In a method of printing a transferable component, a stamp including an elastomeric post having three-dimensional relief features protruding from a surface thereof is pressed against a component on a donor substrate with a first pressure that is sufficient to mechanically deform the relief features and a region of the post between the relief features to contact the component over a first contact area. The stamp is retracted from the donor substrate such that the component is adhered to the stamp. The stamp including the component adhered thereto is pressed against a receiving substrate with a second pressure that is less than the first pressure to contact the component over a second contact area that is smaller than the first contact area. The stamp is then retracted from the receiving substrate to delaminate the component from the stamp and print the component onto the receiving substrate. Related apparatus and stamps are also discussed.

A micro-electromechanical device and method of manufacture are disclosed. A sacrificial layer is formed on a silicon substrate. A metal layer is formed on a top surface of the sacrificial layer. Soft magnetic material is electrolessly deposited on the metal layer to manufacture the micro-electromechanical device. The sacrificial layer is removed to produce a metal beam separated from the silicon substrate by a space.

A system and method for a micro-electrical-mechanical system (MEMS) device including a substrate and a free-standing and suspended electroplated metal MEMS structure formed on the substrate. The free-standing and suspended electroplated metal MEMS structure includes a metal mechanical element mechanically coupled to the substrate and a seed layer mechanically coupled to and in electrical communication with the mechanical element, the seed layer comprising at least one of a refractory metal and a refractory metal alloy, wherein a thickness of the mechanical element is substantially greater than a thickness of the seed layer such that the mechanical and electrical properties of the free-standing and suspended electroplated metal MEMS structure are defined by the material properties of the mechanical element.

Embodiments of the present invention provide systems and methods for depositing materials on either side of a freestanding film using laser-assisted chemical vapor deposition (LA-CVD), and structures formed using same. A freestanding film, which is suspended over a cavity defined in a substrate, is exposed to a fluidic CVD precursor that reacts to form a solid material when exposed to light and/or heat. The freestanding film is then exposed to a laser beam in the presence of the precursor. The CVD precursor preferentially deposits on the surface(s) of the freestanding film.

A method creates MEMS structures by selectively etching a silicon wafer that is patterned by using a masking layer. The method comprises depositing and patterning a first mask on a silicon wafer to define desired first areas on the wafer to be etched. First trenches are etched on parts of the wafer not covered by the first mask. The first trenches are filled with a deposit layer. A part of the deposit layer is removed on desired second areas to be etched and a remainder is left on areas to function as a second mask to define final structures. Parts of the wafer on the desired second areas is etched, and the second mask is removed. A gyroscope or accelerator can be manufactured by dimensioning the structures.

Methods, devices and systems for patterning of substrates using charged particle beams without photomasks and without a resist layer. Material can be deposited onto a substrate, as directed by a design layout database, localized to positions targeted by multiple, matched charged particle beam columns. Reducing the number of process steps, and eliminating lithography steps, in localized material addition has the dual benefit of reducing manufacturing cycle time and increasing yield by lowering the probability of defect introduction. Furthermore, highly localized, precision material deposition allows for controlled variation of deposition rate and enables creation of 3D structures. Local gas injectors and detectors, and local photon injectors and detectors, are local to corresponding ones of the columns, and can be used to facilitate rapid, accurate, targeted, highly configurable substrate processing, advantageously using large arrays of said beam columns.

Interfacial convective assembly can assemble any type of nanoparticles or other nanoelements in minutes to form microscale and nanoscale patterns in vias or trenches in patterned substrates. A solvent film is deposited on a patterned substrate. An aqueous suspension of nanoparticles is deposited onto the solvent film, thereby forming an interfacial liquid system comprising the nanoparticles within an enclosed space on the substrate. The substrate is then heated, thereby inducing convective flow in the interfacial liquid system. The convective flow includes solutal Marangoni convective flow in a direction towards the patterned substrate, causing nanoelements to be transferred to and bind to the patterned substrate. The nanoelements can be assembled on both hydrophilic and hydrophobic surfaces. Nanoparticles can fuse during the process to provide solid or single crystalline electrical circuit components.

The present invention relates to an electromechanical switch and a method for manufacturing the same, and more particularly, to a superconducting contact electromechanical switch that reliably operates at an ultra-low temperature (10 to 100 mK) and has low on-state resistance and a method for manufacturing the same.

An electromechanical switch according to an embodiment of the present invention includes: a substrate; a first electrode disposed on the substrate; a second electrode disposed on the substrate; a third electrode disposed on the substrate; and a switch body disposed at a central point surrounded by the first to third electrodes on the substrate. Here, each of the second and third electrodes is spaced a predetermined distance from the first electrode.

A MEMS speaker suitable for generating audible sound waves, includes a bimetallic strip actuation system extending in a first plane and an amplification capsule including a membrane extending in a second plane, parallel to the first plane, the membrane including a rigid interior zone and a flexible exterior zone, and a rigid coupling wall, fastened at the periphery of the bimetallic strip actuation system to make the exterior zone of the membrane integral with said actuation system.

Stereolithography (SLA)-based 3D printing enables high-resolution microfabrication but faces challenges in multi-material integration and adaptive Z-layer control due to reliance on vats and mechanical stages. We introduce In-situ 3D Polymerization (IS-3DP), a novel method leveraging multiphasic laminar flow in a microfluidic channel to fabricate three-dimensional microstructures. By combining in-situ polymerization with an aqueous two-phase system (ATPS), IS-3DP dynamically controls layer thickness through flow rate adjustments, achieving resolutions below 200 m. This approach eliminates vats, reducing material consumption by an order of magnitude, and enables rapid multi-material switching without complex printer modifications. Compatible with various light sources and photopolymers, IS-3DP offers versatile applications in bioprinting and microdevice manufacturing, with demonstrated layer-by-layer printing of 3D structures in a microfluidic environment.