A microelectromechanical sensor (MEMS) package includes a gyroscope and an accelerometer. The gyroscope is located within a low-pressure cavity that is sealed from an external pressure. The accelerometer is located within a cavity, and the seal for the accelerometer cavity is entirely within the gyroscope cavity. Under normal operating conditions, the accelerometer seal holds the accelerometer cavity at a higher pressure than the pressure of the enclosing gyroscope cavity. In the event that one of the gyroscope seal or the accelerometer seal is broken, the gyroscope senses the change in pressure.

A packaged MEMS device and a method of calibrating a packaged MEMS device are disclosed. In one embodiment a packaged MEMS device comprises a carrier, a MEMS device disposed on the substrate, a signal processing device disposed on the carrier, a validation circuit disposed on the carrier; and an encapsulation disposed on the carrier, wherein the encapsulation encapsulates the MEMS device, the signal processing device and the memory element.

A method for detecting contamination of a micro-electromechanical sensor of a sensor module using a heater, wherein the sensor module has a temperature sensor arranged at a distance from the heater and from the micro-electromechanical sensor. The heater heats the sensor, which is measured by the temperature sensor. The sensor measures physical quantities at different times. The measured physical quantities are compensated based on the temperatures measured at the different times. It is ascertained based on the compensated physical quantities and the temperature difference between the different times whether the micro-electromechanical sensor is free of contamination or has contamination. A system for detecting contamination of a micro-electromechanical sensor of a sensor module, a computer program and a machine-readable storage medium, are also described.