A microelectromechanical and/or nanoelectromechanical device having a fixed part, at least one suspended part configured to be moveable in the plane of the device with respect to the fixed part along at least one first direction and a first suspension means for suspending the suspended part. The first suspension means includes two suspension elements each having a first end fixed directly to the suspended part and a second end connected to the fixed part, each suspension element having a half-ellipse shape in the plane and extending between the first end and the second end, and the two suspension elements being arranged with respect to each other so as to form an ellipse.

An actuator system can be used to adjust a position of a component in a spatial light modulator. The actuator system has a pair of actuators that are coupled together by a frame that is used to adjust the height of the component relative to the substrate. The frame includes a pair of moment arms that are coupled to the actuators and a pair of connecting arms that are coupled to the moment arms. The connecting arms are then connected together at about the center of the frame, which portion of the frame can be used to raise or lower the plate. The center of the frame can be raised or lowered by a shortening or lengthening of the connecting arms relative to each other.

Described are transducer assemblies and imaging devices comprising: a microelectromechanical systems (MEMS) die including a plurality of piezoelectric elements; a complementary metal-oxide-semiconductor (CMOS) die electrically coupled to the MEMS die by a first plurality of bumps and including at least one circuit for controlling the plurality of piezoelectric elements; and a package secured to the CMOS die by an adhesive layer and electrically connected to the CMOS die.

Several types of piezoelectric MEMS vibration energy harvesters are described herein as well as methods of fabricating the vibration energy harvesters. The vibration energy harvesters generally comprise a serpentine structure having a central longitudinal axis; a piezoelectric film deposited on a surface of the serpentine structure; a central mass located at a mid-portion of the central longitudinal axis; two lateral masses positioned at opposing corners of the serpentine structure; anchor points at two other opposing corners of the serpentine structure; and upper and lower electrode layers. The energy harvesters have a 180 degree rotational symmetry about the central mass and when the serpentine structure experiences a strain, the piezoelectric film generates a voltage. The geometry of the energy harvesters allows for lower frequency and wider bandwidth operation as well as higher power density.

A transducer assembly includes: a microelectromechanical systems (MEMS) die including a plurality of piezoelectric elements; a complementary metal-oxide-semiconductor (CMOS) die electrically coupled to the MEMS die by a first plurality of bumps and including at least one circuit for controlling the plurality of piezoelectric elements; and a package secured to the CMOS die by an adhesive layer and electrically connected to the CMOS die.

A MEMS includes a substrate with a substrate extension that rises above a substrate plane. The MEMS includes a movable structural element, a first spring element that mechanically connects the movable structural element to the substrate extension, and a second spring element that mechanically connects the movable structural element to the substrate extension. The first spring element and the second spring element form a parallelogram guide of the movable structural element in relation to the substrate extension.

Controllable electromechanical adhesive devices including three-dimensional dielectrically-coated microstructures that are mechanically compliant are provided. The microstructures can be controlled to provide tunable electromechanical surface adhesion, allowing for dexterous gripping of microscale and/or macroscale objects. For example, the devices can tune the surface adhesion strength of one or more microstructures without complex mechanical actuation in a wide range of on/off ratios with low voltage. The devices can be configured as a force sensor capable of providing tactile feedback for determining the load applied against the microstructures by the surface of an object. For example, the devices can provide output indicative of changes in an electrical property of one or more microstructures for determining the applied load of an object. The devices can be pixelated or otherwise configured to provide localized force sensing and/or surface adhesion. Related systems and methods for controlling the disclosed electromechanical adhesive devices are also described.

A microphone assembly includes a substrate defining a port, a MEMS transducer, a guard ring, and a can. The MEMS transducer is coupled to the substrate such that the MEMS transducer is positioned over the port. The guard ring is coupled to the substrate and surrounds the MEMS transducer. The guard ring includes a plurality of edges that further includes a first edge and an opposing second edge. A portion of the first edge and a portion of the second edge have a reduced thickness relative to adjacent ones of the plurality of edges. The can is coupled to the guard ring such that the substrate and the can cooperatively define an interior cavity.

The invention generally relates to drives for microelectromechanical acoustic pressure-generating device, which may be implemented in a microelectromechanical system (MEMS). In some embodiments of the invention, the microelectromechanical acoustic pressure-generating device is implemented in a chip/die, e.g. in form of a System-on-Chip (SoC) or a System-in-Package (SiP). Further embodiments of the invention relate to the use of such acoustic pressure-generating device in a microelectromechanical loudspeaker system, for example, headphones, hearing-aids, or the like. Embodiments of the invention relate to the miniaturization of the device. Some of the embodiments focus on countermeasures that reduce the pull-in force, which can facilitate further miniaturization of the microelectromechanical acoustic pressure-generating device.

The present invention is related to a harvesting module for converting vibrations, in particular sound vibrations, into electric energy, comprising a substrate, having a surface for holding electronic components a plurality of parallel and/or serially connected transducers placed on the surface of the substrate, for receiving vibrations, in particular sound vibrations, and converting said vibrations into electric energy, a cover unit, positioned at least partially over the transducers, configured for passing on/transmit-ting/catching sound waves to the transducers, and blocking contaminants from the environment, such as dust or moisture, electric connector, for delivering the converted electric energy. The invention is further related to a harvesting device comprising said modules.