optical-pickoff sensor comprises: launching a light beam generated by a light source into an integrated waveguide optical-pickoff monolithically fabricated within a first substrate, the integrated waveguide optical-pickoff including an optical input port, a coupling port, and an optical output port; and detecting changes in an area of overlap between the coupling port and a moving sensor component separated from the coupling port by a gap by measuring an attenuation of the light beam at the optical output port, wherein the moving sensor component is moving in-plane with respect a surface of the first substrate comprising the coupling port and the coupling port is positioned to detect movement of an edge of the moving sensor component.

A device with an out-of-plane electrode includes a device layer positioned above a handle layer, a first electrode defined within the device layer, a cap layer having a first cap layer portion spaced apart from an upper surface of the device layer by a gap, and having an etch stop perimeter defining portion defining a lateral edge of the gap, and an out-of-plane electrode defined within the first cap layer portion by a spacer.

Embodiments of the present invention provide an MEMS actuator with a substrate, at least one post attached to the substrate and a deflectable actuator body that is connected to the at least one post via at least one spring, wherein, during electrostatic, electromagnetic or magnetic force application, the actuator body takes a second position starting from a first position by a tilt-free translational movement, wherein the first position and the second position are different, and wherein in a top view of the MEMS actuator the actuator body is arranged outside an area spanned by the at least one post.

A micro-electrical-mechanical system (MEMS) assembly includes a micro-electrical-mechanical system (MEMS) actuator configured to be coupled, on a lower surface, to a printed circuit board, an image sensor assembly coupled to an upper surface of the micro-electrical-mechanical system (MEMS) actuator, and a holder assembly coupled to and positioned with respect to the micro-electrical-mechanical system (MEMS) actuator.

A system and methods for base excitation of moderately high vibration of micro-cantilevers are disclosed. A micro-cantilever may be coupled to one or more actuators adjacent its base. The actuators may comprise bulk materials, bridges, or formed wires that expand and contract by application of electric currents, due to, for example, the effect of electro-thermal heating or piezoelectric effects. Single actuators or an array of actuators may be placed around the micro-cantilever to oscillate it and apply actuation pulses. The system and methods, and adjustments of the geometrical parameters, may be performed to yield a nominal natural frequency in the system. The excitation of actuators with signals corresponding to the natural frequency may induce resonance in the system and may result in high amplitude vibrations and displacement of the cantilever tip of the micro-cantilever. Various architectures of the actuators may be implemented to stimulate different frequencies of the beam and induce displacement in different direction and amplitudes.