A capacitive microelectromechanical device is provided. The capacitive microelectromechanical device includes a semiconductor substrate, a support structure, an electrode element, a spring element, and a seismic mass. The support structure, for example, a pole, suspension or a post, is fixedly connected to the semiconductor substrate, which may comprise silicon. The electrode element is fixedly connected to the support structure. Moreover, the seismic mass is connected over the spring element to the support structure so that the seismic mass is displaceable, deflectable or movable with respect to the electrode element. Moreover, the seismic mass and the electrode element form a capacitor having a capacitance which depends on a displacement between the seismic mass and the electrode element.

An actuator device includes a support portion, a movable portion, a connection portion which connects the movable portion to the support portion on a second axis, a first wiring which is provided on the connection portion, a second wiring which is provided on the support portion, and an insulation layer which includes a first opening exposing a surface opposite to the support portion in a first connection part located on the support portion in one of the first wiring and the second wiring and covers a corner of the first connection part. The rigidity of a first metal material forming the first wiring is higher than the rigidity of a second metal material forming the second wiring. The other wiring of the first wiring and the second wiring is connected to the surface of the first connection part in the first opening.

A fixed frame (2) is fixed to an external member. An ultrasonic oscillator (3) is disposed inside the fixed frame (2) and includes a flexible first substrate and a first piezoelectric element deposited on the first substrate in the form of a thin film. The ultrasonic oscillator (3) is warped in response to expansion or contraction of the first piezoelectric element and generates ultrasonic waves. Actuator units (4) include a flexible second substrate coupling the first substrate to the fixed frame (2) and a second piezoelectric element deposited on the second substrate in the form of a thin film. The actuator units (4) are warped in response to expansion or contraction of the second piezoelectric element and cause the ultrasonic oscillator (3) to swing relative to the fixed frame (2). The fixed frame (2), the first substrate, and the second substrate are composed of the same substrate.

An array of micro mirrors is used to beam steer a laser for Light Detection and Ranging (LiDAR) applications. The array of micro mirrors are driven in a nonlinear motion to synchronize motion of the micro mirrors in the array.

A light deflection device includes a substrate including a planar portion and a recess; a spacer member disposed at a bottom of the recess; a supporting section disposed on the spacer member; a movable part rotatably supported by the supporting section and having a reflecting surface configured to reflect light at a height equal to or higher than a height of the planar portion; and a light transmissive member disposed on the planar portion and covering the movable part.

A micromechanical component having a movable seismic mass developed in a second and third silicon functional layer, a hollow body being developed in the second and third silicon functional layers, which has a cover element developed in a fourth silicon functional layer.

A micro-electro-mechanical (MEMS) device is formed in a first wafer overlying and bonded to a second wafer. The first wafer includes a fixed part, a movable part, and elastic elements that elastically couple the movable part and the fixed part. The movable part further carries actuation elements configured to control a relative movement, such as a rotation, of the movable part with respect to the fixed part. The second wafer is bonded to the first wafer through projections extending from the first wafer. The projections may, for example, be formed by selectively removing part of a semiconductor layer. A composite wafer formed by the first and second wafers is cut to form many MEMS devices.

A micromechanical device with electromagnetic actuation includes a base and a micro electro mechanical system (MEMS). The MEMS includes a mobile rotating element based on one or two axes of rotation. The base includes stators each forming a first internal pole, an external pole and an air gap. In order to increase the reliability and the mechanical stability of the device, the first internal poles are mounted in a connected manner to each other onto the base.

A micromechanical constituent includes an actuator designed to impart to a displaceable element a first displacement motion around a first rotation axis and a second displacement motion around a second rotation axis oriented tiltedly with respect to the first rotation axis, the actuator including a permanent magnet on a first spring element and a one second permanent magnet on a second spring element, where the first permanent magnet is excitable to perform a first translational motion tiltedly with respect to the first rotation axis and tiltedly with respect to the second rotation axis, and the second permanent magnet is excitable to perform a second translational motion directed oppositely to the first translational motion, causing the second displacement motion of the displaceable element around the second rotation axis.

A MEMS electrostatic piston-tube actuator that provides 4 degrees of freedom (4-DOF) motion is disclosed. The actuator comprises of an inner and an outer MEMS structure. The inner MEMS structure comprises of an inner moving stage (rotor) and an inner fixed frame (stator). The inner rotor comprises of a central load stage, a plurality of rotary comb drive electrodes surrounding the central rotor. The outer MEMS structure comprises of an outer moving stage (outer rotor) and outer stator frame. The outer rotor holds the entire inner MEMS structure and is rigidly attached to it through a fixed periphery of the inner MEMS structure. The outer rotor comprises of a plurality of through openings (tubes) and attached to a fixed outer periphery through a plurality of mechanical springs. A load set on the central stage can be controlled in 4-DOF comprising of translational and rotational motions of roll, yaw, pitch, and z-axis translation.