An actively reversible and reusable dry adhesion system, and related methods for using the same, may comprise a first plurality of nanoparticles, e.g., carbon nanotubes, formed on a first substrate that may be selectively reconfigured in response to an active stimulus, e.g., electrical current, temperature gradient, magnetism, etc.; a second plurality of nanoparticles, e.g., carbon nanotubes, formed on a second substrate that may be selectively reconfigured in response to the active stimulus; and a switch or button that may be operably connected to the first and second substrates. The switch or button may be configured to selectively apply the active stimulus. When the switch or button is activated, the first and second pluralities of nanoparticles may interlock to adhere the first substrate to the second substrate. The dry adhesion system may form an interlocking fastener on a nanoscale, and may be reversible and reusable.

A spatial light modulator is provided that uses light modulation structures at each pixel to employ electromagnetic interference to modulate the intensity and/or phase of the transmitted and/or reflected light from the pixel. The use of the modulation structures enables the independent and dynamic changing of the intensity and/or phase of the reflected and/or transmitted light at each pixel. The modulation structure can incorporate a plate with a semi-reflective surface that is separated from a substrate having either a reflective or semi-reflective surface. The modulation structure can have actuators positioned between the substrate and the plate to control the separation distance between the plate and the substrate. By controlling the separation distance, the amount of light reflected by and/or transmitted through the surfaces of the plate and substrate can be controlled. The separation distance can be related to the resulting interference applied to particular wavelengths of the light.

Methods, apparatuses and methods of manufacture are described for a MEMS mirror array with reduced crosstalk. The MEMS mirror array has a plurality of reflective surfaces wherein each reflective surface has a resonant frequency, and further wherein adjacent reflective surfaces do not have the same resonant frequency.

A method for fabricating a device includes the following steps: fabricating at least one first microstructure and one second microstructure on the substrate, fabricating a connection microstructure making it possible to electrically connect at least the first microstructure to the second microstructure by fabricating a support made of dielectric material by solidifying, by means of a lithography method, a part of a deposited resin layer and by depositing a first metallic layer on at least a part of the support comprising at least a part linking the first microstructure and the second microstructure.

An example microelectromechanical system (MEMS) switch comprises a hinge plane having two or more intersecting hinges; a switch plate; and a plurality of electrostatic pads. Selective activation of the electrostatic pads causes torsion of at least one of the two or more intersecting hinges to tilt the switch plate to a selected one of three or more positions.

In embodiments, a package assembly may include an application-specific integrated circuit (ASIC) and a microelectromechanical system (MEMS) having an active side and an inactive side. In embodiments, the MEMS may be coupled directly to the ASIC by way of one or more interconnects. The MEMS, ASIC, and one or more interconnects may define or form a cavity such that the active portion of the MEMS is within the cavity. In some embodiments, the package assembly may include a plurality of MEMS coupled directly to the ASIC by way of a plurality of one or more interconnects. Other embodiments may be described and/or claimed.

An ultrasonic transducer element includes a substrate, a lower electrode on a first surface of the substrate, a first insulating film on the lower electrode, a first cavity layer on the first insulating film, a second insulating film on the first cavity layer, an upper electrode on the second insulating film that overlaps the first cavity layer, a third insulating film on the upper electrode, a second cavity layer on the third insulating film, a fourth insulating film on the second cavity layer, a fixing portion formed by the second to fourth insulating films, a movable portion in a membrane insides the second cavity layer, a first connection portion and a second connection portion that are stacked with a gap and the connection portions are configured by the second to fourth insulating films connecting the movable portion and the fixing portion.

A method for fabrication of free standing mechanical and photonic structures is presented. A resist mask is applied to a bulk substrate. The bulk substrate is attached to a movable platform. The bulk substrate is exposed to an ion stream produced by a reactive ion beam etching source. The platform is moved relative to the ion stream to facilitate undercutting a portion of the bulk substrate otherwise shielded by the mask.

A method of forming a micromechanical structure comprising, forming a sacrificial layer on a surface and walls of a trench in a substrate; depositing a structural layer over the sacrificial layer, extending into the trench, selectively etching the structural layer to define a pattern having a boundary, at least a portion of the structural layer overlying a respective portion of the trench being removed and at least a portion of the structural layer extending into the trench being preserved at the boundary; and removing at least a portion of the sacrificial layer from underneath the structural layer, prior to removal of at least a portion of the sacrificial layer extending into the trench at the structural boundary. A micromechanical structure formed by the method is also provided.

The present subject matter relates to systems and methods for arranging and controlling programmable combinations of tuning elements in which more than one form of switching technology is combined in a single array. Specifically, such an array can include one or more first switchable elements including a first switching technology (e.g., one or more solid-state-controlled devices) and one or more second switchable elements including a second switching technology that is different than the first switching technology (e.g., one or more micro-electro-mechanical capacitors). The one or more first switchable elements and the one or more second switchable elements can be configured, however, to deliver a combined variable reactance.