Methods for forming an electrode structure, which can be used as a biosensor, are provided in which the electrode structure has non-random topography located on one surface of an electrode base. In some embodiments, an electrode structure is obtained that contains no interface between the non-random topography of the electrode structure and the electrode base of the electrode structure. In other embodiments, electrode structures are obtained that have an interface between the non-random topography of the electrode structure and the electrode base of the electrode structure.

A process and a transfer film for transferring microstructures to a flexible or rigid final substrate that offers advantages in both speed and precision is provided. The inventive process involves subjecting a transfer film in a continuous roll-to-roll process to the following operations: either forming microstructures on, or transferring microstructures to a surface of the transfer film; and then transferring the microstructures from the transfer film onto a surface of the final substrate. The microstructures are single or multi-layer structures that are made up of: voids in a substantially planar surface, the voids optionally filled or coated with another material; raised areas in a substantially planar surface; or combinations thereof.

The invention relates to a surface treatment method for treating the inner walls of a microchannel made from a polymeric material that is at least partially photocured or thermoset. Said treatment is carried out via irradiation in the air at a wavelength of less than or equal to 300 nm. The invention also relates to a method for manufacturing a microfluidic device including such a surface treatment step.

Methods for forming an electrode structure, which can be used as a biosensor, are provided in which the electrode structure has non-random topography located on one surface of an electrode base. In some embodiments, an electrode structure is obtained that contains no interface between the non-random topography of the electrode structure and the electrode base of the electrode structure. In other embodiments, electrode structures are obtained that have an interface between the non-random topography of the electrode structure and the electrode base of the electrode structure.

The present application relates to multifunctional hierarchically microstructured surfaces and three-dimensional anchored interfacial domain structures. The multifunctional properties are extremal. In one aspect the microstructured surfaces may be super-adhesive. Examples of super-adhesive mechanisms may include gas trapping, fluid trapping, and solid wrinkle trapping. In another aspect the micro structured surfaces may be nearly adhesive-less. Examples of adhesive-less mechanisms may include inter-solid surface lubrication, energy conserving fluid flows, and super-low drag phase-phase lateral displacement. The extremal structures may be obtained by anchoring mechanisms. Examples of anchoring mechanisms may include Wenzel-Cassie formation, contact angle confusion, and capillary effects.

Provided are systems and methods for the post-treatment of dry adhesive microstructures. The microstructures may be post-treated to comprise mushroom-like flaps at their tips to interface with the contact surface. In some aspects, a change in material composition of the microstructures in a dry adhesive may affect mechanical properties to enhance or diminish overall adhesive performance. For example, conductive additives can be added to the material to improve adhesive performance. In other aspects, microstructures comprising conductive material may allow for pre-load engagement sensing systems to be integrated into the microstructures.

A biosensor package structure is provided. The biosensor package structure includes a protection layer and a redistribution layer disposed over the protection layer. The protection layer has a plurality of openings exposing the redistribution layer. The biosensor package structure includes at least one die disposed over the protection layer and the redistribution layer, a plurality of pads disposed on a lower surface of the die, and a plurality of vias disposed between the pads and the redistribution layer. The biosensor package structure includes a dielectric material disposed over the protection layer and the redistribution layer and adjacent to the die, pads and vias. The biosensor package structure further includes at least one biosensing region at the top portion of the die. The top surfaces of the pads are disposed at a level that is lower than the top surface of the biosensing region and higher than the bottom surface of the die.

A microfabricated device having at least one gas-entrapping feature formed therein in a configuration that entraps air bubbles upon wetting the feature with a solvent or solution is described. The device includes a sacrificial residue in contact with the gas-entrapping feature, the dissolution of which guides the wetting of the gas-entrapping feature.

A substrate for sensing, a method of manufacturing the substrate, and an analyzing apparatus including the substrate are provided. The substrate for sensing includes: a support layer; a plurality of metal nanoparticle clusters arranged on the support layer; and a plurality of perforations arranged among the plurality of metal nanoparticle clusters. The plurality of metal nanoparticle clusters each comprise a plurality of metal nanoparticles stacked in a three-dimensional structure. Each of the plurality of perforations transmits incident light therethrough.

An activated textured surface comprising a plurality of energetic moieties adapted to bind biomolecules on microfeatures and/or microstructures of the activated textured surface. The microfeatures and/or microstructures provide an increase in surface area. The activated textured surface may comprise microstructures without microfeatures, or in some cases, microstructures are disposed in and/or between at least a portion of the microfeatures. The activated textured surface may be a part of a microarray substrate. Activation of the surface molecules of the microfeatures and/or microstructures using electromagnetic radiation or plasma may be used to create the energetic moieties on the activated textured surface.