B81B2207/053

Use of Shear to Incorporate Tilt into the Microstructure of Reversible Gecko-Inspired Adhesives
20190211235 · 2019-07-11 ·

The present invention relates to an easy, scalable method, relying on conventional and unconventional techniques, to incorporate tilt in the fabrication of synthetic polymer-based dry adhesives mimicking the gecko adhesive system. These dry, reversible adhesives demonstrate anisotropic adhesion properties, providing strong adhesion and friction forces when actuated in the gripping direction and an initial repulsive normal force and negligible friction when actuated in the releasing direction.

MICROELECTROMECHANICAL AND/OR NANOELECTROMECHANICAL DEVICE OFFERING IMPROVED ROBUSTNESS

Microelectromechanical and/or nanoelectromechanical device comprising a fixed part (4), at least one suspended part (2) intended to be moveable in the plane of said device with respect to the fixed part (4) along at least one first direction (Y), a first means (6) for suspending said suspended part (2), said first suspension means (6) comprising two suspension elements (8.1, 8.2) each suspension element (8.1, 8.2) comprising a first end fixed directly to the suspended part (2) and a second end connected to the fixed part (4), each suspension element (8.1, 8.2) having a half-ellipse shape in the plane and extending between the first end and the second end, the two suspension elements (8.1, 8.2) being arranged with respect to each other so as to form an ellipse.

Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)

In embodiments, a package assembly may include an application-specific integrated circuit (ASIC) and a microelectromechanical system (MEMS) having an active side and an inactive side. In embodiments, the MEMS may be coupled directly to the ASIC by way of one or more interconnects. The MEMS, ASIC, and one or more interconnects may define or form a cavity such that the active portion of the MEMS is within the cavity. In some embodiments, the package assembly may include a plurality of MEMS coupled directly to the ASIC by way of a plurality of one or more interconnects. Other embodiments may be described and/or claimed.

MEMS ELEMENTS ON NON-PLANAR SURFACE

A Micro Electrical Mechanical Systems (MEMS) article including a non-planar surface and a continuous film conforming to the non-planar surface is described. The continuous film includes a polymer layer disposed between two metal layers and is patterned to define one or more MEMS elements.

System with an increased surface density of microelectromechanical or nanoelectromechanical devices

A nanoelectronic system comprised of n microelectromechanical or nanoelectromechanical devices arranged on a connection support to electrically connect the n devices, each device with an interaction area, at least one mechanical anchor and a first terminal, a second terminal and a third terminal, the relative arrangement of the first, second and third terminals, the anchor area and the interaction area being identical or similar for the n sensors, the first terminal of each device being intended to recover a signal emitted by each representative device of the interaction area state. At least part of the devices are arranged in such a way that the geometric location of the first terminal of one of the adjacent devices is identical to the geometric location of the first terminal of said other adjacent device, the first terminals being coincident.

Use of shear to incorporate tilt into the microstructure of reversible gecko-inspired adhesives

The present invention relates to an easy, scalable method, relying on conventional and unconventional techniques, to incorporate tilt in the fabrication of synthetic polymer-based dry adhesives mimicking the gecko adhesive system. These dry, reversible adhesives demonstrate anisotropic adhesion properties, providing strong adhesion and friction forces when actuated in the gripping direction and an initial repulsive normal force and negligible friction when actuated in the releasing direction.

Transducer array subdicing
10233076 · 2019-03-19 · ·

Systems and techniques are provided for transducer array subdicing. A laminate material may include two laminate material flexures which each have a flexure boundary defined by a gap in the piece of laminate material. A trench may be located between the two flexures. The trench may be defined by a removal of a portion of laminate material from the piece of laminate material. A second trench may be on an opposite surface of the piece of laminate material from the trench. The second trench may be partially aligned with the trench. The trench and the second trench may result from the removal of laminate material from the piece of laminate material to a depth of 20% to 60% of the thickness of the piece of laminate material.

MEMS devices on flexible substrate

A flexible film including one or more MEMS elements and articles including the flexible film are described. The flexible film includes a polymer layer between two metal layers with one of the metal layers containing a perforation. The polymer layer includes voided regions that allow for relative movement of the two metal layers.

Actuator systems and methods
10167933 · 2019-01-01 ·

An actuator system can be used to adjust a position of a component in a spatial light modulator. The actuator system has a pair of actuators that are coupled together by a frame that is used to adjust the height of the component relative to the substrate. The frame includes a pair of moment arms that are coupled to the actuators and a pair of connecting arms that are coupled to the moment arms. The connecting arms are then connected together at about the center of the frame, which portion of the frame can be used to raise or lower the plate. The center of the frame can be raised or lowered by a shortening or lengthening of the connecting arms relative to each other.

Micro-acoustic wafer-level package and method of manufacture

A wafer-level package for micro-acoustic devices and a method of manufacture is provided. The package comprises a base wafer with electric device structures. A frame structure is sitting on top of the base wafer enclosing particular device areas for the micro-acoustic devices. A cap wafer provided with a thin polymer coating is bonded to the frame structure to form a closed cavity over each device area and to enclose within the cavity the device structures arranged on the respective device area.