A nanostructure includes a base layer including a surface. The nanostructure further includes nano-patterned features including non-random topography located on the surface of the base layer. The nanostructure also includes an encapsulating layer including a conductive material arranged on the nano-patterned features.

A method for processing a silicon substrate includes forming a structure having a bottom surface and a depth of 200 m or more or 300 m or more from a first surface of a silicon substrate, forming a protective film on an inner wall of the structure, and performing plasma etching so as to selectively remove the protective film disposed on the bottom surface of the structure with respect to the protective film disposed on the substantially perpendicular side wall of the structure, wherein the plasma etching is performed under the condition in which plasma with a sheath length at least 10 times the depth when the depth is 200 m or more, or at least 5 time the depth when the depth is 300 m or more, is generated and a mean free path of ions generated in the plasma is longer than the sheath length.

Active superhydrophobic surface structures are actively-controlled surface structures exhibiting a superhydrophobic state and an ordinary state. Active superhydrophobic surface structures comprise an outer elastomeric covering defining an exposed surface, a controlled group of MEMS (micro-electro-mechanical system) actuators at least covered by the elastomeric covering, and, a controlled region of the exposed surface corresponding to the controlled group. The controlled region has a superhydrophobic state in which the controlled region is textured. The controlled region also has an ordinary state in which the controlled region is smooth (i.e., less textured than in the superhydrophobic state). Active superhydrophobic surface structures may be part of an apparatus that includes a controller and/or one or more sensors. The controller, sensors, and the controlled region may form a feedback loop in which the active superhydrophobic surface is actively controlled.

A photo-patterned fluorocarbon monolayer directly grafted to Si surface atoms provides anti-wetting performance at controlled locations, wherein the Si surface oxide is etched and reacted with fluorocarbon chains with a terminal CC double bond, resulting in SiC surface. As the direct SiC linkages are chemically robust, and much more resistant to decomposition than SiOC bonds, the resulting surface does not suffer from the shortcomings of current MEMS dispensers.

Embodiments described herein include an antimicrobial substrate surface. An example embodiment includes a structure that includes an antimicrobial surface on a substrate. The antimicrobial surface includes a plurality of nanostructures. Each nanostructure includes a nanopillar on the substrate. The nanopillar has a height. Each nanostructure also includes a head covering a distal end and at least part of the height of the nanopillar.

A nanotweezer comprises a first metastructure including a first substrate, a first electrode, and a plurality of plasmonic nanostructures; a second metastructure including a second substrate and a second electrode, wherein the second substrate and the second electrode are substantially transparent to light within a wavelength range; a microfluidic channel between the first metastructure and the second metastructure; a voltage source configured to selectively apply an electric field between the first electrode and the second electrode a light source configured to selectively apply an excitation light to the microfluidic channel, the excitation light having a wavelength within the wavelength range. In response to the selective application of the electric field and/or the excitation light, nanoparticles within the microfluidic channel are manipulated.

Disclosed herein are processes and devices for use in the electrochemical detection of a target in a sample. For example, silicon or glass surfaces are treated with silanes functionalized with various side chains to tune the surface wetting characteristics.

A platform structure for manufacturing a scaffold for use in tissue engineering, comprising a frame; a ring-shaped thermally conductive member fixedly disposed in the frame; a thermally conductive platform centrally movably disposed in the ring-shaped thermally conductive member and having edges in direct contact with inner walls of the ring-shaped thermally conductive member, wherein the thermally conductive platform and the ring-shaped thermally conductive member together define a space of a variable depth; a vertically movable mechanism connected to a bottom of the thermally conductive platform and adapted to drive the thermally conductive platform to sink and thus increase gradually the depth of the space; and a low temperature generating mechanism connected to the ring-shaped thermally conductive member and the thermally conductive platform to cool down the ring-shaped thermally conductive member and the thermally conductive platform, to prevent deformation and ensure uniform dimensions of tall scaffolds.

In biosciences and related fields, it can be useful to modify surfaces of apparatuses, devices, and materials that contact biomaterials such as biomolecules and biological micro-objects. Described herein are surface modifying and surface functionalizing reagents, preparation thereof, and methods for modifying surfaces to provide improved or altered performance with biomaterials.

A master tool is provided with an ink pattern on a major surface thereof. The ink pattern is formed by a screen printing process. A stamp-making material is applied to the major surface of the master tool to form a stamp having a stamping pattern being negative to the ink pattern of the master tool. The stamping pattern is inked with an ink composition and contacted with a metalized surface to form a printed pattern on a metalized surface of a substrate according to the stamping pattern. Using the printed pattern as an etching mask, the metalized surface is etched to form electrically conductive traces on the substrate.