A method for treating a micro electro-mechanical system (MEMS) component is disclosed. In one example, the method includes the steps of providing a first wafer, treating the first wafer to form cavities and at least an oxide layer on a top surface of the first wafer using a first chemical vapor deposition (CVD) process, providing a second wafer, bonding the second wafer on a top surface of the at least one oxide layer, treating the second wafer to form a first plurality of structures, depositing a layer of Self-Assembling Monolayer (SAM) to a surface of the MEMS component using a second CVD process.

A micromechanical sensor system includes a micromechanical sensor chip surrounded at least laterally by a molded housing which has a front side and a rear side. The micromechanical sensor chip includes a chip area on the rear side, which is omitted from the molded housing, and a rewiring device formed on the rear side, which, starting from the chip area, extends to the surrounding molded housing on the rear side, and from there, past at least one via from the rear side to the front side of the molded housing.

A method of making microstructures having re-entrant or doubly re-entrant topology includes forming a mold defining the negative surface features of the re-entrant or doubly re-entrant topology that is to be formed. In one embodiment, a soft or flowable material is formed on a first substrate and the mold is contacted with the same to form a solid, now positive surface having the re-entrant or doubly re-entrant topology. The mold is then released from the first substrate. The microstructures are secured to a second, different substrate, and the first substrate is removed. Any residual microstructure material located between adjacent microstructures may be removed to form the separate microstructures on the second substrate. The second substrate may be thin and flexible any manipulated into useful or desired shapes having the microstructures on one side thereof.

A MEM vibration sensor includes a substrate including a first supporting-portion and a cavity and a sensing-device disposed on the substrate. The sensing-device includes a second supporting-portion correspondingly disposed over and connected with the first supporting-portion, a first sensing-unit disposed on the cavity, a first mass-block disposed on the cavity, a second sensing-unit disposed on the first sensing-unit and the first mass-block, a first metal pad disposed on the third supporting-portion and electrically coupled with the first sensing-unit, and a second metal pad disposed on the third supporting-portion and electrically coupled with the second sensing-unit.

The present invention relates to methods for designing and creating surface microstructures and includes 3D scanning of existing surface microstructures as well as transferring processed data of the scanned microstructures to a material using a proper writing tool. Surface microstructures created with the methods of the invention have a wide field of applications, such as for security features in optical security elements, alignment layers for liquid crystals, antireflection surfaces, AR/VR applications, optical filters, light coupling, micro-optics, as well as for light management in many different technical areas.

Additive manufacturing using bonding of voxels and related systems, devices, and articles are generally described. Certain embodiments are related to additive manufacturing with microscale resolution using solid-state kinetic bonding of microparticles or microfabricated thin-film voxels.

An only inkjet-printing-based process for depositing functional materials, in various instances PZT, Bi-based material or (K,Na)-based material, on a substrate, in various instances platinized silicon. Substrate templating (via SAMs) and material deposition are both performed by an inkjet printing process. Additionally, a composition to be used as a SAM precursor ink which is a thiol in a solvent mixture. Further, a cartridge for a printing machine with such a composition. Still further, the use of such a cartridge, alone, or as a kit with another cartridge containing a precursor of the functional material, in particular to perform both steps of the printing method. Finally, a product, for instance a microsystem, obtained by the process.

A strain sensor utilizes an ohmic-based contact switch to detect strain. The sensor can be incorporated into other structures, such as an artificial flapping wing, to detect strain and other parameters, including air flow disturbances. The sensors are fabricated using an additive manufacturing process, with a layer of gold or other conductive material applied for electrical conductivity and UV laser ablation for electrical isolation. The sensor design incorporates mechanical amplification, converting small strains into larger displacements that close contact pads, resulting in an ohmic switch activated at a specific strain threshold. Unlike traditional sensors, the switch provides a high or low state output directly without the need for additional amplification or post-processing. The device can detect disturbances in flapping wing cycles and obtain yaw rotation information, with potential applications in other aircraft for disturbance detection.

Methods of and devices for manufacturing a multi-layered microfluidic filter are disclosed. In one embodiment, method of manufacturing a multi-layered filter comprises providing a first molding plate that includes a plurality of apertures and is coupled to a flow stream source, applying from the flow stream source a first flow stream to pass through the plurality of apertures of the first molding plate, forming a first membrane layer comprising a first set of pores using the first molding plate and the first flow stream, controlling the first flow stream to generate a second flow stream from the first set of pores of the first membrane layer, and forming a second membrane layer comprising a second set of pores using the second flow stream and the first membrane layer.

A system and method for a micro-electrical-mechanical system (MEMS) device including a substrate and a free-standing and suspended electroplated metal MEMS structure formed on the substrate. The free-standing and suspended electroplated metal MEMS structure includes a metal mechanical element mechanically coupled to the substrate and a seed layer mechanically coupled to and in electrical communication with the mechanical element, the seed layer comprising at least one of a refractory metal and a refractory metal alloy, wherein a thickness of the mechanical element is substantially greater than a thickness of the seed layer such that the mechanical and electrical properties of the free-standing and suspended electroplated metal MEMS structure are defined by the material properties of the mechanical element.