Disclosed herein is an alkaline composition for cleaning a substrate including a structure of copper or copper alloy and a structure including cobalt or cobalt alloy, the composition including: (a) 0.0001 to 0.2% by weight of a cobalt corrosion inhibitor selected from a surfactant

##STR00001## (b) 0.0001 to 0.5% by weight of a copper corrosion inhibitor selected from benzotriazole, 5-chloro benzotriazole, 4-methyl benzotriazole; 5-methyl benzotriazole; tetrahydro benzotriazole; and methyl-benzotriazole-1-yl)-methyl-imino-bis-ethanol; (c) 0.05 to 1% by weight of a C.sub.2 to C.sub.7 monoamino alkanol; and (d) a solvent;
where the solvent consists essentially of water.

A method for fabricating a microfluidic device includes providing an assembly that includes a first silicon substrate having a hydrophilic silicon oxide top surface that includes a microfluidic channel and a second silicon substrate having a hydrophilic silicon oxide bottom surface directly bonded on the top surface of the first silicon substrate, the second silicon substrate including fluidic access holes giving fluidic access to the microfluidic channel. The method also includes exposing the assembly to oxidative species including one or more oxygen atoms and to heat so as to form silicon oxide at a surface of the access holes and of the microfluidic channel.

The present invention provides a method of removing a foreign particle on a first member, comprising: supplying a composition on the first member; pressing a second member against the composition supplied on the first member; curing the composition on the first member after the pressing; and separating the second member together with the composition from the first member, after the curing, wherein in the supplying, a supply amount of the composition to be supplied on the first member is controlled based on a cure shrinkage rate of the composition in the curing and an estimated size of a foreign particle being presumably adhered on the first member, such that a thickness of a portion of the composition cured in the curing, which exists between the second member and the first member, becomes larger than the estimated size.

A mirror device manufacturing method includes a forming step of forming a structure by forming a base portion, a movable portion, and a coupling portion coupling the base portion and the movable portion to each other such that the movable portion is able to swing with respect to the base portion through processing of a wafer, and forming a mirror layer in the movable portion; and a collecting step of performing collection of foreign substances from the structure using a collection member after the forming step. A mirror unit manufacturing method includes a sealing step of sealing the mirror device after the collecting step.