A microphone and a method for producing a microphone are disclosed. The microphone includes a substrate, a spring element plastically elongated in a direction perpendicular to the substrate, a transducer element in electrical contact with the substrate by way of the spring element and a cover to which the transducer element is fastened, the cover is arranged in such a way that the transducer element is arranged between the cover and the substrate.

A method of manufacturing and assembling a sandwich flexure mechanism assembly is set forth herein. The method involves manufacture of a monolithic sandwich flexure module having a multitude of out of plane rigid inter-stage connections between at least some sets of twin stages of the monolithic sandwich flexure module. The method further involves assembling an interconnect subassembly to intermediate bodies of the monolithic sandwich flexure module. The interconnect subassembly furnishing in-plane rigid inter-stage connections between pairs of the intermediate bodies that constitute sister stages of the monolithic sandwich flexure module. The method can further involve assembling a motion body, actuators, and displacement sensors at the monolithic sandwich flexure module.

A radio frequency micro-electromechanical switch (RF MEMS switch) is described. Also described is a method of producing such an RF MEMS switch. The method can include depositing on a substrate a first sacrificial layer and producing a pattern. A first layer of metal is deposited on the first sacrificial layer and on the substrate. A pattern is produced to form a first RF line and a first MEMS membrane. A second sacrificial layer is deposited on the first RF line and a pattern is produced. A dielectric layer is deposited on the second sacrificial layer and then a pattern is produced to form a dome. The first and second sacrificial layers are removed through a dome opening. A second metal layer is deposited on the dome and on the substrate, and then a pattern is produced to plug the dome opening(s) and to form a second RF line.

Complementary metal oxide semiconductor (CMOS) ultrasonic transducers (CUTs) and methods for forming CUTs are described. The CUTs may include monolithically integrated ultrasonic transducers and integrated circuits for operating in connection with the transducers. The CUTs may be used in ultrasound devices such as ultrasound imaging devices and/or high intensity focused ultrasound (HIFU) devices.

An ultrasonic sensor has a capacitance micromachined ultrasonic transducer (CMUT) with three metal layers and four insulating layers. A first metal layer receives a reference voltage, a second metal layer receives a direct current voltage, and a third metal layer receives an alternating current voltage. A cavity formed between the first metal layer and the second metal layer allows for mechanical vibration of the CMUT, which generates ultrasonic waves.

A capacitive pressure sensor is provided. The capacitive pressure sensor includes a substrate; and a first electrode formed in one surface of the substrate and vertical to the surface of the substrate. The capacitive pressure sensor also includes a second electrode with a portion facing the first sub-electrode, a portion facing the second sub-electrode and a portion formed in the other surface of the substrate. Further, the capacitive pressure sensor includes a first chamber between the first electrode and the second electrode and a second chamber formed in the second electrode. Further, the pressure sensor also includes a first sealing layer formed on the second electrode; and a second sealing layer formed on the other surface of the substrate.

Provided is a method of manufacturing a stretchable substrate according to various embodiments of the present disclosure in order to implement the above-described objects. The method may include forming an auxetic including a plurality of unit structures and forming one or more microstructures.

A method of making an acoustic sensor (e.g., for use in a piezoelectric MEMS microphone) includes forming or providing a mold having one or more grooves in a top surface of the mold that extend in a direction of the length of the mold to a distal end of the mold. The method also includes forming or depositing a structure having one or more piezoelectric layers over the top surface of the mold to define a beam, the distal portion of the beam having a corrugated section including one or more grooves that correspond to the grooves of the mold. The method also includes forming a gap in the structure to define two beams separated by the gap, and releasing the structure from the mold to form one or more cantilever beams that increases an acoustic resistance of the gap between sensors.

A method of manufacturing and assembling a sandwich flexure mechanism assembly is set forth herein. The method involves manufacture of a monolithic sandwich flexure module having a multitude of out of plane rigid inter-stage connections between at least some sets of twin stages of the monolithic sandwich flexure module. The method further involves assembling an interconnect subassembly to intermediate bodies of the monolithic sandwich flexure module. The interconnect subassembly furnishing in-plane rigid inter-stage connections between pairs of the intermediate bodies that constitute sister stages of the monolithic sandwich flexure module. The method can further involve assembling a motion body, actuators, and displacement sensors at the monolithic sandwich flexure module.