A compound sensor includes a package, a first acceleration detector, a second acceleration detector, and an angular velocity detector. The first acceleration detector is disposed in a first cavity. The second acceleration detector is disposed in a second cavity. The angular velocity detector is disposed in a third cavity. An inner pressure of the first cavity is higher than an inner pressure of the second cavity. An inner pressure of the third cavity is lower than the inner pressure of the second cavity.

A MEMS micro-mirror assembly (250, 300, 270, 400) comprising, a MEMS device (240) which comprises a MEMS die (241) and a magnet (231); a flexible PCB board (205) to which the MEMS device (240) is mechanically, and electrically, connected; wherein the flexible PCB board (205) further comprises a first extension portion (205b) which comprises a least one electrical contact (259a,b) which is useable to electrically connect the MEMS micro-mirror assembly (250, 300, 270, 400) to another electrical component). There is further provided a projection system comprising such a MEMS micro-mirror assembly (250, 300, 270, 400).

A silicon wafer includes a plurality of chip patterns arranged parallel to a first direction and a second direction intersecting the first direction, wherein the plurality of chip patterns include one or more patterns arranged in the first direction and the second direction in a straight line, the plurality of chip patterns include a first chip pattern and a second chip pattern adjacent to the first chip pattern, and the second chip pattern is arranged by rotating the first chip pattern at 90 degrees, the plurality of chip patterns are arranged so that an axis in which a cleavage plane of the silicon wafer and a surface arranged with the pattern on the silicon wafer intersect, and the first direction are different, and an angle between the axis and the first direction of the second chip pattern is 90 degrees.

The invention relates to a MEMS package comprising a package substrate and at least one MEMS element. The at least one MEMS element comprises a MEMS interaction region and is embedded in the package substrate in such a way that at least the MEMS interaction region remains free. The MEMS package is characterized in that one or more antennas for transmitting and/or receiving electromagnetic signals are present on or in the package substrate, wherein the package substrate functions as an antenna substrate for the one or more antennas.

The invention also relates to a method for producing the MEMS package according to the invention. For this purpose, the package substrate and/or conductor tracks are first provided by an additive manufacturing process, preferably by a multi-material additive manufacturing process. The at least one MEMS element is then at least partially embedded in the package substrate such that at least the MEMS interaction region remains free. Furthermore, the one or more antennas are mounted on or in the package substrate.

A semiconductor device and method of forming such a device includes a MEMS component including one or more MEMS pixels and having a MEMS membrane substrate and a MEMS sidewall. The semiconductor device includes an analog circuit component bonded to the MEMS component, and which includes at least one analog CMOS component within an analog circuit insulative layer, and an analog circuit component substrate. The semiconductor device includes an HPC component bonded to the analog circuit component substrate. The HPC component includes at least one HPC metal component disposed within an HPC insulative layer, at least one bond pad, at least one bond pad via connecting the at least one bond pad and the at least one HPC metal component, and an HPC substrate. Additionally, the semiconductor device includes a DTC component bonded to the HPC substrate, and which includes a DTC die disposed in a DTC substrate.

A semiconductor device and method of forming such a device includes a MEMS component including one or more MEMS pixels and having a MEMS membrane substrate and a MEMS sidewall. The semiconductor device includes an analog circuit component bonded to the MEMS component, and which includes at least one analog CMOS component within an analog circuit insulative layer, and an analog circuit component substrate. The semiconductor device includes an HPC component bonded to the analog circuit component substrate. The HPC component includes at least one HPC metal component disposed within an HPC insulative layer, at least one bond pad, at least one bond pad via connecting the at least one bond pad and the at least one HPC metal component, and an HPC substrate. Additionally, the semiconductor device includes a DTC component bonded to the HPC substrate, and which includes a DTC die disposed in a DTC substrate.

Methods, systems, and techniques for the high speed manufacture of micro-electrical mechanical systems (MEMS) arrays, such as arrays of polymeric capacitive micromachined ultrasonic transducers (CMUTs). A sheet of material from which to form cavities for the devices is obtained, and physical or energy projections are projected into the material to form the cavities. Upper and lower surfaces of the material are respectively contacted with and bonded to upper and lower metalized films. The metalized portions of the upper and lower metalized films may serve as electrodes for a CMUT, and the films themselves may be the CMUT's substrate and membrane.

Multi-cell piston motion membrane microelectromechanical systems (MEMS) apparatuses and processes are described. Described MEMS sensors or devices can comprise a patterned piston motion membrane array wherein each cell of the patterned piston motion membrane array is connected to at least one other cell of the patterned piston motion membrane array. In addition, MEMS sensors or devices can comprise a patterned transduction membrane array wherein each cell of the patterned transduction membrane array is fixed in position near its periphery relative to a fixed electrode structure via anchor structures or a transduction membrane stiffener. Further design flexibility and improvements are described that provide efficient MEMS sensor die usage, high SNR, and high resonance frequency for described MEMS sensors or devices.