A semiconductor package includes a semiconductor die having a sensor structure disposed at a first side of the semiconductor die, and a first port extending through the semiconductor die from the first side to a second side of the semiconductor die opposite the first side, so as to provide a link to the outside environment. Corresponding methods of manufacture are also provided.

The application describes a package design for a MEMS transducer having an integrated circuit mounted within a chamber of the package. The integrated circuit may extend into a side wall recess of the package.

The present disclosure is directed to a microfluidic die that includes ejection circuitry and one time programmable memory with a minimal number of contact pads to external devices. The die includes a relatively large number of nozzles and a relatively small number of contact pads. The die includes decoding circuitry that utilizes the small number of contact pads to control the drive and ejection of the nozzles and the reading/writing of the memory with the same contact pads.

The present disclosure is directed to a microfluidic die that includes ejection circuitry and one time programmable memory with a minimal number of contact pads to external devices. The die includes a relatively large number of nozzles and a relatively small number of contact pads. The die includes decoding circuitry that utilizes the small number of contact pads to control the drive and ejection of the nozzles and the reading/writing of the memory with the same contact pads.

A MEMS device is provided with an actuator stator providing an electrical connection point. The MEMS device includes an electrical distribution substrate, and an actuator stator positioned above it. The actuator stator has a floor and an outer frame extending up from the floor. The MEMS device includes a stator pad disposed on the outer frame and above the electrical distribution substrate. The MEMS device also includes an actuator rotor suspended above the floor, within the outer frame, with a sensor mounted thereon. A wire bond interconnect electrically couples the sensor to the stator pad. In some embodiments, the outer frame includes a via extending therethrough which electrically connects the stator pad with the electrical distribution substrate, enabling an electrical connection between the sensor and the electrical distribution substrate. In some embodiments, a second wire bond interconnect electrically connects the stator pad and the substrate.

A method for fabricating a micro-electronics H-frame device is provided by micro-machining a top cover usable in the device, and micro-machining a bottom cover usable in the device. The method includes fabricating together on a front of a wafer a top surface of a top substrate, the top substrate usable in the device, and a bottom surface of a bottom substrate, the bottom substrate usable in the device, wherein the top surface of the top substrate comprises top substrate top metallization, and wherein the bottom surface of the bottom substrate comprises bottom surface bottom metallization. In addition, fabricating mid-substrate metallization, bonding the top substrate to the top cover, and bonding the bottom substrate to the bottom cover are performed. The top substrate is bonded to a top surface of the mid-substrate metallization and bonding the bottom substrate to a bottom surface of the mid-substrate metallization, thereby creating a vertical electrical connection between the top substrate and the bottom substrate.

Disclosed a micro-differential pressure sensor, a package structure, a test method, and an electronic device. The micro-differential pressure sensor comprises a MEMS chip, the MEMS chip comprises a substrate, a diaphragm, and a back-pole plate set in a laminated manner, the substrate having a back cavity which passes through in the thickness direction thereof, the back-pole plate comprises a first electrode region and a second electrode region isolated from each other, the first electrode region forming a first electrode, the second electrode region forming a second electrode, and the diaphragm forming a third electrode, the first electrode and the third electrode form a first capacitor, the second electrode and the third electrode form a second capacitor.