In some embodiments a method of manufacturing a sensor system can comprise forming a first structure having a substrate layer and a first sensor that is positioned on a first side of the substrate layer, bonding a cap structure over the first sensor on the first side of the substrate layer, and depositing a first dielectric layer over the cap structure. After bonding the cap structure and depositing the first dielectric layer, a second sensor is fabricated on the first dielectric layer. The second sensor includes material that would be adversely affected at a temperature that is used to bond the cap structure to the first side of the substrate layer.

An apparatus includes a first acoustic sensing resonator formed from a silicon substrate and has a first microelectromechanical system. The apparatus also includes a second acoustic sensing resonator formed from the silicon substrate and has a second microelectromechanical system. The second acoustic sensing resonator is arranged on the silicon substrate at a ninety degree (90) angle with respect to the first acoustic sensing resonator and together the first acoustic sensing resonator and second acoustic sensing resonator form a torque sensor. A high temperature bonding surface is connected to the torque sensor for directly connecting the torque sensor to a metal object.

Provided are a manufacturing method of an inkjet print head, the inkjet print head and a drawing apparatus equipped with the inkjet print head. The manufacturing method includes: forming a separation assisting layer on a substrate; forming heating resistors, thin-film transistors and nozzles for ejecting liquid, on the separation assisting layer; separating the separation assisting layer from the substrate; forming a first heat-conductive layer on the opposite surface of the separation assisting layer from the nozzles; and forming an ink supply port for supplying ink to the nozzles from a first heat-conductive layer side of the inkjet print head.