Aspects include methods of fabricating antibacterial surfaces for medical implant devices including patterning a photoresist layer on a silicon substrate and etching the silicon to generate a plurality of nanopillars. Aspects also include removing the photoresist layer from the structure and coating the plurality of nanopillars with a biocompatible film. Aspects also include a system for preventing bacterial infection associated with medical implants including a thin silicon film including a plurality of nanopillars.

Aspects include methods of fabricating antibacterial surfaces for medical implant devices including patterning a photoresist layer on a silicon substrate and etching the silicon to generate a plurality of nanopillars. Aspects also include removing the photoresist layer from the structure and coating the plurality of nanopillars with a biocompatible film. Aspects also include a system for preventing bacterial infection associated with medical implants including a thin silicon film including a plurality of nanopillars.

The present techniques relate to various aspects of forming and filling high-aspect ratio trench structures (e.g., trench structures having an aspect ratio of 20 or greater, including aspect ratios in the range of 20:1 up to and including 50:1 or greater) combined with trench opening widths ranging from 0.5 micron to 50 microns. By way of example, patterned substrate described herein includes a substrate, a mask layer deposited on the substrate, and a photoresist layer deposited on the mask layer. The photoresist layer is patterned to form a pattern and the mask layer is etched through the pattern to expose the substrate. The substrate is etched through the pattern to form a structure comprising a plurality of trenches having vertical sidewall. The photoresist layer remains on the mask layer during etching of the substrate.

Provided are systems and methods for the post-treatment of dry adhesive microstructures. The microstructures may be post-treated to comprise mushroom-like flaps at their tips to interface with the contact surface. In some aspects, a change in material composition of the microstructures in a dry adhesive may affect mechanical properties to enhance or diminish overall adhesive performance. For example, conductive additives can be added to the material to improve adhesive performance. In other aspects, microstructures comprising conductive material may allow for pre-load engagement sensing systems to be integrated into the microstructures.

A method for forming reliefs on a face of a substrate is provided, successively including forming a protective screen for protecting at least a first zone of the face; an implanting to introduce at least one species comprising carbon into the substrate from the face of the substrate, the forming of the protective screen and the implanting being configured to form, in the substrate, at least one carbon modified layer having a concentration of implanted carbon greater than or equal to an etching threshold only from a second zone of the face of the substrate not protected by the protective screen; removing the protective screen; and etching the substrate from the first zone selectively with respect to the second zone.

A system and method for manipulating the structural characteristics of a MEMS device include etching a plurality of holes into the surface of a MEMS device, wherein the plurality of holes comprise one or more geometric shapes determined to provide specific structural characteristics desired in the MEMS device.

Embodiments described herein include an antimicrobial substrate surface. An example embodiment includes a structure that includes an antimicrobial surface on a substrate. The antimicrobial surface includes a plurality of nanostructures. Each nanostructure includes a nanopillar on the substrate. The nanopillar has a height. Each nanostructure also includes a head covering a distal end and at least part of the height of the nanopillar.

A fabrication method includes: (1) forming a wire array on a fabrication substrate; (2) forming a porous layer within a portion of the fabrication substrate below the wire array; (3) separating the porous layer and the wire array from a remaining portion of the fabrication substrate; and (4) affixing top ends of the wire array to a target substrate.

Dry adhesive microstructures may be post-treated to comprise mushroom-like flaps at their tips to interface with the contact surface. In some aspects, a change in material composition of the microstructures in a dry adhesive may affect mechanical properties to enhance or diminish overall adhesive performance. For example, conductive additives can be added to the material to improve adhesive performance. In other aspects, microstructures comprising conductive material may allow for pre-load engagement sensing systems to be integrated into the microstructures.

A method for manufacturing a micromechanical component is provided including a substrate and including a cap, which is connected to the substrate and, together with the substrate, encloses a first cavity, a first pressure prevailing and a first gas mixture having a first chemical composition being enclosed in the first cavity, the cap together with the substrate enclosing a second cavity, a second pressure prevailing and a second gas mixture having a second chemical composition being enclosed in the second cavity. A recess situated essentially between the first cavity and the second cavity is formed for diverting at least one first particle type of the first gas mixture and/or at least one second particle type of the second gas mixture.