The present invention discloses a three-axis accelerometer. The three-axis accelerometer comprises: a substrate; at least one anchor block fixedly disposed on the substrate; a first X-axis electrode, a second X-axis electrode, a first Y-axis electrode, a second Y-axis electrode, a first Z-axis electrode and a second Z-axis electrode all fixedly disposed on the substrate; a framework suspended above the substrate and comprising a first beam column, a second beam column disposed opposite to the first beam column and at least one connecting beam connecting the first beam column and the second beam column; a proof mass suspended above the substrate; and at least one elastic connection component configured to elastically connect to the at least anchor block, the connecting beam, and the proof mass. The three-axis accelerometer can realize high-precision acceleration detection on three axes with only one proof mass, and in particular, can provide a fully differential detection signal for the Z axis, thereby greatly improving detection precision.

A MEMS micromirror includes a mirror surface driving structure which is positioned on a substrate and includes two L-shaped structures in head-to-tail arrangement. Each L-shaped structure includes a second torsion beam, an L-shaped transverse plate and a second comb-shaped structure. The first driving electrode is provided on the substrate at a position under a head end of the L-shaped transverse plate, the head end of the L-shaped transverse plate is rotatable with support of the second torsion beam, and a tail end of the L-shaped transverse plate is connected with the second comb-shaped structure. The micromirror surface layer is disposed above the mirror surface driving structure, the first torsion beam is fixed by the substrate and supports two sides of the micromirror surface layer, and two sides, corresponding to the second comb-shaped structures, of the micromirror surface layer are provided with first comb-shaped structures, respectively.

A MEMS micromirror includes a mirror surface driving structure which is positioned on a substrate and includes two L-shaped structures in head-to-tail arrangement. Each L-shaped structure includes a second torsion beam, an L-shaped transverse plate and a second comb-shaped structure. The first driving electrode is provided on the substrate at a position under a head end of the L-shaped transverse plate, the head end of the L-shaped transverse plate is rotatable with support of the second torsion beam, and a tail end of the L-shaped transverse plate is connected with the second comb-shaped structure. The micromirror surface layer is disposed above the mirror surface driving structure, the first torsion beam is fixed by the substrate and supports two sides of the micromirror surface layer, and two sides, corresponding to the second comb-shaped structures, of the micromirror surface layer are provided with first comb-shaped structures, respectively.

A MEMS electrostatic actuator that achieves autofocus and super resolution imaging in cameras is disclosed. The actuator is able to provide multi-degrees of freedom motion (of up to 5-degrees-of-freedom). It consists of a moving and fixed parts. The moving part comprises an inner and outer rotor. The inner rotor contains a load stage and the moving plates of the parallel-plate electrodes and is attached to the outer rotor via a plurality of mechanical springs. The outer rotor holds the inner rotor and contains a plurality of openings or tubes surrounded by walls and are attached to the outer periphery of the actuator via multiple mechanical springs. The present device can be used to achieve super resolution functionality in compact cameras.

A light deflector includes a stationary part; a movable unit having a reflecting surface; a connecting part between the movable unit and the stationary part; a drive unit disposed on a first surface of the connecting part, the drive unit configured to deform the connecting part to oscillate the movable unit; and a rib disposed on a second surface of the connecting part, the second surface being an opposite surface of the first surface. The rib includes a portion whose longitudinal direction is orthogonal to a direction at which the connecting part is bent.

An optical device includes a support portion, a first movable portion having an optical surface, a second movable portion having a frame shape and surrounding the first movable portion, a first coupling portion coupling the first movable portion and the second movable portion to each other, a second coupling portion coupling the second movable portion and the support portion to each other, and a softening member which has a softening characteristic and to which stress is applied when the first movable portion swings around a first axis. When viewed in a direction perpendicular to the optical surface, the softening member is provided to a portion of the second movable portion, the portion extending between a drive element and the first coupling portion, and is not electrically connected to an outside.

This disclosure relates to devices for two-dimensional deflection of a laser beam, which include a substrate having a substrate opening, a spring membrane provided on the substrate having spring arms extending over the substrate opening, and a middle section arranged in the substrate opening and supported by the spring arms. The middle section is mounted so it is two-dimensionally tiltable and is axially displaceable in both directions of the spring membrane middle axis. The device includes a mirror fastened on the middle section of the spring membrane and a magnetic or electrostatic drive for tilting the mirror against the restoring force of the spring arms. One or more of a component coupled to the mirror and an end stop unit are configured to limit axial deflection of the middle section to a distance that is within a range of axial deflection of the middle section during the drive-related tilting of the mirror.

In described examples, a system (e.g., a microelectromechanical system) includes a substrate, a support coupled to the substrate and a first and second element. The first element includes a contactor spring having a first portion coupled to the support and having a second portion including a cavity having a sloped surface. A clearance from the sloped surface to the substrate is widened as the sloped surface extends away from the first portion. The second portion includes a first contact surface adjacent to the sloped surface. The second element is coupled to the substrate and has a second contact surface adjacent to the first contact surface. One of the first element and the second element is adapted: in a first direction to urge the first contact surface and the second contact surface together; and in a second direction to urge the first contact surface and the second contact surface apart.

A MEMS actuator includes a monolithic body of semiconductor material, with a supporting portion of semiconductor material, orientable with respect to a first and second rotation axes, transverse to each other. A first frame of semiconductor material is coupled to the supporting portion through first deformable elements configured to control a rotation of the supporting portion about the first rotation axis. A second frame of semiconductor material is coupled to the first frame by second deformable elements, which are coupled between the first and the second frames and configured to control a rotation of the supporting portion about the second rotation axis. The first and second deformable elements carry respective piezoelectric actuation elements.

A method for forming a MEMS device may include performing a silicon-on-nothing process to form a cavity in a monocrystalline silicon substrate at a first depth relative to a top surface of the monocrystalline silicon substrate; forming, in an electrically conductive electrode region of the monocrystalline silicon substrate, an electrically insulated region extending to a second depth that is less than the first depth relative to the top surface of the monocrystalline silicon substrate; and etching the monocrystalline silicon substrate to expose a gap between a first electrode and a second electrode, wherein the second electrode is separated from the first electrode, within a first depth region, by a first distance defined by the electrically insulated region and the gap, and wherein the second electrode is separated from the first electrode, within a second depth region, by a second distance defined by the gap.