A rotation rate sensor including a substrate, a drive structure, which is movable with regard to the substrate, a detection structure, and a Coriolis structure, the drive structure, the Coriolis structure, and the detection structure being essentially situated in a layer, in that an additional layer is situated essentially in parallel to the layer above or underneath the layer, a mechanical connection between the Coriolis structure and the drive structure being established with a first spring component, the first spring component being configured as a part of the additional layer, and/or a mechanical connection between the detection structure and the substrate being established with a second spring component, the second spring component being configured as a part of the additional layer.

An actuator element of a MEMS device on a substrate is provided to create large, out-of-plane deflection. The actuator element includes a metallic layer having a first portion contacting the substrate and a second portion having an end proximal to the first portion. A distal end is cantilevered over the substrate. A first insulating layer contacts the metallic layer on a bottom contacting surface of the second cantilevered portion from the proximal to the distal end. A second insulating layer contacts the metallic layer on a portion of a top contacting surface at the distal end. The second portion of the metallic layer is prestressed. A coefficient of thermal expansion of the first and second insulating layers is different than a coefficient of thermal expansion of the metallic layer. And, a Young's modulus of the first and second insulating layer is different than a Young's modulus of the metallic layer.

MEMS devices include a suspended element connected to a fixed part of a substrate by one or more flexures, wherein the one or more flexures are configured to permit movement of the suspended element relative to a fixed part of the substrate. An actuator coupled to the suspended element and a damping structure coupled to the suspended element extends into a gap between the suspended element and the fixed part of the substrate. One or more fluid confinement structures are configured to permit movement of the damping structure within a limited portion of the gap and to confine a viscoelastic fluid to the limited portion of the gap.

A microelectromechanical device includes a fixed structure defining a cavity with a tiltable structure that is elastically suspended in the cavity. A piezoelectrically driven actuation structure, interposed between the tiltable structure and the fixed structure, is biased for causing rotation of the tiltable structure about a first rotation axis belonging to a horizontal plane in which the tiltable structure rests. The actuation structure includes a pair of driving arms carry respective regions of piezoelectric material and are elastically coupled to the tiltable structure on opposite sides of the first rotation axis through respective elastic decoupling elements. The elastic decoupling elements exhibit stiffness in regard to movements out of the horizontal plane and compliance to torsion about the first rotation axis.

According to one embodiment, a sensor includes a first member including a first member surface, and a first element part. The first element part includes a first fixed electrode fixed to the first member surface, and a first movable electrode facing the first fixed electrode. The first fixed electrode is along the first member surface. A gap is located between the first movable electrode and the first fixed electrode. The first movable electrode includes a first surface and a second surface. The first surface is between the first fixed electrode and the second surface. At least one of the first surface or the second surface is non-parallel to the first member surface.

A mirror array includes a lid, a base, and a movable mirror between the lid and the base. The movable mirror includes a stationary frame including a cavity, a movable frame in the cavity, and a central stage in the cavity. The mirror array also includes a first protrusion on the base wafer. The first protrusion overlaps with the central stage in a first direction.

A piezoelectric drive element includes: a movable part; a pair of piezoelectric drive parts each connected at one end portion thereof to the movable part and configured to rotate the movable part about at least a rotation axis; and a fixing part to which end portions of the piezoelectric drive parts are connected. The pair of piezoelectric drive parts are aligned in a direction along the rotation axis with the movable part located therebetween, a width of the movable part is narrower than a width of each of the pair of piezoelectric drive parts in a plan view, and the fixing part is placed in a gap region that is outside the movable part and that is located between the pair of piezoelectric drive parts in a plan view.

In one example, an apparatus that is part of a Light Detection and Ranging (LiDAR) module of a vehicle comprises a semiconductor integrated circuit comprising a microelectromechanical system (MEMS) and a substrate. The MEMS comprises an array of micro-mirror assemblies, each micro-mirror assembly comprising: a micro-mirror having a first thickness; and an actuator comprising first fingers and second fingers, the first fingers being connected with the substrate, the second fingers being mechanically connected to the micro-mirror having a second thickness smaller than the first thickness, the actuator being configured to generate an electrostatic force between the first fingers and the second fingers to rotate the micro-mirror to reflect light emitted by a light source out of the LiDAR module or light received by the LiDAR module to a receiver.

A flip chip micromirror assembly comprising a micromirror chip that is flip chip mounted onto the circuit board via a bonding layer. The micromirror chip has a micromirror layer in which a micromirror is formed. The micromirror chip has a flip chip surface facing the electrode surface of the circuit board. The bonding layer includes conductive region(s) that electrically couples corresponding board electrodes with corresponding chip electrodes. However, the bonding layer is not interposed between the electrode surface of the circuit board and the micromirror itself. In other words, the bonding layer spaces the micromirror chip from the circuit board, and provides a gap underneath the micromirror between the micromirror chip and the circuit board. This gap is of sufficient thickness that the micromirror can be actuated with full movement without being mechanically obstructed by the circuit board.

A capacitive microelectromechanical device is provided. The capacitive microelectromechanical device includes a semiconductor substrate, a support structure, an electrode element, a spring element, and a seismic mass. The support structure, for example, a pole, suspension or a post, is fixedly connected to the semiconductor substrate, which may comprise silicon. The electrode element is fixedly connected to the support structure. Moreover, the seismic mass is connected over the spring element to the support structure so that the seismic mass is displaceable, deflectable or movable with respect to the electrode element. Moreover, the seismic mass and the electrode element form a capacitor having a capacitance which depends on a displacement between the seismic mass and the electrode element.