Microelectromechanical system (MEMS) devices, methods of operating the MEMS device, and methods of manufacturing the MEMS device are disclosed. In some embodiments, the MEMS device includes a glass substrate; an electrode on the glass substrate; a hinge mechanically coupled to the electrode; a membrane mirror mechanically coupled to the hinge; a TFT on the glass substrate and electrically coupled to the electrode; and a control circuit comprising: a multiplexer configured to turn on or turn off the TFT; and a drive source configured to provide a drive signal for charging the electrode through the TFT. An amplitude of the drive signal corresponds to an amount of charge, and the amount of charge generates an electrostatic force for actuating the hinge and a portion of the membrane mirror mechanically coupled to the hinge.

An inkjet-printing-base process for depositing functional materials, for example PZT, on a substrate, in various instances platinized silicon. Substrate templating (via SAMs) and material deposition are both performed by an inkjet printing process. Additionally, a composition to be used as a SAM precursor ink which is a thiol in a solvent mixture, wherein the composition can be 1 dodecanethiol in a solvent mixture of 2-methoxyethanol and glycerol.

A microelectromechanical (MEMS) system may comprise multiple sensors within cavities of the MEMS system. The operation of different sensors requires different pressures within the respective cavities. A first cavity may be sealed at a first pressure. A through-hole may be etched into a cap layer of the MEMS system to introduce gas into a second cavity such that the cavity has a desired pressure. The cavity may then be sealed by a MEMS valve to maintain the desired pressure in the second cavity.

A method for producing micromechanical components is provided. A liquid starting material which can be cured by means of irradiation is applied onto a substrate. A partial volume of the starting material is cured by means of a local irradiation process using a first radiation source in order to produce at least one three-dimensional structure. The three-dimensional structure delimits at least one closed cavity in which at least one part of the liquid starting material is enclosed. Alternatively or in addition, a micromechanical component is provided that contains a liquid starting material, which is partly cured by means of irradiation, and at least one cavity in which the liquid starting material is enclosed.

The present invention belongs to the field of advanced manufacturing technology and relates to one set-up and method of electrohydrodynamic jet 3D printing based on resultant effect of electric field and thermal field. This method is used to fabricate micro/nano 3D structure, under the resultant effects of electro hydrodynamic force and thermal field. First of all, the ink reaches needle orifice at a constant speed under the resultant effect of fluid field and gravity field. Then a high voltage electric field is applied between needle and substrate. And the ink is dragged to form stable micro/nano scale jet which is far smaller than the needle size using the electric field shear force generated at needle orifice. The solvent evaporation rate of ink increases combined with the radiation of thermal field at the same time. Finally, the micro/nano scale 3D structure is fabricated on substrate with the accumulation of jet layer by layer. Compared with liquid jet printing technology, this method describing in present invention owns many advantages, including wide adaptability of material and manufacturing complex micro/nano scale 3D structures.

Disclosed are embodiments for an engineered feature formed as a part of or on a chamber component. In one embodiment, a chamber component for a processing chamber includes a component part body having unitary monolithic construction. The component part body has an outer surface. An engineered complex surface is formed on the outer surface. The engineered complex surface has a first lattice framework formed from a plurality of first interconnected laths and a plurality of first openings are bounded by three or more laths of the plurality of laths.

A method of making microstructures having re-entrant or doubly re-entrant topology includes forming a mold defining the negative surface features of the re-entrant or doubly re-entrant topology that is to be formed. In one embodiment, a soft or flowable material is formed on a first substrate and the mold is contacted with the same to form a solid, now positive surface having the re-entrant or doubly re-entrant topology. The mold is then released from the first substrate. The microstructures are secured to a second, different substrate, and the first substrate is removed. Any residual microstructure material located between adjacent microstructures may be removed to form the separate microstructures on the second substrate. The second substrate may be thin and flexible any manipulated into useful or desired shapes having the microstructures on one side thereof.

A method of constructing a micromechanical device by additive manufacturing for characterizing strength of a low dimensional material sample, the method including: a) deriving a three-dimensional representation arranged to represent a said micromechanical device with reference to at least one physical characteristic of a said low dimensional material sample; b) transforming the three-dimensional representation into a plurality of two-dimensional representations arranged to individually represent a portion of the three-dimensional representation; and c) forming the micromechanical device from a fluid medium arranged to transform its physical state by stereolithography apparatus in response to a manipulated illumination exposed thereto, whereby a said low dimensional material sample is loaded onto the formed micromechanical device.

Custom 3d printer and resin for microfluidic flow channels and 3D printed high density, reversible, chip-to-chip microfluidic interconnects.

The present invention relates to a method for transferring two-dimensional nanomaterials. The method comprises the following steps: (S1) providing a first substrate with a two-dimensional nanomaterial layer on a surface of the first substrate; (S2) covering the two-dimensional nanomaterial layer with a carbon nanotube film structure; (S3) obtaining a composite structure comprising the two-dimensional nanomaterial layer and the carbon nanotube film structure by removing the first substrate with a corrosion solution to; (S4) placing the composite structure on a surface of a cleaning solution; (S5) providing a target substrate comprising at least one through hole, and picking up the composite structure from the cleaning solution with the target substrate by contacting the target substrate with the two-dimensional nanomaterial layer of the composite structure and covering the at least one through hole with two-dimensional nanomaterial layer; and (S6) removing the carbon nanotube film structure from the composite structure.