A micro-electromechanical (MEMS) apparatus includes a substrate, two first anchors, a frame, and two elastic members. The substrate is provided with a reference point thereon. The frame surrounds the two first anchors, and each of the elastic members connects the corresponding first anchor and the frame. Each of the first anchors is disposed near the center of the MEMS apparatus to decrease an effect caused by warpage of the substrate. The MEMS apparatus can be applied to an MEMS sensor having a rotatable mass, such as a three-axis accelerometer or a magnetometer, to improve process yield, reliability, and measurement accuracy.

A MEMS device includes a mass system capable of undergoing oscillatory drive motion along a drive axis and oscillatory sense motion along a sense axis perpendicular to the drive axis. A quadrature correction unit includes a fixed electrode and a movable electrode coupled to the movable mass system, each being lengthwise oriented along the drive axis. The movable electrode is spaced apart from the fixed electrode by a gap having an initial width. At least one of the fixed and movable electrodes includes an extrusion region extending toward the other of the fixed and movable electrodes. The movable electrode undergoes oscillatory motion with the mass system such that the extrusion region is periodically spaced apart from the other of the fixed and movable electrodes by a gap exhibiting a second width that is less than the first width thereby enabling capacitance enhancement between the electrodes.

A device with a mobile element extending along a given plane comprising at least one first, one second and one third layers extending in planes parallel to the given plane, with the first layer forming a support, the second layer comprising all or a portion of the mobile element and means for suspending the mobile element with respect to the support and the third layer comprising all or a portion of the capacitive means of which the capacitance varies according to the relative position of the mobile element with respect to the support, said capacitive means comprising at least one mobile electrode integral with one of the faces of the mobile element parallel to the given plane, and at least one fixed electrode with respect to the support, with the fixed and mobile electrodes being arranged at least partially in the same plane parallel to the given plane and at least partially above and/or below the mobile element.

A MEMS acceleration detection device including a housing having a cavity and a spring mass system assembled into the cavity of the housing. A lid enclosing the spring mass system in the cavity and contacting a top surface of the housing.

A micro-electromechanical system (MEMS) device includes a silicon substrate; and a Tantalum (Ta) layer comprising a first portion and a second portion, a first portion being suspended over the silicon substrate and configured to move relative to the silicon substrate, and the second portion of the structure being coupled to the silicon substrate and fixed in place relative to the silicon substrate.

A frame (110) is rotatably coupled to a substrate (200) by way of a torsion spring element (100), wherein the frame (110) can be both twisted in relation to the substrate (200) and moved linearly in relation to said substrate (200). The torsion spring element (100) is made of a single piece and suitable for use in micro-electromechanical devices.

A microelectromechanical sensor device having a sensing structure with: a substrate; an inertial mass, suspended above the substrate and elastically coupled to a rotor anchoring structure by elastic coupling elements, to perform at least one inertial movement due to a quantity to be sensed; first sensing electrodes, integrally coupled to the inertial mass to be movable due to the inertial movement; and second sensing electrodes, fixed with respect to the quantity to be sensed, facing and capacitively coupled to the first sensing electrodes to form sensing capacitances having a value that is indicative of the quantity to be sensed. The second sensing electrodes are arranged in a suspended manner above the substrate and a compensation structure is configured to move the second sensing electrodes with respect to the first sensing electrodes and vary a facing distance thereof, in the absence of the quantity to be sensed, in order to compensate for a native offset of the sensing structure.

The present disclosure is directed to a process for manufacturing a micro-electro-mechanical system (MEMS) device. The process includes, in part, forming a first sacrificial dielectric region on a semiconductor wafer; forming a structural layer of semiconductor material on the first sacrificial dielectric region; forming a plurality of first openings through the structural layer; forming a second sacrificial dielectric region on the structural layer; forming a ceiling layer of semiconductor material on the second sacrificial dielectric region; forming a plurality of second openings through the ceiling layer; forming on the ceiling layer a permeable layer; selectively removing the first and the second sacrificial dielectric regions; and forming on the permeable layer a sealing layer of semiconductor material.