An example method of producing a microelectromechanical system (MEMS) package, the method comprising: applying first epoxy layers to a first substrate, at least one of the first epoxy layers coupled to a second substrate; applying a first post gel heat treatment to the first epoxy layers; after applying the first post gel heat treatment to the first epoxy layers, applying second epoxy layers to the second substrate and to the first epoxy layers; and applying a second post gel heat treatment to the first epoxy layers and the second epoxy layers.

A package for multiple MEMS-based speakers in a compact form factor is provided. One package includes: a first rigid section defining a first vent aperture; a second rigid section defining a second vent aperture; a first speaker die attached to the first rigid section and covering the first vent aperture; a second speaker die attached to the second rigid section and covering the second vent aperture; a first flexible section attached between and providing electrical continuity between the first rigid section and the second rigid section; and a spacer defining an acoustic port, where the first rigid section is attached to a first side of the spacer, and the second rigid section is attached to a second side of the spacer, where the first speaker die faces the second speaker die.

Monolithic microelectromechanical systems (MEMS) based spatial light modulators (SLM) including ribbon-type modulators and drivers integrally fabricated in or on a common substrate are provided. Generally, the monolithic MEMS-based SLM includes a common electrode in or on a substrate, a number of electrostatically displaceable ribbons, each including a tensile, amorphous silicon-germanium layer (SiGe layer) that serves as a structural layer and as a ribbon electrode, and a light reflective surface on the SiGe layer facing away from the surface on the substrate. A driver including a plurality of drive channels monolithically integrated in the substrate below the surface, the driver electrically coupled to the common electrode and each ribbon electrode and operable to apply voltages thereto to drive the plurality of ribbons to modulate light reflected from the light reflective surfaces.

Disclosed is a MEMS mirror including a flat plate that is displaceable in a film thickness direction, a frame part that is separated from the flat plate and surrounds the flat plate, a support part that connects the flat plate and the frame part and is smaller in film thickness than the frame part, and a piezoelectric body for control that is arranged on the support part. A control voltage is applied to the piezoelectric body for control to deform the piezoelectric body for control and deform the support part together with the deformation of the piezoelectric body for control, to thereby adjust a spring constant of the support part.

A MEMS element is provided in which, a backplate including a fixed electrode and a vibrating membrane including a movable electrode are disposed facing each other; the vibrating membrane is provided with a pillar connected to the backplate, a pillar side slit and a peripheral portion side slit; and on the vibrating membrane vibrating portions and fixed electrode portions facing the vibrating portions are formed. A central portion of the vibrating membrane is connected to the backplate by the pillar, and thereby the amplitude of the central portion can be suppressed. In each of the vibrating portions, the pillar side slit is formed in the vicinity of a joint portion of the pillar and the vibrating membrane and a peripheral portion side silt is formed at the peripheral portion, and thereby a difference of the amplitude amount between the central portion and the peripheral portion is decreased.

The invention generally relates to drives for microelectromechanical acoustic pressure-generating device, which may be implemented in a microelectromechanical system (MEMS). In some embodiments of the invention, the microelectromechanical acoustic pressure-generating device is implemented in a chip/die, e.g. in form of a System-on-Chip (SoC) or a System-in-Package (SiP). Further embodiments of the invention relate to the use of such acoustic pressure-generating device in a microelectromechanical loudspeaker system, for example, headphones, hearing-aids, or the like. Embodiments of the invention relate to the miniaturization of the device. Some of the embodiments focus on countermeasures that reduce the pull-in force, which can facilitate further miniaturization of the microelectromechanical acoustic pressure-generating device.

Impedance paths for integrated circuits having microelectromechanical systems (MEMS) switches that allow for electrical charge to bleed from circuit nodes to fixed electric potentials (e.g., ground) are described. Such paths are referred to herein as charge bleed circuits. The circuit nodes may be circuit locations where electrical charge may accumulate because there is no other path for the electrical charge to dissipate. In some embodiments, a charge bleed circuit includes a switchable device (e.g., a MEMS switch, a solid-state device switch, or a circuit including various solid-state device switches that, collectively, implement a device that can be switched on and off) that connects and disconnects the impedance path from a circuit node. This may allow the device to perform different types of measurements at desired performance levels.

An ICE imaging system is disclosed, which comprises an Intracardiac echocardiography (ICE) catheter having a longitudinal axis, a proximal end, and a distal end. The ICE catheter corresponds to a micro-electromechanical (MEMS) or other transducer based phased array ultrasound catheter with an out diameter of 6 French or smaller for delivery through an internal jugular, subclavian, axillary, innominate venous system into heart chambers for the purpose of lead placement for a pacemaker or other implantable cardioverter defibrillator (ICD) device. Further, a catheter shaft houses an electronic flex cable which is in communication with at least one signal trace, and is configured to direct a plurality of transducer array elements to transmit and receive ultrasound beams, receive at least one signal from the plurality of transducer array elements, and construct at least one image of at least a portion of the heart based on the at least one signal.

A fluidic microelectromechanical system (MEMS) device includes fluid interaction elements (FIEs) that are configured to be monitored by a sensing device to generate an electrical signal in response to a fluid flow through the device. The FIEs include a serial arrangement of cantilevered lever arms to achieve increased sensitivity in a fluid flow sensor as compared to some conventional MEMS devices.